公开(公告)号：US11731240B2

公开(公告)日：2023-08-22

申请号：US16228525

申请日：2018-12-20

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC: H01L21/00 ,  B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  H01L21/67046 ,  H01L21/67051 ,  B08B2203/0288

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US11673222B2

公开(公告)日：2023-06-13

申请号：US17206652

申请日：2021-03-19

Applicant: EBARA CORPORATION

Inventor： Katsuhide Watanabe ,  Itsuki Kobata

IPC: B24B37/10 ,  B24B49/04 ,  B24B37/32 ,  B24B37/013

CPC classification number: B24B37/105 ,  B24B37/013 ,  B24B37/32 ,  B24B49/04

Abstract: A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

公开(公告)号：US11450544B2

公开(公告)日：2022-09-20

申请号：US16845914

申请日：2020-04-10

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC: H01L21/67 ,  H01L21/677 ,  C23C22/83 ,  C23C22/77 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/306 ,  H01L21/321 ,  H01L21/3213 ,  B24B37/04 ,  H01L21/66 ,  B24B37/20 ,  H01L21/683

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method.
The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US20210265176A1

公开(公告)日：2021-08-26

申请号：US17180394

申请日：2021-02-19

Applicant: EBARA CORPORATION

Inventor： Atsuo Katagiri ,  Itsuki Kobata

IPC: H01L21/67

Abstract: A substrate processing apparatus includes a stage for holding a wafer, a catalyst processing member for processing the surface of the wafer using a catalyst, a pressing mechanism for pressing the catalyst processing member against the wafer, a relative motion mechanism for causing the catalyst processing member and the wafer to make a relative movement, and a supply mechanism for supplying a process liquid to the surface the wafer. The catalyst processing member has a processing surface opposed to the wafer, and includes a base material on which a groove is formed on the processing surface and the catalyst. The processing surface of the base material includes a plurality of regions sectioned by the groove. The catalyst processing member holds different types of catalysts in the plurality of regions.

公开(公告)号：US20210023672A1

公开(公告)日：2021-01-28

申请号：US17010183

申请日：2020-09-02

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno

IPC: B24B37/005 ,  B24B49/16 ,  B24B37/10 ,  B24B37/34 ,  H01L21/306 ,  H01L21/66

Abstract: The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.
One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

公开(公告)号：US20210013071A1

公开(公告)日：2021-01-14

申请号：US17036555

申请日：2020-09-29

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Toshio Mizuno ,  Itsuki Kobata ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC: H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34

Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US10665487B2

公开(公告)日：2020-05-26

申请号：US15305088

申请日：2015-04-17

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC: H01L21/677 ,  H01L21/3105 ,  H01L21/683 ,  H01L21/306 ,  H01L21/321 ,  H01L21/67 ,  B24B37/20 ,  H01L21/311 ,  H01L21/3213 ,  B24B37/04 ,  H01L21/66

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US10343255B2

公开(公告)日：2019-07-09

申请号：US15949960

申请日：2018-04-10

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/10 ,  B24B37/26 ,  H01L21/67 ,  H01L21/687 ,  B24B37/04 ,  B24B37/20 ,  B24B37/005 ,  H01L21/3105 ,  H01L21/66

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

公开(公告)号：US10131030B2

公开(公告)日：2018-11-20

申请号：US14879786

申请日：2015-10-09

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno

IPC: B24B37/11 ,  H01L21/67

Abstract: A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.

公开(公告)号：US12154797B2

公开(公告)日：2024-11-26

申请号：US17878840

申请日：2022-08-01

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Yosuke Himori

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.