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公开(公告)号：US20200072562A1
公开(公告)日：2020-03-05
申请号：US16665046
申请日：2019-10-28
Applicant: International Business Machines Corporation
Inventor： Gerd Schlottig , Stephan Paredes , Ingmar G. Meijer , Thomas Brunschwiler
Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.
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公开(公告)号：US10388540B2
公开(公告)日：2019-08-20
申请号：US15456807
申请日：2017-03-13
Applicant: International Business Machines Corporation
Inventor： Thomas Brunschwiler , Ingmar Meijer , Stephan Paredes , Gerd Schlottig
IPC: H01L21/48 , H01L23/373 , H01L23/427
Abstract: This invention relates to cooling devices for multi-chip semiconductor devices, system-on-a-package devices, and other packaged devices. Because of the non-uniform height across the surface in such large-chip and multi-chip assemblies, providing heat exchange can be troublesome. Many air cooled heat sinks are too stiff to adapt to such non-uniform or warped shapes of chips or to shape-changing chip surfaces during operation. In the present disclosure, application of a mechanical load perpendicular to the chip plane causes certain features to flex and adapt to the non-uniform height of the chip plane, providing improved heat exchange.
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公开(公告)号：US20180261522A1
公开(公告)日：2018-09-13
申请号：US15456807
申请日：2017-03-13
Applicant: International Business Machines Corporation
Inventor： Thomas Brunschwiler , Ingmar Meijer , Stephan Paredes , Gerd Schlottig
IPC: H01L23/367 , H01L23/42 , H01L21/48
CPC classification number: H01L21/4882 , H01L23/3736 , H01L23/427
Abstract: This invention relates to cooling devices for multi-chip semiconductor devices, system-on-a-package devices, and other packaged devices. Because of the non-uniform height across the surface in such large-chip and multi-chip assemblies, providing heat exchange can be troublesome. Many air cooled heat sinks are too stiff to adapt to such non-uniform or warped shapes of chips or to shape-changing chip surfaces during operation. In the present disclosure, application of a mechanical load perpendicular to the chip plane causes certain features to flex and adapt to the non-uniform height of the chip plane, providing improved heat exchange.
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公开(公告)号：US20160322933A1
公开(公告)日：2016-11-03
申请号：US15205360
申请日：2016-07-08
Inventor： Werner Escher , Bruno Michel , Stephan Paredes , Rami Ghannam
CPC classification number: H02S40/44 , F24S10/502 , F24S10/55 , F24S20/20 , F24S23/70 , F24S2020/17 , H01L31/0521 , H01L31/0547 , H02S10/20 , H02S20/00 , H02S20/10 , Y02E10/41 , Y02E10/44 , Y02E10/52 , Y02E10/60
Abstract: A method is disclosed for operating a photovoltaic thermal hybrid system having a hybrid solar receiver with a photovoltaic module, operatively coupled to the system to deliver an electrical output power for a power user, a thermal collector distinct from the photovoltaic module, wherein the photovoltaic module and/or the thermal collector are movably mounted in the system, a collector thermal storage thermally connected to the thermal collector to store heat collected at the thermal collector, and a positioning mechanism adapted to move the photovoltaic module and/or the thermal collector. The method includes instructing the positioning mechanism to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received at the photovoltaic module to an intensity of radiation received at the thermal collector.
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公开(公告)号：US20160319703A1
公开(公告)日：2016-11-03
申请号：US15105000
申请日：2014-12-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Brian Burg , Bruno Michel , Chin Lee Ong , Stephan Paredes , Patrick Ruch
Abstract: A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.
Abstract translation: 公开了一种用于将热量转换成机械能的装置。 该装置包括通道流动锅炉，其具有至少一个通道，其适于加热用于产生液体 - 气体混合物的工作流体; 膨胀装置，其适于膨胀所述液 - 气混合物; 以及可移动元件，其布置成使得所述膨胀液体 - 气体混合物至少部分地将所述液体 - 气体混合物的内部和/或动能转换成与所述可移动元件相关联的机械能; 其中所述通道流动锅炉和/或所述膨胀装置适于向所述液体 - 气体混合物供应热量。
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Patent Agency Ranking
公开(公告)号：US09153722B2
公开(公告)日：2015-10-06
申请号：US13853389
申请日：2013-03-29
Applicant: International Business Machines Corporation
Inventor： Werner Escher , Bruno Michel , Stephan Paredes
CPC classification number: H01L31/0521 , F24S10/20 , F24S23/71 , F24S30/45 , F28F3/12 , H01L2224/48227 , H01L2224/73265 , H01L2924/1461 , H02S40/44 , Y02E10/42 , Y02E10/44 , Y02E10/50 , Y02E10/52 , Y02E10/60 , H01L2924/00
Abstract: A chip module cooling device includes two fluid circuits corresponding to inlet and outlet fluid circuits, respectively, wherein each comprises orifices and channel portions forming a tree structure, wherein branches represent the orifices, and nodes represent the channel portions, a branch linking a node to one child node only, wherein several nodes having a same parent node are sibling nodes and extends through L levels of the tree structure, with L≧3, and in fluidic connection with the other of the two fluid circuits, via channel portions corresponding to leaf nodes. For each fluid circuit, channel portions corresponding to sibling nodes are parallel to each other, and are not parallel to a channel portion corresponding to a parent node of the sibling nodes; and wherein channel portions of one of the fluid circuits are parallel to and interdigitated with channel portions of the other one of the fluid circuits.
Abstract translation: 芯片模块冷却装置分别包括对应于入口和出口流体回路的两个流体回路，其中每个流体回路包括形成树结构的孔和通道部分，其中分支表示孔，节点表示通道部分，将节点连接到 一个子节点，其中具有相同父节点的几个节点是同胞节点并延伸到树结构的L个级别，L≥3，并且与两个流体回路中的另一个流体连接，经由对应于叶片的通道部分 节点。 对于每个流体回路，对应于兄弟节点的信道部分彼此平行，并且不平行于对应于兄弟节点的父节点的信道部分; 并且其中一个流体回路的通道部分与另一个流体回路的通道部分平行并互相指向。
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公开(公告)号：US20150221575A1
公开(公告)日：2015-08-06
申请号：US14633069
申请日：2015-02-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC: H01L23/367 , G02B6/122 , G06F17/50
CPC classification number: H01L23/367 , G02B6/12 , G02B6/122 , G02B6/4269 , G02B6/4272 , G02B6/43 , G02B2006/12147 , G06F17/5022 , G06F17/5068 , G06F17/5077 , H01L2224/16225 , H01L2924/15311
Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.
Abstract translation: 一种用于产生集成电路结构的功能设计模型的计算机辅助设计系统中的计算机程序产品或硬件描述语言（“HDL”）设计结构，包括生成集成电路结构的至少第一和第二区域的功能性表示 产生包括光波导的光学层的功能表示，以及产生用于将热量从至少第二区域通过光学层传递到散热器的导热材料的功能表示。
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公开(公告)号：US20150166371A1
公开(公告)日：2015-06-18
申请号：US14415425
申请日：2013-07-04
Inventor： Werner Escher , Javier V. Goicochea , Ahmed S.G. Khalil , Bruno Michel , Chin Lee Ong , Stephan Paredes
CPC classification number: C02F1/447 , B01D61/364 , B01D61/366 , B01D2313/38 , C02F1/14 , C02F2101/10 , C02F2103/08 , Y02A20/128 , Y02A20/129 , Y02A20/131 , Y02A20/142 , Y02A20/211 , Y02A20/212
Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).
Abstract translation: 用于从进料液体生产馏出物的脱盐系统（1）包括：具有由膜系统（7）分离的液体部分（5）和蒸汽部分（6）的蒸汽提升装置（2）; 具有第一蒸汽部分（11）和液体部分（12）的隔膜蒸馏装置（3），所述第一蒸汽部分（11）和液体部分（12）由壁（14）分离并具有与液体部分（12）分离的第二蒸汽部分（13） 通过膜系统（15）; 以及具有由壁（23）分隔开的第一液体部分（21）和第二液体部分（22）的热交换装置（4）。
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公开(公告)号：US11641785B2
公开(公告)日：2023-05-02
申请号：US17063907
申请日：2020-10-06
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthias Mergenthaler , Andreas Fuhrer Janett , Stephan Paredes , Peter Mueller
Abstract: A method of modifying a resonant frequency of a quantum device includes generating an ion beam having a beam energy and exposing a surface of the quantum device to the ion beam for an exposure time. The ion beam is incident onto the quantum device at an oblique angle that is less than 90 degrees as measured from the surface of the quantum device. The quantum device includes a Josephson junction, the ion beam exposing the quantum device proximate to the Josephson junction to modify a property of the Josephson junction, the property being associated with the resonant frequency of the quantum device.
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公开(公告)号：US11094840B2
公开(公告)日：2021-08-17
申请号：US16032266
申请日：2018-07-11
Applicant: International Business Machines Corporation
Inventor： Emanuel Loertscher , Bruno Michel , Stephan Paredes , Patrick Ruch
IPC: H01L31/052 , H01L31/054 , H01L31/0352
Abstract: One or more embodiments of the present invention are directed to a photovoltaic system. The system comprises photovoltaic cells, arranged side-by-side to form an array of photovoltaic cells. It further involves a cooling device, which comprises one or more layers, wherein the layers extend opposite to the array of photovoltaic cells and in thermal communication therewith, for cooling the cells, in operation. The one or more layers are structured such that a thermal resistance of the photovoltaic system varies across the array of photovoltaic cells, so as to remove heat from photovoltaic cells of the array with different heat removal rates, in operation. One or more embodiments of the present invention are further directed to related systems and methods for cooling such photovoltaic systems.
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