Radiation-emitting semiconductor chip
    2.
    发明授权
    Radiation-emitting semiconductor chip 有权
    辐射发射半导体芯片

    公开(公告)号:US09054016B2

    公开(公告)日:2015-06-09

    申请号:US13123421

    申请日:2009-10-29

    摘要: A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation, the active region being arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer in the emission region is electrically conductively connected to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; and the first connection layer in the protective diode region is electrically conductively connected to the second semiconductor layer.

    摘要翻译: 辐射发射半导体芯片包括具有半导体层序列的载体和半导体本体,其中在具有半导体层序列的半导体主体中形成发光区域和保护二极管区域; 所述半导体层序列包括产生辐射的有源区,所述有源区布置在第一半导体层和第二半导体层之间; 第一半导体层布置在有源区的背离载体的一侧; 发射区域具有延伸穿过有源区域的凹部; 发射区域中的第一半导体层导电地连接到第一连接层,其中第一连接层在凹部中从第一半导体层朝向载体延伸; 并且保护二极管区域中的第一连接层与第二半导体层导电连接。

    RADIATION-EMITTING SEMICONDUCTOR CHIP
    3.
    发明申请
    RADIATION-EMITTING SEMICONDUCTOR CHIP 有权
    辐射发射半导体芯片

    公开(公告)号:US20110260205A1

    公开(公告)日:2011-10-27

    申请号:US13123421

    申请日:2009-10-29

    IPC分类号: H01L33/62

    摘要: A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation, the active region being arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer in the emission region is electrically conductively connected to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; and the first connection layer in the protective diode region is electrically conductively connected to the second semiconductor layer.

    摘要翻译: 辐射发射半导体芯片包括具有半导体层序列的载体和半导体本体,其中在具有半导体层序列的半导体主体中形成发光区域和保护二极管区域; 所述半导体层序列包括产生辐射的有源区,所述有源区布置在第一半导体层和第二半导体层之间; 第一半导体层布置在有源区的背离载体的一侧; 发射区域具有延伸穿过有源区域的凹部; 发射区域中的第一半导体层导电地连接到第一连接层,其中第一连接层在凹部中从第一半导体层朝向载体延伸; 并且保护二极管区域中的第一连接层与第二半导体层导电连接。

    LIGHT-EMITTING DIODE ARRANGEMENT HAVING A PIEZO TRANSFORMER
    5.
    发明申请
    LIGHT-EMITTING DIODE ARRANGEMENT HAVING A PIEZO TRANSFORMER 有权
    具有PIEZO变压器的发光二极管布置

    公开(公告)号:US20140145610A1

    公开(公告)日:2014-05-29

    申请号:US13820181

    申请日:2011-08-24

    IPC分类号: F21K99/00 F21V23/02

    摘要: A light-emitting diode arrangement has a frame-shaped piezo transformer having at least one output-side connection, and having a light-emitting diode module that generates electromagnetic radiation, which module is disposed within the frame-shaped piezo transformer and electrically connects to the output-side connection of the piezo transformer by at least one output-side electrical conductor, wherein radiation emitted by the light-emitting diode module in the direction of the piezo transformer is reflected, at the latter.

    摘要翻译: 发光二极管装置具有至少一个输出侧连接的框形压电变压器,并且具有产生电磁辐射的发光二极管模块,该模块设置在框形压电变压器内并电连接到 通过至少一个输出侧电导体的压电变压器的输出侧连接,其中由发光二极管模块在压电变压器的方向上发射的辐射在后者处被反射。

    Method for producing an optoelectronic component and optoelectronic component
    7.
    发明授权
    Method for producing an optoelectronic component and optoelectronic component 有权
    光电子元件和光电元件的制造方法

    公开(公告)号:US08956897B2

    公开(公告)日:2015-02-17

    申请号:US13598896

    申请日:2012-08-30

    摘要: In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.

    摘要翻译: 在制造光电子部件的方法中,提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底,并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后,用外延沉积层序列进行接触。

    METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT
    8.
    发明申请
    METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT 有权
    用于生产光电元件和光电元件的方法

    公开(公告)号:US20120322186A1

    公开(公告)日:2012-12-20

    申请号:US13598896

    申请日:2012-08-30

    IPC分类号: H01L33/12

    摘要: In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.

    摘要翻译: 在制造光电子部件的方法中,提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底,并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后,用外延沉积层序列进行接触。

    Method for producing an optoelectronic component and optoelectronic component
    9.
    发明授权
    Method for producing an optoelectronic component and optoelectronic component 有权
    光电子元件和光电元件的制造方法

    公开(公告)号:US08283191B2

    公开(公告)日:2012-10-09

    申请号:US12990243

    申请日:2009-06-09

    IPC分类号: H01L21/00 H01L33/22 H01L33/38

    摘要: In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.

    摘要翻译: 在制造光电子部件的方法中,提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底,并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后,用外延沉积层序列进行接触。

    METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT
    10.
    发明申请
    METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT 有权
    用于生产光电元件和光电元件的方法

    公开(公告)号:US20110104836A1

    公开(公告)日:2011-05-05

    申请号:US12990243

    申请日:2009-06-09

    IPC分类号: H01L33/00

    摘要: In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.

    摘要翻译: 在制造光电子部件的方法中,提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底,并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后,用外延沉积层序列进行接触。