公开(公告)号：US07407845B2

公开(公告)日：2008-08-05

申请号：US11048369

申请日：2005-01-31

申请人： Choong-Ho Lee ,  Jae-Man Yoon ,  Dong-Gun Park ,  Chul Lee

发明人： Choong-Ho Lee ,  Jae-Man Yoon ,  Dong-Gun Park ,  Chul Lee

IPC分类号： H01L21/84

CPC分类号： H01L29/66772 ,  H01L29/42384 ,  H01L29/42392 ,  H01L29/785 ,  H01L29/7854 ,  H01L29/78603 ,  H01L29/78648

摘要： In one embodiment, a semiconductor device includes a semiconductor substrate having a lower layer and an upper layer overlying the lower layer. The upper layer is arranged and structured to form first and second active regions that are spaced apart from each other and protrude from an upper surface of the lower layer. A third active region of a bridge shape is distanced vertically from the upper surface of the lower layer and connects the first and second active regions. The device further includes a gate electrode, which is formed with a gate insulation layer surrounding the third active region, so that the third active region functions as a channel.

摘要翻译： 在一个实施例中，半导体器件包括具有下层和覆盖在下层上的上层的半导体衬底。 上层被布置和构造成形成彼此间隔开并从下层的上表面突出的第一和第二有源区。 桥接形状的第三有源区域与下层的上表面垂直地间隔开并且连接第一和第二有源区域。 该器件还包括栅电极，其形成有围绕第三有源区的栅绝缘层，使得第三有源区用作沟道。

公开(公告)号：US07166514B2

公开(公告)日：2007-01-23

申请号：US11046722

申请日：2005-02-01

申请人： Hee-Soo Kang ,  Jae-Man Yoon ,  Dong-Gun Park ,  Sang-Yeon Han ,  Young-Joon Ahn ,  Choong-Ho Lee

发明人： Hee-Soo Kang ,  Jae-Man Yoon ,  Dong-Gun Park ,  Sang-Yeon Han ,  Young-Joon Ahn ,  Choong-Ho Lee

IPC分类号： H01L21/336

CPC分类号： H01L29/7851 ,  H01L29/66818 ,  Y10S257/90

摘要： A fin type MOSFET and a method of manufacturing the fin type MOSFET are disclosed. Gate structures in the fin type MOSFET are formed by a damascene process without a photolithography process. Impurities used to form a channel region are selectively implanted into portions of a semiconductor substrate adjacent to the gate structures.

公开(公告)号：US20060017104A1

公开(公告)日：2006-01-26

申请号：US11183997

申请日：2005-07-19

申请人： Jae-Man Yoon ,  Dong-Gun Park ,  Choong-Ho Lee ,  Chul Lee

发明人： Jae-Man Yoon ,  Dong-Gun Park ,  Choong-Ho Lee ,  Chul Lee

IPC分类号： H01L29/76 ,  H01L29/94

CPC分类号： H01L29/78696 ,  H01L29/66666 ,  H01L29/66772 ,  H01L29/78642

摘要： A semiconductor device may include a tubular channel pattern vertically extending from a semiconductor substrate. A gate insulation layer may be provided on faces exposed through the channel pattern. A gate electrode may be provided on the gate insulation layer. The gate electrode may fill the channel pattern. A conductive region, which may serve as lower source/drain regions, may be formed at a surface portion of the semiconductor substrate. The conductive region may contact a lower portion of the channel pattern. A conductive pattern, which may serve as upper source/drain regions, may horizontally extend from an upper portion of the channel pattern.

公开(公告)号：US20100283094A1

公开(公告)日：2010-11-11

申请号：US12840599

申请日：2010-07-21

申请人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

发明人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

IPC分类号： H01L27/108

CPC分类号： H01L27/10894 ,  H01L27/10876 ,  H01L29/66666 ,  H01L29/7827

摘要： There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.

摘要翻译： 提供了具有垂直晶体管的半导体器件及其制造方法。 该方法包括制备具有单元区域和外围电路区域的半导体衬底。 在单元区域的基板上形成沿行方向和列方向二维排列的岛状的垂直栅极结构。 每个垂直栅极结构包括半导体柱和围绕半导体柱的中心部分的栅电极。 在垂直栅极结构之间的间隙区域的下方，在半导体衬底的内部形成有位线分离沟槽，并且在外围电路区域的半导体衬底的内部形成限制外围电路有源区的外围电路沟道。 位线分离沟槽与垂直栅极结构的列方向平行地形成。 位线分离绝缘层和外围电路隔离层分别形成在位线分离沟槽和外围电路沟槽内部。

公开(公告)号：US07056781B2

公开(公告)日：2006-06-06

申请号：US11014212

申请日：2004-12-15

申请人： Jae-Man Yoon ,  Gyo-Young Jin ,  Hee-Soo Kang ,  Dong-Gun Park

发明人： Jae-Man Yoon ,  Gyo-Young Jin ,  Hee-Soo Kang ,  Dong-Gun Park

IPC分类号： H01L21/336

CPC分类号： H01L29/785 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795 ,  H01L29/7854 ,  H01L29/78609

摘要： According to some embodiments, a fin type active region is formed under an exposure state of sidewalls on a semiconductor substrate. A gate insulation layer is formed on an upper part of the active region and on the sidewalls, and a device isolation film surrounds the active region to an upper height of the active region. The sidewalls are partially exposed by an opening part formed on the device isolation film. The opening part is filled with a conductive layer that partially covers the upper part of the active region, forming a gate electrode. Source and drain regions are on a portion of the active region where the gate electrode is not. The gate electrode may be easily separated and problems causable by etch by-product can be substantially reduced, and a leakage current of channel region and an electric field concentration onto an edge portion can be prevented.

摘要翻译： 根据一些实施例，在半导体衬底上的侧壁的曝光状态下形成鳍型有源区。 在有源区的上部和侧壁上形成栅极绝缘层，并且器件隔离膜将活性区域包围到有源区的上部高度。 侧壁由形成在器件隔离膜上的开口部分部分露出。 开口部分填充有部分覆盖有源区的上部的导电层，形成栅电极。 源极和漏极区域在栅电极不是的有源区域的一部分上。 可以容易地分离栅极电极，并且可以显着地减少由蚀刻副产物引起的问题，并且可以防止沟道区域的漏电流和电场集中在边缘部分上。

公开(公告)号：US08174065B2

公开(公告)日：2012-05-08

申请号：US12840599

申请日：2010-07-21

申请人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

发明人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

IPC分类号： H01L29/66

CPC分类号： H01L27/10894 ,  H01L27/10876 ,  H01L29/66666 ,  H01L29/7827

摘要： There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.

摘要翻译： 提供了具有垂直晶体管的半导体器件及其制造方法。 该方法包括制备具有单元区域和外围电路区域的半导体衬底。 在单元区域的基板上形成沿行方向和列方向二维排列的岛状的垂直栅极结构。 每个垂直栅极结构包括半导体柱和围绕半导体柱的中心部分的栅电极。 在垂直栅极结构之间的间隙区域的下方，在半导体衬底的内部形成有位线分离沟槽，并且在外围电路区域的半导体衬底的内部形成限制外围电路有源区的外围电路沟道。 位线分离沟槽与垂直栅极结构的列方向平行地形成。 位线分离绝缘层和外围电路隔离层分别形成在位线分离沟槽和外围电路沟槽内部。

公开(公告)号：US20060134868A1

公开(公告)日：2006-06-22

申请号：US11316307

申请日：2005-12-21

申请人： Jae-Man Yoon ,  Dong-gun Park ,  Gyo-young Jin ,  Yoshida Makoto ,  Tai-su Park

发明人： Jae-Man Yoon ,  Dong-gun Park ,  Gyo-young Jin ,  Yoshida Makoto ,  Tai-su Park

IPC分类号： H01L21/336 ,  H01L21/8234

CPC分类号： H01L29/7851 ,  H01L21/823437 ,  H01L21/823481 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795

摘要： Provided is a double gate field effect transistor and a method of manufacturing the same. The method of manufacturing the double gate field effect transistor comprises forming as many fins as required by etching a silicon substrate, masking the resultant product by an insulating material such as silicon nitride, forming trench regions for device isolation and STI film by using the silicon nitride mask, forming gate oxide films on both faces of the fins after removing the hard mask, and forming a gate line. As such, unnecessary channel formation under the silicon oxide film, when a voltage higher than a threshold voltage is applied to the substrate, is prevented by forming a thick silicon oxide film on the substrate on which no protruding fins are formed.

摘要翻译： 提供双栅场效应晶体管及其制造方法。 制造双栅场效应晶体管的方法包括通过蚀刻硅衬底形成所需的散热片，通过绝缘材料如氮化硅掩蔽所得产物，通过使用氮化硅形成用于器件隔离的沟槽区域和STI膜 掩模，在除去硬掩模之后在翅片的两个表面上形成栅极氧化膜，并形成栅极线。 因此，当在没有突出的翅片形成的基板上形成厚的氧化硅膜时，通过在基板上施加高于阈值电压的电压，在氧化硅膜下形成不需要的通道。

公开(公告)号：US20050153490A1

公开(公告)日：2005-07-14

申请号：US11014212

申请日：2004-12-15

申请人： Jae-Man Yoon ,  Gyo-Young Jin ,  Hee-Soo Kang ,  Dong-Gun Park

发明人： Jae-Man Yoon ,  Gyo-Young Jin ,  Hee-Soo Kang ,  Dong-Gun Park

IPC分类号： H01L21/336 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L21/00

CPC分类号： H01L29/785 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795 ,  H01L29/7854 ,  H01L29/78609

摘要： According to some embodiments, a fin type active region is formed under an exposure state of sidewalls on a semiconductor substrate. A gate insulation layer is formed on an upper part of the active region and on the sidewalls, and a device isolation film surrounds the active region to an upper height of the active region. The sidewalls are partially exposed by an opening part formed on the device isolation film. The opening part is filled with a conductive layer that partially covers the upper part of the active region, forming a gate electrode. Source and drain regions are on a portion of the active region where the gate electrode is not. The gate electrode may be easily separated and problems causable by etch by-product can be substantially reduced, and a leakage current of channel region and an electric field concentration onto an edge portion can be prevented.

摘要翻译： 根据一些实施例，在半导体衬底上的侧壁的曝光状态下形成鳍型有源区。 在有源区的上部和侧壁上形成栅极绝缘层，并且器件隔离膜将活性区域包围到有源区的上部高度。 侧壁由形成在器件隔离膜上的开口部分部分露出。 开口部分填充有部分覆盖有源区的上部的导电层，形成栅电极。 源极和漏极区域在栅电极不是的有源区域的一部分上。 可以容易地分离栅极电极，并且可以显着地减少由蚀刻副产物引起的问题，并且可以防止沟道区域的漏电流和电场集中在边缘部分上。

公开(公告)号：US20050048729A1

公开(公告)日：2005-03-03

申请号：US10898484

申请日：2004-07-22

申请人： Jae-Man Yoon ,  Dong-gun Park ,  Makoto Yoshida ,  Gyo-Young Jin ,  Jeong-dong Choe ,  Sang-Yeon Han

发明人： Jae-Man Yoon ,  Dong-gun Park ,  Makoto Yoshida ,  Gyo-Young Jin ,  Jeong-dong Choe ,  Sang-Yeon Han

IPC分类号： H01L21/334 ,  H01L21/336 ,  H01L21/8234 ,  H01L21/8238 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/66545 ,  H01L21/823425 ,  H01L21/823814 ,  H01L21/823828 ,  H01L21/82385 ,  H01L29/66537

摘要： A method of manufacturing a transistor according to some embodiments includes sequentially forming a dummy gate oxide layer and a dummy gate electrode on an active region of a semiconductor substrate, ion-implanting a first conductive impurity into source/drain regions to form first impurity regions, and ion-implanting the first conductive impurity to form second impurity regions that are overlapped by the first impurity regions. The method includes forming a pad polysilicon layer on the source/drain regions, sequentially removing the pad polysilicon layer and the dummy gate electrode from a gate region of the semiconductor substrate, annealing the semiconductor substrate, and ion-implanting a second conductive impurity to form a third impurity region in the gate region. The method includes removing the dummy gate oxide layer, forming a gate insulation layer, and forming a gate electrode on the gate region.

摘要翻译： 根据一些实施例的制造晶体管的方法包括在半导体衬底的有源区上依次形成伪栅极氧化物层和虚拟栅电极，将第一导电杂质离子注入到源/漏区中以形成第一杂质区， 并离子注入第一导电杂质以形成与第一杂质区重叠的第二杂质区。 该方法包括在源极/漏极区域上形成焊盘多晶硅层，从半导体衬底的栅极区域顺序地去除焊盘多晶硅层和伪栅电极，退火半导体衬底，并离子注入第二导电杂质以形成 栅极区域中的第三杂质区域。 该方法包括去除伪栅极氧化物层，形成栅极绝缘层，以及在栅极区域上形成栅电极。

公开(公告)号：US07781285B2

公开(公告)日：2010-08-24

申请号：US11450936

申请日：2006-06-09

申请人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

发明人： Bong-Soo Kim ,  Kang-Yoon Lee ,  Dong-Gun Park ,  Jae-Man Yoon ,  Seong-Goo Kim ,  Hyeoung-Won Seo

IPC分类号： H01L21/8242

CPC分类号： H01L27/10894 ,  H01L27/10876 ,  H01L29/66666 ,  H01L29/7827

摘要： There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.

摘要翻译： 提供了具有垂直晶体管的半导体器件及其制造方法。 该方法包括制备具有单元区域和外围电路区域的半导体衬底。 在单元区域的基板上形成沿行方向和列方向二维排列的岛状的垂直栅极结构。 每个垂直栅极结构包括半导体柱和围绕半导体柱的中心部分的栅电极。 在垂直栅极结构之间的间隙区域的下方，在半导体衬底的内部形成有位线分离沟槽，并且在外围电路区域的半导体衬底的内部形成限制外围电路有源区的外围电路沟道。 位线分离沟槽与垂直栅极结构的列方向平行地形成。 位线分离绝缘层和外围电路隔离层分别形成在位线分离沟槽和外围电路沟槽内部。