Test pattern and method of evaluating the transfer properties of a test pattern
    21.
    发明授权
    Test pattern and method of evaluating the transfer properties of a test pattern 有权
    测试图案的测试模式和评估测试图案的转移特性的方法

    公开(公告)号:US07354684B2

    公开(公告)日:2008-04-08

    申请号:US11713962

    申请日:2007-03-05

    IPC分类号: G03F9/00 G03C5/00

    摘要: A test pattern or set of patterns, a method of evaluating the transfer properties of the pattern, and a method of determining a parameter of a transfer process (e.g., imaging process) making use of the test pattern is provided. With the test pattern, the impact of line edge roughness on a transferred pattern may be analyzed. For example, the test pattern may be based upon a lines/spaces pattern, wherein periodic structures having a well-defined period and amplitude are adjacent to the lines. A photomask is provided with the test pattern and an image of the pattern is obtained. Edges of the image are determined and, therefrom, a set of edge position data are obtained. Edge position data are fitted to a straight line to determine edge position residuals. An amplitude spectrum is calculated dependent upon spatial frequencies to obtain a amplitude/spatial frequency relationship. A ratio of determined maximum is formed.

    摘要翻译: 提供了一种测试图案或一组图案,评估图案的转印特性的方法以及使用该测试图案确定转印处理(例如,成像处理)的参数的方法。 利用测试图案,可以分析线边缘粗糙度对转移图案的影响。 例如,测试图案可以基于线/间隔图案,其中具有明确定义的周期和幅度的周期结构与线相邻。 光掩模被提供有测试图案并且获得图案的图像。 确定图像的边缘,由此获得一组边缘位置数据。 边缘位置数据拟合到一条直线上以确定边缘位置残差。 根据空间频率计算振幅谱,以获得幅度/空间频率关系。 形成确定的最大值的比率。

    System and method for semiconductor device fabrication using modeling
    22.
    发明申请
    System and method for semiconductor device fabrication using modeling 审中-公开
    使用建模的半导体器件制造的系统和方法

    公开(公告)号:US20070226674A1

    公开(公告)日:2007-09-27

    申请号:US11390982

    申请日:2006-03-27

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: System and Method for Semiconductor Device Fabrication Using Modeling System and method for using adjustment patterns as well as physical parameters as targets to control mask structure dimensions using optical proximity correction. A preferred embodiment includes defining targets based on definition rules and adjusting mask layer structures based on the targets. The targets comprise structures that are visible in the reproduced pattern as well as targets that affect geometric properties. The targets that affect geometric properties include target sacrificial structures that are selected from one or more of the following groups: actual sacrificial structures that are visible only in an intermediate exposure of the reproduced pattern, virtual sacrificial structures of a mask layer having at least one dimension smaller than a minimum dimension required for resolution, and virtual sacrificial structures not part of the reproduced pattern. Furthermore, targets that affect physical properties, such as light intensity, can be defined and utilized in the adjusting.

    摘要翻译: 使用建模系统的半导体器件制造的系统和方法以及使用调整图案以及物理参数作为目标的方法来使用光学邻近校正来控制掩模结构尺寸。 优选实施例包括基于定义规则定义目标并且基于目标调整掩模层结构。 目标包括在再现模式中可见的结构以及影响几何特性的目标。 影响几何特性的目标包括从以下一个或多个组中选择的靶牺牲结构:仅在再现图案的中间曝光中可见的实际牺牲结构,具有至少一个维度的掩模层的虚拟牺牲结构 小于分辨率所需的最小尺寸,虚拟牺牲结构不是再现模式的一部分。 此外,可以在调整中定义和利用影响物理性质如光强度的目标。

    Lithography masks and methods of manufacture thereof
    28.
    发明授权
    Lithography masks and methods of manufacture thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US07799486B2

    公开(公告)日:2010-09-21

    申请号:US11602886

    申请日:2006-11-21

    IPC分类号: G03F1/00

    摘要: Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 优选实施例包括制造光刻掩模的方法。 所述方法包括提供衬底,在所述衬底的第一区域中形成第一图案,以及在所述衬底的第二区域中形成第二图案,所述第二图案包括不同于第一图案特征的图案的图案。 该方法包括在第一区域中比在衬底的第二区域中影响光的偏振旋转。

    Contact Level Mask Layouts By Introducing Anisotropic Sub-Resolution Assist Features
    29.
    发明申请
    Contact Level Mask Layouts By Introducing Anisotropic Sub-Resolution Assist Features 审中-公开
    通过引入各向异性分解辅助功能的接触层面罩布局

    公开(公告)号:US20090191468A1

    公开(公告)日:2009-07-30

    申请号:US12021527

    申请日:2008-01-29

    IPC分类号: G03F1/00

    CPC分类号: G03F1/36

    摘要: This disclosure includes a SRAF layout that minimizes the number of SRAFs required to reliably print contact shapes. A method is provided that reduces the number of necessary SRAF features on a mask, placing at least two elongated SRAF shapes on the mask such that the elongated SRAF shapes extend past at least one edge of a mask shape in at least one direction.

    摘要翻译: 本公开包括SRAF布局,其最小化可靠地打印接触形状所需的SRAF的数量。 提供了一种减少掩模上必要的SRAF特征的数量的方法,在掩模上放置至少两个细长的SRAF形状,使得细长SRAF形状延伸经过至少一个方向上的掩模形状的至少一个边缘。