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    Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor
    1.
    发明授权
    Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor 失效
    介电陶瓷组合物和多层陶瓷电容器以及制造多层陶瓷电容器的方法

    公开(公告)号：US5004715A

    公开(公告)日：1991-04-02

    申请号：US483462

    申请日：1990-02-22

    申请人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

    发明人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

    IPC分类号： C04B35/00 ,  C04B35/497 ,  C04B35/499 ,  H01B3/12 ,  H01G4/008 ,  H01G4/12

    CPC分类号： H01G4/0085 ,  C04B35/497 ,  C04B35/499 ,  H01G4/1254

    摘要： A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).

    摘要翻译： 公开了一种具有高介电常数，低介电损耗，高电阻率，高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。 陶瓷组合物是包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3）和氧化铜的二元体系，或包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3），钛酸铅（PbTiO3） ）和氧化铜。 还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。 还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。 该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤（还原过程）; 以及在氮气氛中烧结多层层叠体的工序（烧结工序）。

    Laminated ceramic capacitor
    2.
    发明授权
    Laminated ceramic capacitor 失效
    层压陶瓷电容器

    公开(公告)号：US5014158A

    公开(公告)日：1991-05-07

    申请号：US507568

    申请日：1990-04-11

    申请人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Tatsuro Kikuchi

    发明人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Tatsuro Kikuchi

    IPC分类号： C04B35/49 ,  H01G4/12

    CPC分类号： C04B35/49 ,  H01G4/1245 ,  Y10T29/435

    摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.

    摘要翻译： 层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。 内部电极层由Ni制成。 电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种 ，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98

    Multilayered ceramic substrate and method of manufacturing the same
    3.
    发明授权
    Multilayered ceramic substrate and method of manufacturing the same 失效
    多层陶瓷基板及其制造方法

    公开(公告)号：US5252519A

    公开(公告)日：1993-10-12

    申请号：US785750

    申请日：1991-10-31

    申请人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Yasuhiko Hakotani

    发明人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Yasuhiko Hakotani

    IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01L21/60

    CPC分类号： H05K1/092 ,  H01L23/49822 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10T29/4913

    摘要： A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.

    摘要翻译： 使用铜作为布线材料的多层玻璃陶瓷基板通过以下步骤制造：用Au糊形成用于连接通过将Ni粉末，Pt粉末和Pd粉末中的至少一种添加到Au粉末中而制备的半导体芯片的布线图案和氧化铜 主要由CuO粉末组成的糊料，在生片上通过在空气中热处理而烧制有机图案，通过在含氢还原气氛中进行热处理来还原氧化铜电极的工序，以及烧结基板材料的工序 ，氧化铜电极和金电极通过在氮气中热处理。 在这种结构中，由于在多层基板的顶层上形成Au布线图形，所以实现了高可靠性的引线接合。 此外，通过利用Au的优异的可焊性，也可以应用于半导体的倒装芯片安装。 此外，在该Au糊剂组合物中，Au的熔点可以提高，如果在900℃下与Cu电极一起烧结，则避免合金化或熔融。

    Method of manufacturing a multilayer ceramic body
    5.
    发明授权
    Method of manufacturing a multilayer ceramic body 失效
    制造多层陶瓷体的方法

    公开(公告)号：US4795512A

    公开(公告)日：1989-01-03

    申请号：US18579

    申请日：1987-02-25

    申请人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Toru Ishida

    发明人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Toru Ishida

    IPC分类号： B32B18/00 ,  C04B35/622 ,  C04B35/64 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

    CPC分类号： H05K3/4629 ,  B32B18/00 ,  C04B35/622 ,  C04B35/64 ,  H05K3/4611 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/343 ,  C04B2237/525 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/76 ,  H05K1/0306 ,  H05K1/092

    摘要： A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.

    摘要翻译： 公开了使用Cu作为导体材料的多层陶瓷的制造方法。 该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤，其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤（还原过程）; 以及在氮气气氛中烧成的步骤，从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化（烧成工序）的烧结。 对于最上层电极，使用金属铜膏，并且在上述还原处理之后进行图案印刷工艺，使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式，可以获得高可靠性的最上层Cu电极。

    Dielectric paste and method of manufacturing the paste
    6.
    发明授权
    Dielectric paste and method of manufacturing the paste 失效
    电介质糊及其制造方法

    公开(公告)号：US4812422A

    公开(公告)日：1989-03-14

    申请号：US869904

    申请日：1986-06-03

    申请人： Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

    发明人： Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

    IPC分类号： H01L21/31 ,  C03C3/091 ,  H01B3/02 ,  H01B3/10 ,  H05K1/03 ,  C03C8/16 ,  C03C8/14

    CPC分类号： H05K1/0306 ,  C03C3/091 ,  H01B3/10 ,  H05K3/4629

    摘要： Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.

    摘要翻译： 公开了一种用于陶瓷多层布线基板的电介质浆料，其特征在于其中包括由Al 2 O 3，SiO 2，CaO和MgO制成的陶瓷和硼硅酸盐玻璃组成的无机组分的组成。 这可以通过将玻璃的一部分与陶瓷混合，在高温下煅烧混合物，然后加入剩余的玻璃与煅烧产物混合来制备。 绝缘层密集地形成，并且通过将该组合物与有机液体混合，可以获得优异的电绝缘性能的电介质糊料。

    Method for producing multilayered ceramic substrate
    9.
    发明授权
    Method for producing multilayered ceramic substrate 失效
    多层陶瓷基板的制造方法

    公开(公告)号：US5370759A

    公开(公告)日：1994-12-06

    申请号：US60981

    申请日：1993-05-14

    申请人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Tsuneharu Katada ,  Satoru Yuhaku ,  Kazuhiro Miura ,  Yoshifumi Nakamura

    发明人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Tsuneharu Katada ,  Satoru Yuhaku ,  Kazuhiro Miura ,  Yoshifumi Nakamura

    IPC分类号： H01L21/48 ,  H01L23/498 ,  B32B31/16 ,  B32B18/00

    CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

    摘要： A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved.

    摘要翻译： 一种多层陶瓷基板的制造方法，其特征在于，包括以下步骤：在导体上形成至少两个生坯片，每个生片包括低温焙烧玻璃陶瓷基板材料，在每个生片上形成电极图案和通孔电极， 糊状，层压所述生片以获得层压体，形成一对生片，其包括在低温焙烧玻璃 - 陶瓷基片材料的生片的烧成温度以下未烧结的无机材料，然后 通过无机材料生片形成孔，将无机材料生片层叠在层压体的最外层生片上，得到所得到的层叠体，其中孔位于最外层低温烧成玻璃的电极图案的一部分上 - 陶瓷生片，在烧成温度下焙烧所得到的层压体，除去未烧结的无机物 ial 基板在其平面方向上不收缩，并且提高了顶层布线图案的表面平滑度，电阻和可焊性。