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公开(公告)号：US20120023743A1
公开(公告)日：2012-02-02
申请号：US13270448
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H01R43/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US08071893B2
公开(公告)日：2011-12-06
申请号：US12397922
申请日：2009-03-04
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US20180151918A1
公开(公告)日：2018-05-31
申请号：US15363961
申请日：2016-11-29
Applicant: Vijayasekaran Boovaragavan , Michael Nikkhoo , Dongli Zeng , John Christopher Collins
Inventor： Vijayasekaran Boovaragavan , Michael Nikkhoo , Dongli Zeng , John Christopher Collins
IPC: H01M10/42 , H01M10/0525 , H01M10/0587 , H01M2/20 , H01M10/48 , H01M2/02 , H01M2/34
CPC classification number: H01M10/425 , H01M2/0207 , H01M2/348 , H01M10/0436 , H01M10/4257 , H01M10/48 , H01M2200/00 , H01M2220/30
Abstract: A battery circuit includes a battery cell, monitoring circuitry configured to determine one or more parameters of the battery cell, a pouch enclosing the battery cell and the monitoring circuitry in a sealed, internal cavity, the pouch being configured to inhibit ingress of external fluid to the sealed, internal cavity, and an electrical connector exterior the pouch and electrically connected to the battery cell and the monitoring circuitry via one or more paths extending through the pouch and into the internal cavity.
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公开(公告)号：US20180048013A1
公开(公告)日：2018-02-15
申请号：US15237455
申请日：2016-08-15
Applicant: Dongli Zeng , Tzu-Yuan Lin , John Christopher Collins , Vijayasekaran Boovaragavan , Michael Nikkhoo
Inventor： Dongli Zeng , Tzu-Yuan Lin , John Christopher Collins , Vijayasekaran Boovaragavan , Michael Nikkhoo
CPC classification number: H01M10/0459 , H01M2/1653 , H01M2/1673 , H01M2/168 , H01M2/18 , H01M10/0436
Abstract: Examples disclosed herein relate to a continuous separator having perforations to help reduce or prevent wrinkling of the separator when producing curved electrode stacks. One example provides a battery comprising a plurality of discontinuous electrode layers, and a continuous separator separating the discontinuous electrode layers, the continuous separator having perforations extending at least partially through a depth of the continuous separator in a folded region of the continuous separator.
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Patent Agency Ranking
公开(公告)号：US20170142863A1
公开(公告)日：2017-05-18
申请号：US14942871
申请日：2015-11-16
Applicant: Erin Hurbi , Michael Nikkhoo
Inventor： Erin Hurbi , Michael Nikkhoo
CPC classification number: B29C45/14598 , B29C45/1671 , B29C45/1676 , G06F1/20 , G06F2200/201
Abstract: Examples are disclosed herein that relate to insert molding a heat pipe into a molded part. One example provides a method including inserting a heat pipe into a mold, injecting a material into the mold to at least partially surround the heat pipe and allowing the material to harden into a molded part that incorporates the heat pipe, and incorporating the molded part into a computing device.
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公开(公告)号：US20160212887A1
公开(公告)日：2016-07-21
申请号：US14600769
申请日：2015-01-20
Applicant: Michael Nikkhoo
Inventor： Michael Nikkhoo
CPC classification number: G02B27/0176 , G06F1/163 , G06F1/203 , G06F3/011 , H05K7/20418
Abstract: A passive heat pipe structure used in a wearable device includes a multilayer stack of graphite sheets, each sheet having a plane high thermal conductivity oriented along a first axis and a plane of lower thermal conductivity along a second axis different from the first axis. The stack has a three-dimensional shape including a length and a width where the length is longer than the width and the first axis aligns parallel to said length, the multilayer stack having a height less than the width. A plurality of bonding layers interspersed between each sheet of the multilayer stack, each bonding layer thermally coupling each sheet to a respective adjacent sheet. The bonding layers may comprise metal layers or adhesive layers.
Abstract translation: 在可穿戴装置中使用的被动热管结构包括石墨片的多层叠层，每片具有沿着第一轴取向的平面高热导率和沿着不同于第一轴的第二轴的较低导热率的平面。 叠层具有三维形状，其包括长度比宽度长的长度和宽度，并且第一轴线与所述长度平行排列，所述多层堆叠具有小于宽度的高度。 多个粘合层散布在每个多层堆叠片之间，每个粘合层将每个片材热耦合到相应的相邻片材。 接合层可以包括金属层或粘合剂层。
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公开(公告)号：US20160209661A1
公开(公告)日：2016-07-21
申请号：US14601099
申请日：2015-01-20
Applicant: Michael Nikkhoo , Erin Hurbi
Inventor： Michael Nikkhoo , Erin Hurbi
CPC classification number: G02B27/0176 , C09K5/14 , G02B1/04 , G02B7/008 , G02B27/017 , G02B2027/0178 , H05K7/2039
Abstract: An apparatus comprising an optical mounting structure configured to house heat producing electrical components and display optical systems. The optical mounting structure includes a frame where at least one of the structural components of the frame at least partially comprises a plastic including a plurality of carbon nanoparticles. One or more graphite layers are bonded with the at least one component and thereby combining with the plastic to remove heat from the frame and heat producing electrical components. A method of creating an optical structure adapted to support a plurality of heat emitting components is also provided.
Abstract translation: 一种装置，包括配置成容纳发热电元件和显示光学系统的光学安装结构。 光学安装结构包括框架，其中框架的至少一个结构部件至少部分地包括包括多个碳纳米颗粒的塑料。 一个或多个石墨层与至少一个部件结合，从而与塑料结合以从框架中除去热量并产生热量的电气部件。 还提供了一种创建适于支撑多个发热部件的光学结构的方法。
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公开(公告)号：US08633403B2
公开(公告)日：2014-01-21
申请号：US13270421
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号：US08339798B2
公开(公告)日：2012-12-25
申请号：US12832885
申请日：2010-07-08
Applicant: Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
Inventor： Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
CPC classification number: H05K1/183 , H04R1/025 , H04R1/04 , H05K1/02 , H05K1/115 , H05K1/181 , H05K1/185 , H05K2201/0919 , H05K2201/10053 , H05K2201/10083 , H05K2201/10356 , H05K2201/10446
Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。
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