公开(公告)号：US20240388067A1

公开(公告)日：2024-11-21

申请号：US18787825

申请日：2024-07-29

Applicant: Intel Corporation

Inventor： Jin Hong ,  Ranjeet Kumar ,  Meer Nazmus Sakib ,  Haisheng Rong ,  Kimchau Nguyen ,  Mengyuan Huang ,  Aliasghar Eftekhar ,  Christian Malouin ,  Siamak Amiralizadeh Asl ,  Saeed Fathololoumi ,  Ling Liao ,  Yuliya Akulova ,  Olufemi Dosunmu ,  Ansheng Liu

IPC: H01S5/50 ,  G02B27/28 ,  H01S5/026 ,  H01S5/30

Abstract: Embodiments of the present disclosure are directed to a silicon photonics integrated apparatus that includes an input to receive an optical signal, a splitter optically coupled to the input to split the optical signal at a first path and a second path, a polarization beam splitter and rotator (PBSR) optically coupled with the first path or the second path, and a semiconductor optical amplifier (SOA) optically coupled with the first path or the second path and disposed between the splitter and the PBSR. Other embodiments may be described and/or claimed.

公开(公告)号：US12148742B2

公开(公告)日：2024-11-19

申请号：US16816669

申请日：2020-03-12

Applicant: Intel Corporation

Inventor： Thomas Liljeberg ,  Andrew C. Alduino ,  Ravindranath Vithal Mahajan ,  Ling Liao ,  Kenneth Brown ,  James Jaussi ,  Bharadwaj Parthasarathy ,  Nitin A Deshpande

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H04B10/40

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

公开(公告)号：US20240333392A1

公开(公告)日：2024-10-03

申请号：US18613293

申请日：2024-03-22

Applicant: Intel Corporation

Inventor： Saeed Fathololoumi ,  Ling Liao ,  Quan Tran

IPC: H04B10/50 ,  H04B10/508

CPC classification number: H04B10/5053 ,  H04B10/506 ,  H04B10/508

Abstract: Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser, an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.

公开(公告)号：US11830863B2

公开(公告)日：2023-11-28

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

CPC classification number: H01L25/167 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L23/5385 ,  H01L23/5386 ,  H04Q11/0005 ,  H01L2023/4031 ,  H04Q2011/0039

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20230204877A1

公开(公告)日：2023-06-29

申请号：US17561694

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： John M. Heck ,  Haisheng Rong ,  Harel Frish ,  Ankur Agrawal ,  Boping Xie ,  Randal S. Appleton ,  Hari Mahalingam ,  Alexander Krichevsky ,  Pooya Tadayon ,  Ling Liao ,  Eric J. M. Moret

IPC: G02B6/42

CPC classification number: G02B6/4207 ,  G02B6/4214 ,  G02B6/428

Abstract: Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.

公开(公告)号：US20210320722A1

公开(公告)日：2021-10-14

申请号：US17304556

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Zuoguo Wu ,  Ling Liao ,  David Hui

IPC: H04B10/50 ,  H04B10/61 ,  H04B10/40

Abstract: In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

公开(公告)号：US10054740B2

公开(公告)日：2018-08-21

申请号：US15393696

申请日：2016-12-29

Applicant: INTEL CORPORATION

Inventor： Yoel Chetrit ,  Judson D. Ryckman ,  Jeffrey B. Driscoll ,  Harel Frish ,  Ling Liao

IPC: G02B6/12 ,  G02B6/122 ,  H01P3/16 ,  H01P11/00 ,  G02B6/136

CPC classification number: G02B6/1228 ,  G02B6/12002 ,  G02B6/136 ,  G02B2006/12038 ,  H01P3/16 ,  H01P11/006

Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.

公开(公告)号：US20160209589A1

公开(公告)日：2016-07-21

申请号：US15085766

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Mahesh Krishnamurthi ,  Judson Ryckman ,  Haisheng Rong ,  Ling Liao ,  Harel Frish ,  Oshrit Harel ,  Assia Barkai ,  Yun-Chung Na ,  Han-Din Liu

IPC: G02B6/122 ,  G02B6/132 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/12002 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4296 ,  G02B2006/12061 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.