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公开(公告)号：US10199172B2
公开(公告)日：2019-02-05
申请号：US15275372
申请日：2016-09-24
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Jason C. Sauers , Cheung-Wei Lam , Federico P. Centola , Andro Radchenko , Martin Schauer
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.
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Patent Agency Ranking
公开(公告)号：US20190006287A1
公开(公告)日：2019-01-03
申请号：US15636408
申请日：2017-06-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Ming Y. Tsai , Won Seop Choi
IPC: H01L23/552 , H01L49/02
CPC classification number: H01L23/552 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01L23/642 , H01L28/60
Abstract: Capacitor devices having multiple capacitors with similar nominal capacitances are described. The capacitors may be multilayer ceramic capacitors (MLCCs) and may be fabricated employing class 2 materials. The arrangement of the electrodes in the device may reduce relative variations between the capacitors of the device. The capacitor devices may be allow high performance and compact electrical circuits that may employ matched capacitors.
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公开(公告)号：US09867285B2
公开(公告)日：2018-01-09
申请号：US14843000
申请日：2015-09-02
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Tyler S. Bushnell , Jason C. Sauers
CPC classification number: H05K1/0295 , H05K3/301 , H05K3/3436 , H05K3/3442 , H05K2201/094 , H05K2201/09954 , H05K2201/1031 , H05K2201/10515 , H05K2201/10636 , H05K2201/10962 , H05K2201/2036 , Y02P70/611 , Y02P70/613
Abstract: An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.
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公开(公告)号：US20170208710A1
公开(公告)日：2017-07-20
申请号：US15409260
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Albert Wang , Paul A. Martinez
CPC classification number: G06F1/1613 , G06F1/1656 , G06F1/1658 , G06F1/182 , G06F1/183 , H01R43/205 , H05K2201/0715 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10636 , Y02P70/611
Abstract: The present disclosure relates to shield frames that reduce electromagnetic interference in electrical devices. The shield frames may be formed by coupling a shield frame lid to a ground connection of the circuit board through terminations in electrical components. The terminations in these electrical components thus may act both as a ground termination for the component as well as a ground connection for the shield frame. The components may be disposed in the perimeter of the circuit board to establish, with or without additional conductive posts, sections of the shield frame wall.
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公开(公告)号：US20170207028A1
公开(公告)日：2017-07-20
申请号：US15275372
申请日：2016-09-24
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Jason C. Sauers , Cheung-Wei Lam , Federico P. Centola , Andro Radchenko , Martin Schauer
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.
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公开(公告)号：US20170207024A1
公开(公告)日：2017-07-20
申请号：US15409217
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Gang Ning , Curtis C. Mead , Ming Y. Tsai , Albert Wang
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/35 , H01G4/40
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.
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