WAFER CONTACT SURFACE PROTRUSION PROFILE WITH IMPROVED PARTICLE PERFORMANCE

    公开(公告)号:US20190067069A1

    公开(公告)日:2019-02-28

    申请号:US16073648

    申请日:2017-02-02

    Applicant: ENTEGRIS, Inc.

    Abstract: An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.

    SURFACE MODIFIED SUBSTRATES AND RELATED METHODS

    公开(公告)号:US20250034694A1

    公开(公告)日:2025-01-30

    申请号:US18780569

    申请日:2024-07-23

    Applicant: ENTEGRIS, INC.

    Abstract: Surface modified substrates and related methods are provided. A substrate having a modified surface comprises a first region and a second region. The first region is located above the second region. The first region comprises an aluminum fluoride. The second region comprises an aluminum alloy. A concentration of the aluminum fluoride gradually decreases from the first region to the second region.

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