公开(公告)号：US20150093691A1

公开(公告)日：2015-04-02

申请号：US14559595

申请日：2014-12-03

Applicant: FUJIFILM CORPORATION

Inventor： Akinori SHIBUYA

IPC: G03F7/027 ,  G03F7/20 ,  G03F7/038 ,  G03F7/30

CPC classification number: G03F7/027 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/30

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes compound (A) that when exposed to actinic rays or radiation, generates acids and resin (B) that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer. Compound (A) is expressed by general formula (I) below. Resin (B) contains at least one of repeating units of general formula (1) below.

Abstract translation: 根据一个实施方案，光化射线或辐射敏感性树脂组合物包括化合物（A），当暴露于光化射线或辐射时，产生酸和树脂（B），当被酸作用时，其分解，从而增加 其在碱性显影剂中的溶解度。 化合物（A）由下述通式（I）表示。 树脂（B）含有下述通式（1）的重复单元中的至少一种。

公开(公告)号：US20180118887A1

公开(公告)日：2018-05-03

申请号：US15852992

申请日：2017-12-22

Applicant: FUJIFILM Corporation

Inventor： Akinori SHIBUYA ,  Yu IWAI ,  Takeshi KAWABATA ,  Ichiro KOYAMA

IPC: C08G73/10 ,  C08G73/22 ,  C08F110/02 ,  C08F136/00 ,  C08F290/14 ,  G03F7/031 ,  G03F7/038 ,  H01L21/02

Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

公开(公告)号：US20160004157A1

公开(公告)日：2016-01-07

申请号：US14853574

申请日：2015-09-14

Applicant: FUJIFILM CORPORATION

Inventor： Junichi ITO ,  Akinori SHIBUYA ,  Akiyoshi GOTO ,  Michihiro SHIRAKAWA ,  Kei YAMAMOTO ,  Fumihiro YOSHINO

IPC: G03F7/038 ,  G03F7/32 ,  G03F7/004 ,  G03F7/20

CPC classification number: G03F7/038 ,  C07C381/12 ,  C08F220/14 ,  C08F220/18 ,  C08F220/26 ,  C08F220/28 ,  C08F220/30 ,  C08F220/36 ,  C08F232/08 ,  G03F7/0045 ,  G03F7/0397 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/325 ,  H01L21/0274

Abstract: A method of forming a pattern includes (a) forming a film of an actinic-ray- or radiation-sensitive resin composition, (b) exposing the film to light, and (c) developing the exposed film with a developer comprising an organic solvent to thereby form a negative pattern. The actinic-ray- or radiation-sensitive resin composition includes (A) a resin whose solubility in the developer comprising an organic solvent is lowered when acted on by an acid, which resin contains a repeating unit with any of lactone structures of general formula (1) below, and (B) a compound that when exposed to actinic rays or radiation, generates an acid.

Abstract translation: 形成图案的方法包括（a）形成光化射线或辐射敏感性树脂组合物的膜，（b）将膜曝光，和（c）用包含有机溶剂的显影剂显影曝光的膜 从而形成负模式。 光化射线或辐射敏感性树脂组合物包括（A）当在含有有机溶剂的显影剂中的溶解度降低的树脂（A）作用于酸时，树脂含有具有通式（III）的内酯结构的重复单元 1）和（B）当暴露于光化射线或辐射时产生酸的化合物。

公开(公告)号：US20150168830A1

公开(公告)日：2015-06-18

申请号：US14633721

申请日：2015-02-27

Applicant: FUJIFILM CORPORATION

Inventor： Akiyoshi GOTO ,  Akinori SHIBUYA ,  Shohei KATAOKA ,  Shuhei YAMAGUCHI ,  Tomoki MATSUDA ,  Keita KATO

IPC: G03F7/027 ,  G03F7/20 ,  C07D327/06 ,  C07D279/12 ,  G03F7/038 ,  C07D217/08 ,  C07D335/02 ,  C07D333/46 ,  C07C323/21 ,  G03F7/30 ,  C07D411/04

CPC classification number: G03F7/027 ,  C07C309/12 ,  C07C309/19 ,  C07C311/09 ,  C07C323/21 ,  C07C2601/14 ,  C07C2602/42 ,  C07C2603/74 ,  C07D217/02 ,  C07D217/08 ,  C07D279/12 ,  C07D285/15 ,  C07D295/067 ,  C07D295/26 ,  C07D319/14 ,  C07D327/02 ,  C07D327/06 ,  C07D333/46 ,  C07D335/02 ,  C07D339/08 ,  C07D411/04 ,  C07D413/04 ,  C07D417/04 ,  C07D493/18 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/30

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing a compound represented by Formula (1): wherein R1 represents a polycyclic aromatic group or a polycyclic heterocyclic aromatic group, R2 represents a (n+2)-valent saturated hydrocarbon group. R3 represents a (m+2)-valent saturated hydrocarbon group, R4 and R5 each independently represent a substituent, Q represents a linking group containing a heteroatom, m and n each independently represent an integer of 0 to 12, when n is 2 or more, R4's may be the same or different, R4's may be linked to each other to form a non-aromatic ring together with R2, when m is 2 or more, R5's may be the same or different, and R5's may be linked to each other to form a non-aromatic ring together with R3, and X− represents a non-nucleophilic anion.

Abstract translation: 提供了含有由式（1）表示的化合物的光化射线敏感或辐射敏感性树脂组合物：其中R1表示多环芳基或多环杂环芳基，R2表示（n + 2）价饱和烃 组。 R3表示（m + 2）价饱和烃基，R4和R5各自独立地表示取代基，Q表示含有杂原子的连接基，m和n各自独立地表示0〜12的整数，n为2或 更多的是，R4可以相同或不同，R4可以彼此连接，与R2一起形成非芳香环，当m为2以上时，R5可以相同或不同，R5可以相互连接 另外与R3一起形成非芳香环，X-表示非亲核阴离子。

公开(公告)号：US20140287363A1

公开(公告)日：2014-09-25

申请号：US14297948

申请日：2014-06-06

Applicant: FUJIFILM Corporation

Inventor： Akinori SHIBUYA ,  Kaoru IWATO

IPC: G03F7/004 ,  G03F7/20

CPC classification number: G03F7/004 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041

Abstract: Disclosed are an actinic ray-sensitive or radiation-sensitive resin composition including (A) a compound capable of generating an acid by irradiation of actinic rays or radiation, and (B) a resin of which solubility in an alkali developer increases by being decomposed by the action of an acid, and, a resist film, a pattern forming method, an electronic device manufacturing method, and an electronic device, each using the composition, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains at least one type of a specific compound represented by General Formula (A-I) and at least one type of a specific compound represented by General Formula (A-II) as the compound (A).

Abstract translation: 公开了一种光化射线敏感性或辐射敏感性树脂组合物，其包含（A）能够通过光化射线或辐射的照射产生酸的化合物，和（B）通过分解由碱显影剂溶解度增加的树脂 各种使用该组合物的酸和抗蚀剂膜，图案形成方法，电子器件制造方法和电子器件的作用，其中光化射线敏感性或辐射敏感性树脂组合物含有至少一种 的由通式（A1）表示的具体化合物和至少一种由通式（A-II）表示的特定化合物作为化合物（A）。

公开(公告)号：US20140248562A1

公开(公告)日：2014-09-04

申请号：US14271606

申请日：2014-05-07

Applicant: FUJIFILM CORPORATION

Inventor： Akinori SHIBUYA ,  Yoko TOKUGAWA ,  Tomoki MATSUDA ,  Junichi ITO ,  Shohei KATAOKA ,  Toshiaki FUKUHARA ,  Naohiro TANGO ,  Kaoru IWATO ,  Masahiro YOSHIDOME ,  Shinichi SUGIYAMA

IPC: G03F7/038

CPC classification number: G03F7/038 ,  C07C303/32 ,  C07C309/04 ,  C07C309/12 ,  C07D295/16 ,  C07D327/06 ,  C07D339/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/325

Abstract: According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition including (A) a compound represented by a general formula (1) below that generates an acid when exposed to actinic rays or radiation, and (B) a resin.

Abstract translation: 根据一个实施方案，提供了一种光化射线或辐射敏感性树脂组合物，其包含（A）下述通式（1）表示的化合物，当暴露于光化射线或辐射时产生酸，和（B） 树脂。

公开(公告)号：US20140170564A1

公开(公告)日：2014-06-19

申请号：US14184854

申请日：2014-02-20

Applicant: FUJIFILM Corporation

Inventor： Tomoki MATSUDA ,  Yoko TOKUGAWA ,  Akinori SHIBUYA

IPC: G03F7/004 ,  G03F7/20

CPC classification number: G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the following formula (1-1); an actinic ray-sensitive or radiation-sensitive film using the composition; and a pattern forming method: in the formula, R1, R2, R3, R4 and Y− are the same as those in formula (1-1) set forth in the description.

Abstract translation: 提供了含有（A）由下式（1-1）表示的化合物的光化射线敏感或辐射敏感性树脂组合物。 使用该组合物的光化射线敏感或辐射敏感膜; 和图案形成方法：在该式中，R1，R2，R3，R4和Y-与描述中阐述的式（1-1）中的那些相同。

公开(公告)号：US20130136900A1

公开(公告)日：2013-05-30

申请号：US13687897

申请日：2012-11-28

Applicant: FUJIFILM Corporation

Inventor： Akinori SHIBUYA ,  Kaoru IWATO

IPC: G03F7/004

CPC classification number: G03F7/004 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  Y10T428/24628

Abstract: Disclosed are an actinic ray-sensitive or radiation-sensitive resin composition including (A) a compound capable of generating an acid by irradiation of actinic rays or radiation, and (B) a resin of which solubility in an alkali developer is increased by being decomposed by the action of an acid, a resist film using the composition, a pattern forming method, an electronic device manufacturing method, and an electronic device, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains a combination composed of the two types of specific compounds of (A-1) or a combination of the two types of specific compounds of (A-2) as the compound (A).

Abstract translation: 公开了一种光化射线敏感性或辐射敏感性树脂组合物，其包含（A）能够通过光化射线或辐射的照射产生酸的化合物，和（B）通过分解增加其在碱性显影剂中的溶解度的树脂 通过酸的作用，使用该组合物的抗蚀剂膜，图案形成方法，电子器件制造方法和电子器件，其中光化射线敏感或辐射敏感性树脂组合物包含由两种类型组成的组合 的（A-1）的具体化合物或作为化合物（A）的两种类型的（A-2）的具体化合物的组合。