公开(公告)号：US10568202B2

公开(公告)日：2020-02-18

申请号：US15658717

申请日：2017-07-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  John R. Dangler ,  Michael J. Fisher ,  David C. Long

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K5/02 ,  G01N27/04 ,  G06F21/87 ,  H05K1/09

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

公开(公告)号：US10395067B2

公开(公告)日：2019-08-27

申请号：US15249671

申请日：2016-08-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  John R. Dangler ,  Phillip Duane Isaacs ,  David C. Long ,  Michael T. Peets

IPC: H05K1/02 ,  H05K5/02 ,  H05K5/03 ,  G06F21/75 ,  G06F21/87 ,  H01R12/59

Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US10178818B2

公开(公告)日：2019-01-08

申请号：US15835585

申请日：2017-12-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Thomas Weiss

IPC: H05K13/00 ,  H05K5/02 ,  H05K3/10

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

公开(公告)号：US10177075B2

公开(公告)日：2019-01-08

申请号：US15186588

申请日：2016-06-20

Applicant: International Business Machines Corporation

Inventor： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

IPC: F28F7/00 ,  H01L23/473 ,  F28D15/00 ,  H01L23/373 ,  F28F13/00

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

公开(公告)号：US10175064B2

公开(公告)日：2019-01-08

申请号：US14865610

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  Silvio Dragone ,  Roger S. Krabbenhoft ,  David C. Long ,  Stefano S. Oggioni ,  Michael T. Peets ,  William Santiago-Fernandez

IPC: H05K1/02 ,  G01D5/16 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

公开(公告)号：US10172239B2

公开(公告)日：2019-01-01

申请号：US14865551

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. Dangler ,  Phillip Duane Isaacs ,  David C. Long

IPC: G06F21/87 ,  H05K3/10 ,  G06F21/72 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K3/06 ,  H05K3/36

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US10098235B2

公开(公告)日：2018-10-09

申请号：US14865591

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. Dangler ,  David C. Long ,  Michael T. Peets

IPC: H05K3/10 ,  H05K1/02 ,  H05K1/09

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

公开(公告)号：US09913362B2

公开(公告)日：2018-03-06

申请号：US14941860

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: B32B41/00 ,  H05K1/02 ,  H05K1/18 ,  G06F21/87 ,  H05K5/02

CPC classification number: H05K1/0213 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/183 ,  H05K5/0208 ,  H05K2201/10151

Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

公开(公告)号：US09578764B1

公开(公告)日：2017-02-21

申请号：US14865686

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Thomas Weiss

IPC: H05K5/00 ,  H05K5/02

CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

Abstract translation: 提供防篡改组件和制造方法，其包括电子外壳，篡改响应的电子电路结构以及至少一个安全元件。 电子外壳至少部分地包围至少一个待保护的电子部件，并且包括内表面。 防篡改电子电路结构包括篡改响应传感器，其至少部分地覆盖电子外壳的内表面，并且至少一个安全元件至少部分地覆盖并物理地固定在适当位置， 响应传感器至少部分地覆盖电子外壳的内表面。 在增强的实施例中，电子外壳被固定到包括嵌入式篡改响应传感器的多层电路板，并且一起覆盖电子外壳的内表面的篡改传感器传感器和多层电路内的嵌入式篡改响应传感器 板定义关于电子部件的安全卷。

公开(公告)号：US10739751B2

公开(公告)日：2020-08-11

申请号：US16010636

申请日：2018-06-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John G. Torok ,  Noah Singer ,  David C. Long ,  Prabjit Singh

IPC: G05B19/406 ,  G01R31/36

Abstract: A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.