Enhanced systems and methods for improved heat transfer from semiconductor packages

    公开(公告)号:US11545410B2

    公开(公告)日:2023-01-03

    申请号:US16222854

    申请日:2018-12-17

    Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

    ENHANCED SYSTEMS AND METHODS FOR IMPROVED HEAT TRANSFER FROM SEMICONDUCTOR PACKAGES

    公开(公告)号:US20190139855A1

    公开(公告)日:2019-05-09

    申请号:US16222854

    申请日:2018-12-17

    Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

    VOLUMETRIC RESISTANCE BLOWER APPARATUS AND SYSTEM

    公开(公告)号:US20170356468A1

    公开(公告)日:2017-12-14

    申请号:US15688022

    申请日:2017-08-28

    Inventor: Mark MacDonald

    CPC classification number: F04D29/666 G06F1/20

    Abstract: Some embodiments of an apparatus and system are described for a volumetric resistance blower. An apparatus may comprise a motor, a rotor comprising a cylindrical foam block, and a casing having one or more inlets arranged in an axial direction of the rotor and one or more outlets arranged in a radial direction of the rotor. Other embodiments are described.

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