公开(公告)号：US20240379641A1

公开(公告)日：2024-11-14

申请号：US18784850

申请日：2024-07-25

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chih-Yung Hsieh

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538 ,  H01L25/18

Abstract: The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

公开(公告)号：US12125829B2

公开(公告)日：2024-10-22

申请号：US18093331

申请日：2023-01-05

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Yan-Zheng Wu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66 ,  H01L25/07

CPC classification number: H01L25/072 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

公开(公告)号：US20240085741A1

公开(公告)日：2024-03-14

申请号：US18512050

申请日：2023-11-17

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chean Kee

IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347

CPC classification number: G02F1/1337 ,  G02F1/133302 ,  G02F1/133368 ,  G02F1/1339 ,  G02F1/13439 ,  G02F1/13475 ,  G02F2202/04 ,  G02F2202/043 ,  G02F2202/28

Abstract: An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.

公开(公告)号：US20230352474A1

公开(公告)日：2023-11-02

申请号：US18187682

申请日：2023-03-22

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chih-Yung Hsieh

IPC: H01L27/06 ,  H03K17/687

CPC classification number: H01L27/0629 ,  H03K17/6871

Abstract: An electronic device and a diode are provided. The electronic device includes a switch circuit and a diode. The switch circuit includes a transistor. The diode has a first pin and a second pin. The first pin is electrically coupled to the transistor. The second pin is an idle contact.

公开(公告)号：US20230299489A1

公开(公告)日：2023-09-21

申请号：US18172284

申请日：2023-02-21

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chin-Lung Ting

IPC: H01Q9/04 ,  H01F27/28

CPC classification number: H01Q9/0442 ,  H01F27/28

Abstract: An electronic device including a tuning element is provided. The tuning element includes a first capacitor element including a first switch and a first capacitor electrically coupled to the first switch and a second capacitor element including a second capacitor. The first capacitor element is electrically connected in parallel with the second capacitor element.

公开(公告)号：US20230178534A1

公开(公告)日：2023-06-08

申请号：US17989682

申请日：2022-11-18

Applicant: Innolux Corporation

Inventor： Jia-Sin Lin ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Pei-Chi Chen ,  Wan-Chun Tsai

IPC: H01L25/18 ,  H01L29/786 ,  H01L29/93 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L29/78678 ,  H01L29/78669 ,  H01L29/7869 ,  H01L29/93 ,  H01L25/50

Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.

公开(公告)号：US20230009719A1

公开(公告)日：2023-01-12

申请号：US17840622

申请日：2022-06-15

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chih-Yung Hsieh ,  Chia-Chi Ho

IPC: H01L23/00

Abstract: An electronic apparatus including a substrate, a plurality of first bonding pads, an electronic device, and a first spacer is provided. The first bonding pads are disposed on the substrate. The electronic device is disposed on the substrate and electrically connected to the first bonding pads. The first spacer is disposed between the electronic device and the substrate. The electronic device is capable of effectively controlling a height and uniformity of a gap between the electronic device and the substrate, so as to prevent the electronic device from being tilted and ensure the electronic device to have a favorable structural reliability.

公开(公告)号：US11474398B2

公开(公告)日：2022-10-18

申请号：US15931594

申请日：2020-05-14

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chean Kee

IPC: G02F1/1337 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347 ,  G02F1/1333

Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, and a third substrate disposed between the first substrate and the second substrate, wherein the third substrate has a first surface closer to the first substrate and a second surface closer to the second substrate. A first alignment layer having a first alignment direction is disposed on a surface of the first substrate. A second alignment layer is disposed on a surface of the second substrate. A third alignment layer having a third alignment direction is disposed on a first surface of the third substrate, and a fourth alignment layer is disposed on the second surface of the third substrate. The third alignment direction is perpendicular to the first alignment direction.

公开(公告)号：US20220216302A1

公开(公告)日：2022-07-07

申请号：US17561716

申请日：2021-12-24

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Jen-Hai Chi ,  Yi-Hung Lin ,  Yan-Zheng Wu

IPC: H01L29/08 ,  H05K1/11 ,  H05K3/34

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

公开(公告)号：US20240355985A1

公开(公告)日：2024-10-24

申请号：US18617556

申请日：2024-03-26

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/486

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating layer, and a second metal pattern is provided. The first metal pattern is disposed on the substrate and has a first thickness. The first insulating layer is disposed on the first metal pattern and has a second thickness. The second metal pattern is disposed on the first insulating layer and has a third thickness. The first thickness ranges from 0.1 μm to 10 μm, and a ratio of the third thickness to the second thickness is greater than 0 and less than or equal to 0.4.