公开(公告)号：US20190036002A1

公开(公告)日：2019-01-31

申请号：US16072166

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Adel A. ELSHERBINI ,  Valluri R. RAO

IPC: H01L41/09 ,  G02F1/01 ,  H01L27/32 ,  F21S10/02 ,  H01L41/22 ,  H01L51/00

Abstract: Embodiments of the invention include piezoelectrically driven switches that are used for modifying a background color or light source color in display systems, and methods of forming such devices. In an embodiment, a piezoelectrically actuated switch for modulating a background color in a display may include a photonic crystal that has a plurality of blinds oriented substantially perpendicular to a surface of the display. In an embodiment, the blinds include a black surface and a white surface. The switch may also include an anchor spaced away from an edge of the photonic crystal and a piezoelectric actuator formed on the surface of the anchor and a surface of the photonic crystal. Some embodiments may include a photonic crystal that is a multi-layer polymeric structure or a polymer chain with a plurality of nanoparticles spaced at regular intervals on the polymer chain.

公开(公告)号：US20190033500A1

公开(公告)日：2019-01-31

申请号：US16072173

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Baris BICEN ,  Feras EID ,  Sasha N. OSTER ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G02B5/18 ,  G02B26/08 ,  H01L41/09

Abstract: Embodiments of the invention include an optical grating switch integrated into an organic substrate and methods of forming such devices. According to an embodiment, the optical grating switch may include a cavity formed into an organic substrate. Additionally, the optical grating switch may include an array of moveable beams anchored to the organic substrate and suspended over the cavity. In an embodiment of the invention, each of the moveable beams in the optical grating switch may include a piezoelectric region formed over end portions of the moveable beam and a top electrode formed over a top surface of each of the piezoelectric regions. In order to reflect or diffract light, embodiments of the invention may include moveable beams that include a reflective surface formed over a central portion of the moveable beam.

公开(公告)号：US20180328957A1

公开(公告)日：2018-11-15

申请号：US15771869

申请日：2015-12-17

Applicant: Intel Corporation

Inventor： Feras EID ,  Henning BRAUNISCH ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: G01P15/097 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08

CPC classification number: G01P15/097 ,  B81B7/0006 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2203/053 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00166 ,  B81C1/0023 ,  G01P15/0802

Abstract: Embodiments of the invention include a microelectronic device having a sensing device and methods of forming the sensing device. In an embodiment, the sensing device includes a mass and a plurality of beams to suspend the mass. Each beam comprises first and second conductive layers and an insulating layer positioned between the first and second conductive layers to electrically isolate the first and second conductive layers. The first conductive layer is associated with drive signals and the second conductive layer is associated with sense signals of the sensing device.

公开(公告)号：US20180286687A1

公开(公告)日：2018-10-04

申请号：US15476842

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Sasha N. OSTER ,  Fay HUA ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Johanna M. SWAN

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  G03F7/16 ,  B82Y40/00

CPC classification number: H01L21/28562 ,  B82Y40/00 ,  H01L21/033 ,  H01L21/76822 ,  H01L21/76834

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US20180212306A1

公开(公告)日：2018-07-26

申请号：US15746364

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Brandon M. RAWLINGS ,  Georgios C. DOGIAMIS

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01Q9/0457 ,  H01Q13/02

Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.

公开(公告)号：US20180003569A1

公开(公告)日：2018-01-04

申请号：US15199907

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: G01K11/26 ,  H01L41/09 ,  H01L41/047

CPC classification number: G01K11/26 ,  H01L41/047 ,  H01L41/09 ,  H01L41/1132

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

公开(公告)号：US20240266745A1

公开(公告)日：2024-08-08

申请号：US18620275

申请日：2024-03-28

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20230344131A1

公开(公告)日：2023-10-26

申请号：US18216282

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L23/31 ,  H01L23/495 ,  H01Q1/24 ,  H01Q19/22 ,  H01Q1/22 ,  H01L23/552 ,  H01L23/66 ,  H01L21/56 ,  H01Q1/52

CPC classification number: H01Q9/0414 ,  H01L23/3107 ,  H01L23/49541 ,  H01Q1/241 ,  H01Q19/22 ,  H01Q1/2283 ,  H01L23/552 ,  H01L23/66 ,  H01L21/565 ,  H01Q1/526 ,  H01L2223/6677 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20210041647A1

公开(公告)日：2021-02-11

申请号：US17083173

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Shawna LIFF ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Gaurav CHAWLA

IPC: G02B6/42

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US20200064555A1

公开(公告)日：2020-02-27

申请号：US16072240

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Johanna M. SWAN ,  Feras EID ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B6/35 ,  H04Q11/00 ,  H04B10/25

Abstract: Embodiments of the invention include an optical routing device that includes an organic substrate. According to an embodiment, an array of cavities are formed into the organic substrate and an array of piezoelectrically actuated mirrors may be anchored to the organic substrate with each piezoelectrically actuated mirror extending over a cavity. In order to properly rout incoming optical signals, the optical routing device may also include a routing die mounted on the organic substrate. The routing die may be electrically coupled to each of the piezoelectrically actuated mirrors and is able to generated a voltage across the first and second electrodes of each piezoelectrically actuated mirror. Additionally, a photodetector may be electrically coupled to the routing die. According to an embodiment, an array of fiber optic cables may be optically coupled with one of the piezoelectrically actuated mirrors and optically coupled with the photodetector.