摘要:
The present invention relates to complementary devices, such as n-FETs and p-FETs, which have hybrid channel orientations and are connected by conductive connectors that are embedded in a semiconductor substrate. Specifically, the semiconductor substrate has at least first and second device regions of different surface crystal orientations (i.e., hybrid orientations). An n-FET is formed at one of the first and second device regions, and a p-FET is formed at the other of the first and second device regions. The n-FET and the p-FET are electrically connected by a conductive connector that is located between the first and second device regions and embedded in the semiconductor substrate. Preferably, a dielectric spacer is first provided between the first and second device regions and recessed to form a gap therebetween. The conductive connector is then formed in the gap above the recessed dielectric spacer.
摘要:
Methods for forming high performance gates in MOSFETs and structures thereof are disclosed. One embodiment includes a method including providing a substrate including a first short channel active region, a second short channel active region and a long channel active region, each active region separated from another by a shallow trench isolation (STI); and forming a field effect transistor (FET) with a polysilicon gate over the long channel active region, a first dual metal gate FET having a first work function adjusting material over the first short channel active region and a second dual metal gate FET having a second work function adjusting material over the second short channel active region, wherein the first and second work function adjusting materials are different.
摘要:
A semiconductor structure, a fabrication method, and a design structure for a FinFet. The FinFet includes a dielectric layer, a central semiconductor fin region on the dielectric layer, a first semiconductor seed region on the dielectric layer, and a first strain creating fin region. The first semiconductor seed region is sandwiched between the first strain creating fin region and the dielectric layer. The first semiconductor seed region includes a first semiconductor material. The first strain creating fin region includes the first semiconductor material and a second semiconductor material different than the first semiconductor material. A first atom percent of the first semiconductor material in the first semiconductor seed region is different than a second atom percent of the first semiconductor material in the first strain creating fin region.
摘要:
Methods for forming high performance gates in MOSFETs and structures thereof are disclosed. One embodiment includes a method including providing a substrate including a first short channel active region, a second short channel active region and a long channel active region, each active region separated from another by a shallow trench isolation (STI); and forming a field effect transistor (FET) with a polysilicon gate over the long channel active region, a first dual metal gate FET having a first work function adjusting material over the first short channel active region and a second dual metal gate FET having a second work function adjusting material over the second short channel active region, wherein the first and second work function adjusting materials are different.
摘要:
A semiconductor structure, a fabrication method, and a design structure for a FinFet. The FinFet includes a dielectric layer, a central semiconductor fin region on the dielectric layer, a first semiconductor seed region on the dielectric layer, and a first strain creating fin region. The first semiconductor seed region is sandwiched between the first strain creating fin region and the dielectric layer. The first semiconductor seed region includes a first semiconductor material. The first strain creating fin region includes the first semiconductor material and a second semiconductor material different than the first semiconductor material. A first atom percent of the first semiconductor material in the first semiconductor seed region is different than a second atom percent of the first semiconductor material in the first strain creating fin region.
摘要:
The present invention provides a semiconductor device includes a substrate including a semiconducting region and isolation regions, a gate structure including a high-k gate dielectric layer atop the semiconducting region of the substrate and a metal gate conductor layer atop the high-k gate dielectric; protective nitride spacers enclosing the high-k gate dielectric layer between the metal gate conductor layer and the semiconducting region of the substrate, the protective nitride spacers separating the isolation regions from the high-k dielectric; and a polysilicon gate conductor overlying the metal gate conductor layer and enclosing the protective nitride spacers between at least the high-k dielectric layer, the semiconducting region, and a portion of the polysilicon gate conductor.
摘要:
Method for reducing resist poisoning. The method includes the steps of forming a first structure in a dielectric on a substrate, reducing amine related contaminants from the dielectric and the substrate prior to a formation of a second structure on the substrate such that the amine related contaminates will not diffuse out from either the substrate or the dielectric, wherein the reducing utilizes a plasma treatment which one of chemically ties up the amine related contaminates and binds, traps, or consumes the amine related contaminates during subsequent processing steps, forming the second structure on the substrate, and after the forming of the first structure, preventing poisoning of a resist layer in subsequent processing by the reducing.
摘要:
Disclosed herein is a transistor comprising a first fin having a first gate electrode disposed across the first fin; the gate electrode contacting opposing surfaces of the fin; and a planar oxide layer having a second gate electrode disposed across the planar oxide layer to form a planar metal oxide semiconductor field effect transistor; the first fin and the planar oxide layer being disposed upon a surface of a wafer.
摘要:
Some implementations provide techniques and arrangements for distance measurements between computing devices. Some examples determine a distance between devices based at least in part on a propagation time of audio tones between the devices. Further, some examples determine the arrival time of the audio tones by performing autocorrelation on streaming data corresponding to recorded sound to determine a timing of an autocorrelation peak indicative of a detection of an audio tone in the streaming data. In some cases, cross correlation may be performed on the streaming data in a search window to determine a timing of a cross correlation peak indicative of the detection of the audio tone in the streaming data. The location of the search window in time may be determined based at least in part on the timing of the detected autocorrelation peak.
摘要:
A method for reducing resist poisoning is provided. The method includes forming a first structure in a dielectric on a substrate and reducing amine related contaminants from the dielectric and the substrate created after the formation of the first structure. The method further includes forming a second structure in the dielectric. A first organic film may be formed on the substrate which is then heated and removed from the substrate to reduce the contaminant. Alternatively, a plasma treatment or cap may be provided. A second organic film is formed on the substrate and patterned to define a second structure in the dielectric.