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公开(公告)号:US11545410B2
公开(公告)日:2023-01-03
申请号:US16222854
申请日:2018-12-17
Applicant: Intel Corporation
Inventor: Mark MacDonald , David Pidwerbecki , Mark Gallina , Jerrod Peterson
IPC: H01L23/34 , H01L23/367 , H01L23/373 , H01L23/42 , H01L23/40 , H01L23/24 , H01L23/473
Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.
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22.
公开(公告)号:US20210329811A1
公开(公告)日:2021-10-21
申请号:US17359134
申请日:2021-06-25
Applicant: Intel Corporation
Inventor: Mark MacDonald , Akhilesh Rallabandi , Ellann Cohen , Michael Nakanishi , John Carver , Arturo Navarro Alvarez , Oleg Krishcko
IPC: H05K7/20
Abstract: Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.
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公开(公告)号:US20190139855A1
公开(公告)日:2019-05-09
申请号:US16222854
申请日:2018-12-17
Applicant: Intel Corporation
Inventor: Mark MacDonald , David Pidwerbecki , Mark Gallina , Jerrod Peterson
IPC: H01L23/367 , H01L23/373
Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.
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公开(公告)号:US20180164108A1
公开(公告)日:2018-06-14
申请号:US15374878
申请日:2016-12-09
Applicant: Intel Corporation
Inventor: Tawfik Rahal-Arabi , Mark MacDonald
CPC classification number: G01C21/3484 , A61B5/0022 , A61B5/021 , A61B5/024 , A61B5/1112 , A61B5/165 , A61B5/18 , A61B5/6802 , A61B5/6893 , A61B5/6898 , A61B5/7275 , A61B2560/0242 , A61B2562/0247 , G01C21/3461 , G01C21/3492
Abstract: In one example, a navigation routing system includes at least one processor to provide a navigation route based on one or more stress levels of a driver of a vehicle.
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公开(公告)号:US20170356468A1
公开(公告)日:2017-12-14
申请号:US15688022
申请日:2017-08-28
Applicant: INTEL CORPORATION
Inventor: Mark MacDonald
CPC classification number: F04D29/666 , G06F1/20
Abstract: Some embodiments of an apparatus and system are described for a volumetric resistance blower. An apparatus may comprise a motor, a rotor comprising a cylindrical foam block, and a casing having one or more inlets arranged in an axial direction of the rotor and one or more outlets arranged in a radial direction of the rotor. Other embodiments are described.
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公开(公告)号:US09785143B2
公开(公告)日:2017-10-10
申请号:US15040707
申请日:2016-02-10
Applicant: INTEL CORPORATION
Inventor: Jered Wikander , Mark MacDonald , Menglu T. Jiang
CPC classification number: G05B24/02 , G06F1/1601 , G06F1/166 , G06F1/1681 , G06K9/20 , H04N5/00
Abstract: A computer is provided that includes a lid having a display and a motion detector to detect motion or movement of a user.
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公开(公告)号:US20170153692A1
公开(公告)日:2017-06-01
申请号:US15431578
申请日:2017-02-13
Applicant: Intel Corporation
Inventor: Mark Yarvis , Samuel Benn , Soethiha Soe , Mark MacDonald , Dominic Fulginiti
IPC: G06F1/32
Abstract: Techniques related to coordinating power management for multiple devices are discussed. Such techniques may include establishing communications between devices, inventorying the components of each device, and implementing a power management plan to eliminate any redundancy in the components and reduce the total power consumed by the devices.
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28.
公开(公告)号:US20170075422A1
公开(公告)日:2017-03-16
申请号:US15125296
申请日:2014-06-09
Applicant: Yanbing SUN , Jian WANG , Mark MACDONALD , Yoshifumi NISHI , Intel Corporation
Inventor: Yanbing Sun , Jian Wang , Mark MacDonald , Yoshifumi Nishi
CPC classification number: G06F3/015 , G06F3/165 , H04R1/1016 , H04R1/1041 , H04R5/033
Abstract: A wearable device (e.g., a headset (100)) for the human ear (202) and having an infrared (IR) temperature sensor (102) to facilitate control of a media device (700) coupled to the wearable device. The control may be based at least in part on the measured temperature indicated by the IR sensor (102) detecting the wearable device as on (or off) an ear of a user.
Abstract translation: 一种用于人耳(202)并且具有红外(IR)温度传感器(102)的可穿戴设备(例如,头戴式耳机(100)),以便于耦合到可穿戴设备的媒体设备(700)的控制。 控制可以至少部分地基于由用户的耳朵上的(或关闭)检测可穿戴设备的IR传感器(102)所指示的测量温度。
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公开(公告)号:US09483126B2
公开(公告)日:2016-11-01
申请号:US15155272
申请日:2016-05-16
Applicant: Intel Corporation
Inventor: Mark E. Sprenger , Russell S. Aoki , Paul J. Gwin , Ralph V. Miele , Shawn McEuen , Mark MacDonald , David Pidwerbecki
CPC classification number: G06F3/033 , E05D3/02 , E05D11/08 , E05D11/082 , E05D2011/085 , E05D2011/088 , G06F1/1616 , G06F1/1679 , G06F1/1681 , G06F1/1683 , H05K5/0226
Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.
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公开(公告)号:US09353560B2
公开(公告)日:2016-05-31
申请号:US14318288
申请日:2014-06-27
Applicant: Intel Corporation
Inventor: Mark E. Sprenger , Russell S. Aoki , Paul J. Gwin , Ralph V. Miele , Shawn McEuen , Mark MacDonald , David Pidwerbecki
CPC classification number: G06F3/033 , E05D3/02 , E05D11/08 , E05D11/082 , E05D2011/085 , E05D2011/088 , G06F1/1616 , G06F1/1679 , G06F1/1681 , G06F1/1683 , H05K5/0226
Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.
Abstract translation: 在一个示例中,电子设备包括控制器,包括第一部分和第二部分的底盘以及将底盘的第一部分连接到底架的第二部分的铰链组件,包括可围绕第一轴线旋转的轴, 制动器可选择性地与轴的一部分接合,以及耦合到制动器的电活性聚合物(EAP)致动器,其中响应于来自控制器的信号,EAP致动器选择性地将制动器与轴的一部分接合。 可以描述其他示例。
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