公开(公告)号：US09873180B2

公开(公告)日：2018-01-23

申请号：US14695299

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B24D18/00 ,  B29C64/112

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US11878389B2

公开(公告)日：2024-01-23

申请号：US17172152

申请日：2021-02-10

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra Jawali ,  Veera Raghava Reddy Kakireddy ,  Rajeev Bajaj ,  Daniel Redfield

IPC: B24B37/24 ,  B33Y80/00 ,  B23K26/342

CPC classification number: B24B37/24 ,  B23K26/342 ,  B33Y80/00

Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

公开(公告)号：US11772229B2

公开(公告)日：2023-10-03

申请号：US16298802

申请日：2019-03-11

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20230256560A1

公开(公告)日：2023-08-17

申请号：US18305264

申请日：2023-04-21

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/30625

Abstract: A method of forming a polishing pad that has a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11724362B2

公开(公告)日：2023-08-15

申请号：US17114633

申请日：2020-12-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Gregory E. Menk ,  Nag B. Patibandla

IPC: B24D11/00 ,  B24D11/04 ,  B24D3/28 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: B24D11/001 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/04 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US11638979B2

公开(公告)日：2023-05-02

申请号：US16897195

申请日：2020-06-09

Applicant: Applied Materials, Inc

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/306 ,  B29K63/00 ,  B29K75/00 ,  B29L31/00

Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11446788B2

公开(公告)日：2022-09-20

申请号：US16541641

申请日：2019-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Ashwin Chockalingam ,  Ashavani Kumar ,  Fred C. Redeker ,  Nag B. Patibandla

IPC: B24D18/00 ,  B24D3/28 ,  B33Y80/00 ,  B33Y10/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20220001507A1

公开(公告)日：2022-01-06

申请号：US17478836

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Mayu Felicia Yamamura ,  Jason Garcheung Fung ,  Daniel Redfield ,  Rajeev Bajaj ,  Hou T. Ng

IPC: B24B37/26 ,  B24D18/00 ,  B29C64/393 ,  B29C64/112 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B24B37/20

Abstract: A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

公开(公告)号：US20210114172A1

公开(公告)日：2021-04-22

申请号：US17137304

申请日：2020-12-29

Applicant: Applied Materials, Inc.

Inventor： Daniel Redfield ,  Jason Garcheung Fung ,  Mayu Felicia Yamamura

IPC: B24D11/00 ,  B29C64/112 ,  B29C64/393 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y50/02 ,  B33Y10/00 ,  B29C64/282 ,  B29C64/40 ,  C09G1/16

Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.

公开(公告)号：US10953515B2

公开(公告)日：2021-03-23

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C35/08 ,  C09D4/00 ,  C09G1/16 ,  B33Y70/00 ,  B29K33/04

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.