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公开(公告)号：US07605457B2
公开(公告)日：2009-10-20
申请号：US11636155
申请日：2006-12-07
申请人： Masataka Hoshino , Junichi Kasai , Kouichi Meguro , Ryota Fukuyama , Yasuhiro Shinma , Koji Taya , Masanori Onodera , Naomi Masuda
发明人： Masataka Hoshino , Junichi Kasai , Kouichi Meguro , Ryota Fukuyama , Yasuhiro Shinma , Koji Taya , Masanori Onodera , Naomi Masuda
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49575 , H01L25/50 , H01L2224/02371 , H01L2224/05548 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/06506 , H01L2225/06513 , H01L2225/06551 , H01L2225/06555 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device.
摘要翻译： 本发明提供一种半导体器件，其包括堆叠的半导体芯片，每个半导体芯片包括半导体衬底和设置在半导体衬底的侧面上且在其侧面上形成有凹部的第一绝缘层; 设置在凹部的内侧面的中心部的第一金属层; 以及第二金属层，其设置在凹部中并连接到形成在每个半导体芯片上的第一金属层。 本发明还提供一种半导体器件的制造方法。
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公开(公告)号：US08030179B2
公开(公告)日：2011-10-04
申请号：US12556408
申请日：2009-09-09
申请人： Masataka Hoshino , Junichi Kasai , Kouichi Meguro , Ryota Fukuyama , Yasuhiro Shinma , Koji Taya , Masanori Onodera , Naomi Masuda
发明人： Masataka Hoshino , Junichi Kasai , Kouichi Meguro , Ryota Fukuyama , Yasuhiro Shinma , Koji Taya , Masanori Onodera , Naomi Masuda
IPC分类号： H01L21/00 , H01L21/4763
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49575 , H01L25/50 , H01L2224/02371 , H01L2224/05548 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/06506 , H01L2225/06513 , H01L2225/06551 , H01L2225/06555 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device.
摘要翻译： 本发明提供一种半导体器件，其包括堆叠的半导体芯片，每个半导体芯片包括半导体衬底和设置在半导体衬底的侧面上且在其侧面上形成有凹部的第一绝缘层; 设置在凹部的内侧面的中心部的第一金属层; 以及第二金属层，其设置在凹部中并连接到形成在每个半导体芯片上的第一金属层。 本发明还提供一种半导体器件的制造方法。
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公开(公告)号：US08530282B2
公开(公告)日：2013-09-10
申请号：US12900370
申请日：2010-10-07
申请人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
发明人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
IPC分类号： H01L21/44
CPC分类号： H01L21/56 , B29C45/02 , B29C45/14655 , B29C45/1671 , H01L21/565 , H01L23/28 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85399 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
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公开(公告)号：US07968990B2
公开(公告)日：2011-06-28
申请号：US11654704
申请日：2007-01-17
申请人： Junji Tanaka , Junichi Kasai , Kouichi Meguro , Masanori Onodera , Koji Taya
发明人： Junji Tanaka , Junichi Kasai , Kouichi Meguro , Masanori Onodera , Koji Taya
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the substrate on which the semiconductor chip is mounted; forming a resin seal portion that seals the semiconductor chip and the upper connection terminal so that an upper surface of the upper connection terminal is exposed; and shaping the upper connection terminal so that the upper surface of the upper connection terminal becomes lower than an upper surface of the resin seal portion.
摘要翻译： 制造半导体器件的方法包括：将半导体芯片安装在基板上; 在其上安装有半导体芯片的基板的一侧上形成上连接端子; 形成密封半导体芯片和上连接端子以使上连接端子的上表面露出的树脂密封部; 并且使上连接端子成形，使得上连接端子的上表面变得低于树脂密封部分的上表面。
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公开(公告)号：US08772953B2
公开(公告)日：2014-07-08
申请号：US12404146
申请日：2009-03-13
申请人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
发明人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
IPC分类号： H01L23/48 , B29C45/16 , H01L23/28 , B29C45/02 , H01L23/31 , H01L25/065 , H01L25/00 , H01L21/56 , H01L23/00 , H01L23/552 , B29C45/14
CPC分类号： H01L21/56 , B29C45/02 , B29C45/14655 , B29C45/1671 , H01L21/565 , H01L23/28 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85399 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
摘要翻译： 本发明包括一种半导体器件及其方法，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，通过该半导体器件及其制造方法，可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。
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公开(公告)号：US08330263B2
公开(公告)日：2012-12-11
申请号：US12965672
申请日：2010-12-10
申请人： Masanori Onodera , Kouichi Meguro , Junji Tanaka
发明人： Masanori Onodera , Kouichi Meguro , Junji Tanaka
IPC分类号： H01L21/44
CPC分类号： H01L25/50 , G06F1/183 , H01L21/56 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/66 , H01L24/11 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L25/18 , H01L2221/68331 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85986 , H01L2225/0651 , H01L2225/0652 , H01L2225/06548 , H01L2225/06568 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/4554
摘要： Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.
摘要翻译： 本发明的各种实施例包括半导体器件及其制造方法，所述半导体器件包括设置在基板上的第一半导体芯片，密封第一半导体芯片的第一密封树脂，设置在第一密封件上的内置半导体器件 树脂和密封第一密封树脂和内置半导体器件并覆盖基板的侧表面的第二密封树脂。 根据本发明的一个方面，可以提供一种能够实现小型化和降低成本的高品质半导体器件及其制造方法。
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公开(公告)号：US20080169552A1
公开(公告)日：2008-07-17
申请号：US11654703
申请日：2007-01-17
申请人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
发明人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
CPC分类号： H01L21/56 , B29C45/02 , B29C45/14655 , B29C45/1671 , H01L21/565 , H01L23/28 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85399 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
摘要翻译： 本发明包括一种半导体器件及其方法，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部分，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，通过该半导体器件及其制造方法，可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。
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公开(公告)号：US07859096B2
公开(公告)日：2010-12-28
申请号：US12624117
申请日：2009-11-23
申请人： Masanori Onodera , Kouichi Meguro , Junji Tanaka
发明人： Masanori Onodera , Kouichi Meguro , Junji Tanaka
IPC分类号： H01L21/44
CPC分类号： H01L25/50 , G06F1/183 , H01L21/56 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/66 , H01L24/11 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L25/18 , H01L2221/68331 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85986 , H01L2225/0651 , H01L2225/0652 , H01L2225/06548 , H01L2225/06568 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/4554
摘要： The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.
摘要翻译： 本发明提供一种半导体器件及其制造方法，所述半导体器件包括设置在基板上的第一半导体芯片，密封第一半导体芯片的第一密封树脂，设置在第一密封树脂上的内置半导体器件，以及 密封第一密封树脂和内置半导体器件并覆盖基板的侧表面的第二密封树脂。 根据本发明的一个方面，可以提供一种能够实现小型化和降低成本的高品质半导体器件及其制造方法。
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公开(公告)号：US20080169544A1
公开(公告)日：2008-07-17
申请号：US11654704
申请日：2007-01-17
申请人： Junji Tanaka , Junichi Kasai , Kouichi Meguro , Masanori Onodera , Koji Taya
发明人： Junji Tanaka , Junichi Kasai , Kouichi Meguro , Masanori Onodera , Koji Taya
CPC分类号： H01L25/105 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the substrate on which the semiconductor chip is mounted; forming a resin seal portion that seals the semiconductor chip and the upper connection terminal so that an upper surface of the upper connection terminal is exposed; and shaping the upper connection terminal so that the upper surface of the upper connection terminal becomes lower than an upper surface of the resin seal portion.
摘要翻译： 制造半导体器件的方法包括：将半导体芯片安装在基板上; 在其上安装有半导体芯片的基板的一侧上形成上连接端子; 形成密封半导体芯片和上连接端子以使上连接端子的上表面露出的树脂密封部; 并且使上连接端子成形，使得上连接端子的上表面变得低于树脂密封部分的上表面。
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公开(公告)号：US07834470B2
公开(公告)日：2010-11-16
申请号：US12491092
申请日：2009-06-24
申请人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
发明人： Koji Taya , Masanori Onodera , Junji Tanaka , Kouichi Meguro
IPC分类号： H01L23/48
CPC分类号： H01L21/56 , B29C45/02 , B29C45/14655 , B29C45/1671 , H01L21/565 , H01L23/28 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85399 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention include a semiconductor device and a method therefore, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefore, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
摘要翻译： 本发明包括一种半导体器件及其方法，其特征在于，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部分，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，由此可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。
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