公开(公告)号：US5962612A

公开(公告)日：1999-10-05

申请号：US979659

申请日：1997-11-26

Applicant: Teruo Takakura ,  Toru Ishida

Inventor： Teruo Takakura ,  Toru Ishida

IPC: C08F214/18 ,  C08F232/00 ,  C09D127/12 ,  C08F12/20

CPC classification number: C08F232/00 ,  C08F214/186 ,  C09D127/12

Abstract: A fluorine-containing copolymer comprising (a) polymer units based on a fluoroolefin, (b) polymer units based on a cyclic monomer having, on its ring, an unsaturated group copolymerizable with the fluoroolefin, (c) polymer units based on an ethylenically unsaturated compound having a curable moiety but having neither an ester bond nor an ether bond, and optionally (d) polymer units based on at least one olefin selected from ethylene, propylene and isobutylene, or polymer units based on a vinyl ether having an aliphatic ring, in such proportions that, based on the total amount of polymer units (a), (b), (c) and (d), polymer units (a) are from 35 to 65 mol %, polymer units (b) are from 5 to 45 mol %, polymer units (c) are from 1 to 30 mol % and polymer units (d) are from 0 to 40 mol %, which has a number average molecular weight within a range of from 2,000 to 100,000, as calculated as polystyrene by gel permeation chromatograph, and which has rings based on said cyclic monomer, on the main chain of the copolymer.

Abstract translation: 一种含氟共聚物，其包含（a）基于氟烯烃的聚合物单元，（b）基于环状单体的聚合物单元，其环上具有可与氟烯烃共聚的不饱和基团，（c）基于烯属不饱和基团的聚合物单元 具有可固化部分但不具有酯键或醚键的化合物，以及（d）基于选自乙烯，丙烯和异丁烯中的至少一种烯烃的聚合物单元或基于具有脂族环的乙烯基醚的聚合物单元， 按照聚合物单元（a），（b），（c）和（d）的总量计，聚合物单元（a）的含量为35-65mol％，聚合物单元（b）为5 至45摩尔％，聚合物单元（c）为1至30摩尔％，聚合物单元（d）为0至40摩尔％，其数均分子量在2,000至100,000的范围内，计算为 聚苯乙烯通过凝胶渗透色谱仪，并且在m上具有基于所述环状单体的环 ain链的共聚物。

公开(公告)号：US5447982A

公开(公告)日：1995-09-05

申请号：US355815

申请日：1994-12-14

Applicant: Motoi Kamba ,  Toru Ishida ,  Hiroshi Washita ,  Hisao Kawazoe ,  Yoshihiro Ohtsuka

Inventor： Motoi Kamba ,  Toru Ishida ,  Hiroshi Washita ,  Hisao Kawazoe ,  Yoshihiro Ohtsuka

IPC: C08F2/16 ,  C08F2/24 ,  C08F259/08 ,  C08F290/06

CPC classification number: C08F259/08 ,  C08F2/24 ,  C08F290/062

Abstract: A process for preparing an aqueous dispersion, which comprises subjecting a monomer to emulsion polymerization in an aqueous medium in the presence of a fluorine-containing copolymer comprising units derived from a fluoroolefin, and units having a hydrophilic side chain.

Abstract translation: 一种水分散体的制备方法，其包括在含有衍生自氟烯烃的单元的含氟共聚物和具有亲水侧链的单元的存在下，在水性介质中使单体进行乳液聚合。

公开(公告)号：US4795512A

公开(公告)日：1989-01-03

申请号：US18579

申请日：1987-02-25

Applicant: Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Toru Ishida

Inventor： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Toru Ishida

IPC: B32B18/00 ,  C04B35/622 ,  C04B35/64 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

CPC classification number: H05K3/4629 ,  B32B18/00 ,  C04B35/622 ,  C04B35/64 ,  H05K3/4611 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/343 ,  C04B2237/525 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/76 ,  H05K1/0306 ,  H05K1/092

Abstract: A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.

Abstract translation: 公开了使用Cu作为导体材料的多层陶瓷的制造方法。 该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤，其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤（还原过程）; 以及在氮气气氛中烧成的步骤，从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化（烧成工序）的烧结。 对于最上层电极，使用金属铜膏，并且在上述还原处理之后进行图案印刷工艺，使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式，可以获得高可靠性的最上层Cu电极。

公开(公告)号：US06820179B2

公开(公告)日：2004-11-16

申请号：US10000034

申请日：2001-12-04

Applicant: Nobuharu Kobayashi ,  Masanobu Kawamura ,  Toru Ishida ,  Masato Momii ,  Naoki Fujita

Inventor： Nobuharu Kobayashi ,  Masanobu Kawamura ,  Toru Ishida ,  Masato Momii ,  Naoki Fujita

IPC: G06F1200

CPC classification number: G11C16/22 ,  G11C7/1006 ,  G11C16/20

Abstract: A semiconductor device which has an internal circuit for performing a circuit operation corresponding to a signal inputted or outputted through an input/output interface circuit adapted to a serial bus. The semiconductor device has a non-volatile storage circuit for storing identification data. Internal identification data stored in the non-volatile storage circuit is compared with external identification data included in an input signal supplied through the serial bus by a comparator circuit. A control circuit is responsive to a match detecting signal generated by the comparator circuit to perform a circuit operation corresponding to an input signal subsequently supplied through the serial bus to change the internal identification data stored in the non-volatile storage circuit.

Abstract translation: 一种半导体器件，具有内部电路，用于执行与通过适用于串行总线的输入/输出接口电路输入或输出的信号相对应的电路操作。 半导体器件具有用于存储识别数据的非易失性存储电路。 存储在非易失性存储电路中的内部识别数据与由比较器电路通过串行总线提供的输入信号中包含的外部识别数据进行比较。 控制电路响应由比较器电路产生的匹配检测信号，以执行与随后通过串行总线提供的输入信号相对应的电路操作，以改变存储在非易失性存储电路中的内部识别数据。

公开(公告)号：US06783211B2

公开(公告)日：2004-08-31

申请号：US09471981

申请日：1999-12-23

Applicant: Emiko Igaki ,  Toru Ishida ,  Masakazu Tanahashi ,  Hidetomo Nagahara ,  Kiyohide Amemiya ,  Masahiko Hashimoto ,  Masayoshi Miura ,  Masaichiro Tatekawa

Inventor： Emiko Igaki ,  Toru Ishida ,  Masakazu Tanahashi ,  Hidetomo Nagahara ,  Kiyohide Amemiya ,  Masahiko Hashimoto ,  Masayoshi Miura ,  Masaichiro Tatekawa

IPC: B41J2045

CPC classification number: B41J2/14209 ,  B41J2002/14217

Abstract: An ink-jet recording head has nozzles capable of independent ejection and being arranged in high density, in which strength is high, fabricating yield is high, a cost is reduced, ejection efficiency is high, and ejection repeating frequency is high. In this ink-jet recording head, there are two-dimensionally arranged units, in each of which an ink pressure chamber, a partition wall serving as a driving portion, a pressure buffer chamber and a fixed wall are arranged in the same direction.

Abstract translation: 喷墨记录头具有能够独立排出的喷嘴，并且以高密度布置，其中强度高，制造成品率高，成本降低，喷射效率高，喷射重复频率高。 在这种喷墨记录头中，存在二维排列的单元，其中分别设置有墨压力室，作为驱动部分的隔壁，压力缓冲室和固定壁。

公开(公告)号：US06465082B1

公开(公告)日：2002-10-15

申请号：US09554502

申请日：2000-05-16

Applicant: Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

Inventor： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

IPC: H05K100

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Abstract translation: 一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：US06461719B1

公开(公告)日：2002-10-08

申请号：US09720240

申请日：2000-12-22

Applicant: Naomi Ichikuni ,  Toru Ishida ,  Seitoku Kaya ,  Atsushi Funaki ,  Teruo Takakura

Inventor： Naomi Ichikuni ,  Toru Ishida ,  Seitoku Kaya ,  Atsushi Funaki ,  Teruo Takakura

IPC: B32B310

CPC classification number: C08L27/18 ,  C08L2205/02 ,  Y10T428/24 ,  Y10T428/24355 ,  Y10T428/24405 ,  C08L2666/04

Abstract: An agricultural covering material made of a fluorine-containing polymer film having a dynamic viscoelastic modulus of from 1 to 70 kg/mm2, a tensile strength of from 1.5 to 5.0 kg/mm2, a specific gravity of from 1.0 to 2.0 and a contact angle with water of at most 106°.

Abstract translation: 由动态粘弹性模量为1〜70kg / mm 2，拉伸强度为1.5〜5.0kg / mm 2，比重为1.0〜2.0的含氟聚合物膜制成的农业覆盖材料和接触角 水最多为106°。

公开(公告)号：US5090119A

公开(公告)日：1992-02-25

申请号：US605096

申请日：1990-10-30

Applicant: Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

Inventor： Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

IPC: H01L21/607 ,  H01L23/485

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

公开(公告)号：US5004715A

公开(公告)日：1991-04-02

申请号：US483462

申请日：1990-02-22

Applicant: Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

Inventor： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

IPC: C04B35/00 ,  C04B35/497 ,  C04B35/499 ,  H01B3/12 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/0085 ,  C04B35/497 ,  C04B35/499 ,  H01G4/1254

Abstract: A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).

Abstract translation: 公开了一种具有高介电常数，低介电损耗，高电阻率，高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。 陶瓷组合物是包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3）和氧化铜的二元体系，或包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3），钛酸铅（PbTiO3） ）和氧化铜。 还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。 还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。 该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤（还原过程）; 以及在氮气氛中烧结多层层叠体的工序（烧结工序）。

公开(公告)号：US4812422A

公开(公告)日：1989-03-14

申请号：US869904

申请日：1986-06-03

Applicant: Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

Inventor： Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

IPC: H01L21/31 ,  C03C3/091 ,  H01B3/02 ,  H01B3/10 ,  H05K1/03 ,  C03C8/16 ,  C03C8/14

CPC classification number: H05K1/0306 ,  C03C3/091 ,  H01B3/10 ,  H05K3/4629

Abstract: Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.

Abstract translation: 公开了一种用于陶瓷多层布线基板的电介质浆料，其特征在于其中包括由Al 2 O 3，SiO 2，CaO和MgO制成的陶瓷和硼硅酸盐玻璃组成的无机组分的组成。 这可以通过将玻璃的一部分与陶瓷混合，在高温下煅烧混合物，然后加入剩余的玻璃与煅烧产物混合来制备。 绝缘层密集地形成，并且通过将该组合物与有机液体混合，可以获得优异的电绝缘性能的电介质糊料。