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    Semiconductor package
    23.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US07968918B2

    公开(公告)日：2011-06-28

    申请号：US12493290

    申请日：2009-06-29

    申请人： Sung Min Kim

    发明人： Sung Min Kim

    IPC分类号： H01L23/48 ,  H01L21/70 ,  H01L29/40 ,  H01L23/04

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package includes a semiconductor chip having two or more regions that partially overlap so as to define an overlapping region. Through-holes are defined through the two or more partially overlapping regions. One or more first electrodes are disposed on inner surfaces of the semiconductor chip within the through-holes. One or more second electrodes are disposed so as to be insulated from the first electrodes. The one or more second electrodes are at least partially disposed in the overlapping region. Insulation members are disposed in the through-holes.

    摘要翻译： 半导体封装包括具有部分重叠以限定重叠区域的两个或更多个区域的半导体芯片。 通过两个或更多个部分重叠的区域限定通孔。 一个或多个第一电极设置在通孔内的半导体芯片的内表面上。 一个或多个第二电极设置成与第一电极绝缘。 一个或多个第二电极至少部分地设置在重叠区域中。 绝缘构件设置在通孔中。