PLASMA CVD APPARATUS HAVING NON-METAL SUSCEPTOR
    21.
    发明申请
    PLASMA CVD APPARATUS HAVING NON-METAL SUSCEPTOR 审中-公开
    具有非金属硫化物的等离子体CVD装置

    公开(公告)号:US20080299326A1

    公开(公告)日:2008-12-04

    申请号:US11755491

    申请日:2007-05-30

    IPC分类号: C23C16/44

    摘要: A plasma CVD apparatus includes: a cooling susceptor for placing a substrate thereon and serving as an electrode; and a shower plate for introducing gas toward the susceptor via multiple throughholes formed therein. The shower plate serves as an electrode and is disposed in parallel to the susceptor. The cooling susceptor is made of a ceramic material provided with a cooling fluid flow path for passing a cooling fluid therethrough.

    摘要翻译: 等离子体CVD装置包括:用于将基板放置在其上并用作电极的冷却基座; 以及用于经由形成在其中的多个通孔将气体引向基座的喷淋板。 淋浴板用作电极并且平行于基座设置。 冷却基座由陶瓷材料制成,该陶瓷材料设置有用于使冷却流体从其中通过的冷却流体流动路径。

    Method for forming low-k hard film
    25.
    发明授权
    Method for forming low-k hard film 有权
    低k硬膜的形成方法

    公开(公告)号:US07064088B2

    公开(公告)日:2006-06-20

    申请号:US10412363

    申请日:2003-04-11

    IPC分类号: H01L21/31 H01L21/469

    摘要: A hard film is formed on an insulation film formed on a semiconductor substrate by vaporizing a silicon-containing hydrocarbon compound to provide a source gas, introducing a reaction gas composed of the source gas and optionally an additive gas such as alcohol to a reaction space of a plasma CVD apparatus, and applying low-frequency RF power and high-frequency RF power. The silicon-containing hydrocarbon compound includes a cyclic Si-containing hydrocarbon compound and/or a linear Si-containing hydrocarbon compound, as a basal structure, with reactive groups for form oligomers using the basal structure. The residence time of the reaction gas in the reaction space is lengthened by reducing the total flow of the reaction gas in such a way as to form a siloxan polymer film with a low dielectric constant.

    摘要翻译: 通过使含硅烃化合物汽化,形成源极气体,将由源气体构成的反应气体和任选的醇等添加气体引入到半导体基板上的绝缘膜上,形成硬膜至反应空间 等离子体CVD装置,并且施加低频RF功率和高频RF功率。 含硅烃化合物包括使用基础结构的形成低聚物的反应性基团作为基础结构的环状含Si烃化合物和/或线性含Si烃化合物。 反应气体在反应空间中的停留时间通过降低反应气体的总流量而延长,从而形成低介电常数的硅氧烷聚合物膜。

    Gas-shield electron-beam gun for thin-film curing application
    26.
    发明授权
    Gas-shield electron-beam gun for thin-film curing application 有权
    用于薄膜固化应用的气体保护电子束枪

    公开(公告)号:US07012268B2

    公开(公告)日:2006-03-14

    申请号:US10847127

    申请日:2004-05-17

    IPC分类号: H01J37/32 H01J37/06

    CPC分类号: H01J33/00 H01J37/06

    摘要: An electron-beam irradiation apparatus includes an evacuatable filament-electron gun chamber housing a filament and an anode and having an inactive-gas inlet through which an inactive gas flows in; an evacuatable treatment chamber connected to an exhaust system; and a separation wall for separating the filament-electrode gun chamber and the treatment chamber. The separation wall has an aperture configured to pass electrons and gas therethrough from the filament-electron gun chamber.

    摘要翻译: 电子束照射装置包括容纳灯丝和阳极并具有非活性气体入口的惰性气体入口的可抽出的灯丝电子枪室; 连接到排气系统的可抽空处理室; 以及用于分离灯丝电极枪室和处理室的分离壁。 分隔壁具有孔,该孔被配置为使电子和气体从灯丝电子枪室通过。

    Method of forming a carbon polymer film using plasma CVD
    27.
    发明授权
    Method of forming a carbon polymer film using plasma CVD 有权
    使用等离子体CVD形成碳聚合物膜的方法

    公开(公告)号:US07470633B2

    公开(公告)日:2008-12-30

    申请号:US11524037

    申请日:2006-09-20

    IPC分类号: H01L21/31

    摘要: A method forms a hydrocarbon-containing polymer film on a semiconductor substrate by a capacitively-coupled plasma CVD apparatus. The method includes the steps of: vaporizing a hydrocarbon-containing liquid monomer (CαHβXγ, wherein α and β are natural numbers of 5 or more; γ is an integer including zero; X is O, N or F) having a boiling point of about 20° C. to about 350° C.; introducing the vaporized gas into a CVD reaction chamber inside which a substrate is placed; and forming a hydrocarbon-containing polymer film on the substrate by plasma polymerization of the gas.

    摘要翻译: 一种方法通过电容耦合等离子体CVD装置在半导体衬底上形成含烃聚合物膜。 该方法包括以下步骤:使沸点为约1的含烃液体单体(其中α和β为5或更多的天然数;γ为包括零的整数; X为O,N或F)的烃类液体单体 20℃至约350℃。 将蒸发的气体引入其中放置基板的CVD反应室中; 并通过气体的等离子体聚合在基板上形成含烃聚合物膜。

    Method of forming carbon polymer film using plasma CVD
    28.
    发明申请
    Method of forming carbon polymer film using plasma CVD 有权
    使用等离子体CVD形成碳聚合物膜的方法

    公开(公告)号:US20070224833A1

    公开(公告)日:2007-09-27

    申请号:US11387527

    申请日:2006-03-23

    IPC分类号: C23C16/00 H01L21/31

    摘要: A method of forming a hydrocarbon-containing polymer film on a semiconductor substrate by a capacitively-coupled plasma CVD apparatus. The method includes the steps of: vaporizing a hydrocarbon-containing liquid monomer (CαHβXγ, wherein α and β are natural numbers of 5 or more; γ is an integer including zero; X is O, N or F) having a boiling point of about 20° C. to about 350° C. which is not substituted by a vinyl group or an acetylene group; introducing the vaporized gas and CO2 gas or H2 gas into a CVD reaction chamber inside which a substrate is placed; and forming a hydrocarbon-containing polymer film on the substrate by plasma polymerization of the gas, thereby reducing extinction coefficient (k) at 193 nm and increasing mechanical hardness.

    摘要翻译: 通过电容耦合等离子体CVD装置在半导体衬底上形成含烃聚合物膜的方法。 该方法包括以下步骤:蒸发含烃液体单体(其中α和β为自然数) 5或更大;γ是包括零的整数; X是O,N或F),其沸点为约20℃至约350℃,其未被乙烯基或乙炔基取代; 将蒸发的气体和CO 2气体或H 2 H 2气体引入到其中放置基底的CVD反应室中; 并通过气体的等离子体聚合在基板上形成含烃聚合物膜,从而降低193nm处的消光系数(k)并提高机械硬度。

    Method of forming a carbon polymer film using plasma CVD
    29.
    发明申请
    Method of forming a carbon polymer film using plasma CVD 有权
    使用等离子体CVD形成碳聚合物膜的方法

    公开(公告)号:US20060084280A1

    公开(公告)日:2006-04-20

    申请号:US11172031

    申请日:2005-06-30

    IPC分类号: H01L21/31

    摘要: A method of forming a hydrocarbon-containing polymer film on a semiconductor substrate by a capacitively-coupled plasma CVD apparatus. The method includes the steps of: vaporizing a hydrocarbon-containing liquid monomer (CαHβXγ, wherein α and β are natural numbers of 5 or more; γ is an integer including zero; X is O, N or F) having a boiling point of about 20° C. to about 350° C. which is not substituted by a vinyl group or an acetylene group; introducing the vaporized gas into a CVD reaction chamber inside which a substrate is placed; and forming a hydrocarbon-containing polymer film on the substrate by plasma polymerization of the gas.

    摘要翻译: 通过电容耦合等离子体CVD装置在半导体衬底上形成含烃聚合物膜的方法。 该方法包括以下步骤:蒸发含烃液体单体(其中α和β为自然数) 5或更大;γ是包括零的整数; X是O,N或F),其沸点为约20℃至约350℃,其未被乙烯基或乙炔基取代; 将蒸发的气体引入其中放置基板的CVD反应室中; 并通过气体的等离子体聚合在基板上形成含烃聚合物膜。