公开(公告)号：US5958209A

公开(公告)日：1999-09-28

申请号：US855316

申请日：1997-05-13

申请人： Hisao Sakai ,  Toshiko Yokota ,  Tsutomu Asai ,  Susumu Takahashi ,  Mitsuo Suzuki ,  Makoto Dobashi ,  Yasuji Hara

发明人： Hisao Sakai ,  Toshiko Yokota ,  Tsutomu Asai ,  Susumu Takahashi ,  Mitsuo Suzuki ,  Makoto Dobashi ,  Yasuji Hara

IPC分类号： C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  C25C1/12 ,  C25D3/58

CPC分类号： H05K1/09 ,  C25D1/04 ,  C25D3/38 ,  H05K2201/0355 ,  Y10T428/24917

摘要： A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.

摘要翻译： 在180℃下加热1小时后，具有2.5μm以下的无光泽粗糙度Rz和拉伸强度40,000Kgf / mm2的高拉伸强度铜箔是通过将铜从含有 预定少量的聚醚二醇和锡和铁离子。 氯离子含量保持在0.1重量％以下。 ppm。 铜箔的特征在于具有主要为（111）取向的原子单元的铜晶体。

公开(公告)号：US09307639B2

公开(公告)日：2016-04-05

申请号：US12298068

申请日：2007-04-26

申请人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

发明人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

IPC分类号： C25D3/38 ,  H01K1/00 ,  H05K1/09 ,  C25D1/04 ,  C25D7/06 ,  H05K1/03 ,  H05K3/40

CPC分类号： H05K1/09 ,  C25D1/04 ,  C25D3/38 ,  C25D7/0614 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0397 ,  Y10T428/12438

摘要： Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.

摘要翻译： 本发明提供了一种电镀铜箔，其具有与传统的薄型电沉积铜箔相当的低轮廓表面和极大的机械强度及其制造方法。 电沉积铜箔通过沉积具有小直径偏差的细铜晶粒形成。 电沉积铜箔具有低轮廓和光泽的表面，并且具有由70kgf / mm 2至100kgf / mm 2的拉伸强度表示的非常大的机械强度，并且具有加热后的拉伸强度（180℃，对于 60分钟），相当于收到的拉伸强度的85％以上。 电解铜箔通过使用含有由与其结合的具有磺基的苯环构成的化合物的硫酸基铜电解液，活性硫化合物的磺酸盐和季铵盐的聚合物进行电解而制造，所述季铵盐具有 循环结构。

公开(公告)号：US20100038115A1

公开(公告)日：2010-02-18

申请号：US11910050

申请日：2006-03-31

申请人： Mitsuyoshi Matsuda ,  Hisao Sakai ,  Sakito Tomonaga ,  Makoto Dobashi

发明人： Mitsuyoshi Matsuda ,  Hisao Sakai ,  Sakito Tomonaga ,  Makoto Dobashi

IPC分类号： H05K1/00 ,  C25D7/00 ,  C25D1/04 ,  H05K1/09

CPC分类号： C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0355 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24917

摘要： It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

摘要翻译： 本发明的目的是提供一种电镀铜箔，其具有比市面上通常提供的低轮廓电沉积铜箔更低的轮廓和更高的光泽度。 为了实现该目的，本发明采用电沉积铜箔，其具有超薄型，沉积面的表面粗糙度（Rzjis）低于1.0微米，光泽[Gs（60度）] 的厚度不低于400。 本发明还提供一种通过使用通过加入3-巯基-1-丙磺酸和/或二（3-磺丙基）二硫化物得到的硫酸基铜电解液电沉积获得的电沉积铜箔的制备方法，季铵盐 具有环状结构的聚合物和氯。

公开(公告)号：US07524552B2

公开(公告)日：2009-04-28

申请号：US10532717

申请日：2003-10-29

申请人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

发明人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

IPC分类号： B32B3/00 ,  B65D85/00

CPC分类号： H01G4/33 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0355 ,  Y10T428/12514 ,  Y10T428/12903 ,  Y10T428/24917 ,  Y10T428/24926

摘要： To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method.In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

摘要翻译： 提供一种提供介电层的铜箔等，以极大地提高产品产率，同时利用溅射气相沉积法最大限度地利用薄介电层的电容的增加效果。 在铜箔的一侧分别具有电介质层的电介质层的铜箔的情况下，电介质层6是厚度为1.0μm以下的无机氧化物溅射膜，形成在 根据溅射气相沉积法的铜箔和用于分别形成电容器层的介电层提供的铜箔，其特征在于，在无机氧化物溅射膜上产生的凹坑状缺陷部分被聚酰亚胺树脂密封 用过的。

公开(公告)号：US20090095515A1

公开(公告)日：2009-04-16

申请号：US12298068

申请日：2007-04-26

申请人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

发明人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

IPC分类号： C25D3/38 ,  C25D7/06 ,  H05K1/00

CPC分类号： H05K1/09 ,  C25D1/04 ,  C25D3/38 ,  C25D7/0614 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0397 ,  Y10T428/12438

摘要： An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure. The electro-deposited copper foil is suitable for manufacturing TAB substrate having a flying lead as shown in the figure.

摘要翻译： 本发明的目的在于提供一种电镀铜箔，其具有与现有的薄型电沉积铜箔相同的低轮廓表面和极大的机械强度及其制造方法。 为了实现该目的，通过沉积本领域从未获得的具有小直径偏差的细铜晶粒形成电沉积铜箔。 电沉积铜箔具有低轮廓和光泽的表面，并且具有由70kgf / mm 2至100kgf / mm 2的拉伸强度表示的非常大的机械强度，并且具有加热后的拉伸强度（180℃，对于 60分钟），相当于收到的拉伸强度的85％以上。 电解铜箔通过使用含有由与其结合的具有磺基的苯环构成的化合物的硫酸基铜电解液，活性硫化合物的磺酸盐和季铵盐的聚合物进行电解而制造，所述季铵盐具有 循环结构。 电沉积铜箔适用于制造具有如图所示的飞铅的TAB基板。

公开(公告)号：US06777108B1

公开(公告)日：2004-08-17

申请号：US09856350

申请日：2001-05-18

申请人： Shin-ichi Obata ,  Makoto Dobashi

发明人： Shin-ichi Obata ,  Makoto Dobashi

IPC分类号： B32B1504

CPC分类号： C25D1/22 ,  C25D1/04 ,  H05K3/025 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/15 ,  Y10T428/265 ,  Y10T428/31678

摘要： To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than −900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.

摘要翻译： 为了控制载体箔和构成具有载体的电解铜箔的铜 - 微粒层之间的有机释放界面的剥离强度。 在本发明中，（1）在剥离界面层上形成阻挡铜层，在阻挡层上形成铜微粒子， （2）通过使用包含单一金属成分或多个用于形成合金的金属成分的电镀液进行防腐蚀处理，镀浴的沉积势能小于-900mV（ 对AgCl / Ag参比电极）; 和（3）方法（1）和（2）组合。

公开(公告)号：US07455931B2

公开(公告)日：2008-11-25

申请号：US10512453

申请日：2003-04-21

申请人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Kazuko Taniguchi ,  Makoto Dobashi

发明人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Kazuko Taniguchi ,  Makoto Dobashi

IPC分类号： H01M4/58 ,  H01M4/02

CPC分类号： H01M4/134 ,  H01M4/0402 ,  H01M4/0404 ,  H01M4/043 ,  H01M4/0435 ,  H01M4/0438 ,  H01M4/045 ,  H01M4/0452 ,  H01M4/0471 ,  H01M4/366 ,  H01M4/38 ,  H01M4/387 ,  H01M4/405 ,  H01M10/052 ,  H01M2004/027

摘要： An anode for a nonaqueous secondary battery comprising a current collector having formed thereon a first covering layer containing tin, a tin alloy, aluminum or an aluminum alloy and a second covering layer containing a metal having low capability of forming a lithium compound in that order. The anode may have an additional first covering layer formed on the second covering layer. A covering layer containing a copper etc. may be formed as an uppermost layer. Each layer can be formed by heat treating to get desired property. As heat treatment can be done in a short time, it has a great cost merit.

摘要翻译： 一种非水系二次电池用阳极，其特征在于，具备集电体，其上形成有含锡，锡合金，铝或铝合金的第一覆盖层，以及含有依次形成锂化合物的能力低的金属的第二覆盖层。 阳极可以具有形成在第二覆盖层上的附加的第一覆盖层。 可以形成包含铜等的覆盖层作为最上层。 可以通过热处理形成每个层以获得所需的性质。 由于热处理可以在短时间内完成，具有很大的成本优势。

公开(公告)号：US20060147802A1

公开(公告)日：2006-07-06

申请号：US11028661

申请日：2005-01-05

申请人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Shinichi Musha ,  Makoto Dobashi ,  Akihiro Modeki ,  Tomoyoshi Matsushima ,  Hitohiko Honda ,  Takeo Taguchi

发明人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Shinichi Musha ,  Makoto Dobashi ,  Akihiro Modeki ,  Tomoyoshi Matsushima ,  Hitohiko Honda ,  Takeo Taguchi

IPC分类号： H01M4/64 ,  H01M4/66 ,  H01M4/58 ,  C25D7/00

CPC分类号： C25D1/20 ,  C25D1/04 ,  C25D5/10 ,  C25D15/02 ,  C25D17/10 ,  H01M4/045 ,  H01M4/13 ,  H01M4/364 ,  H01M4/38 ,  H01M4/386 ,  H01M4/387 ,  H01M4/587 ,  H01M4/626 ,  H01M4/64 ,  H01M4/661 ,  H01M10/052 ,  H01M2004/021 ,  H01M2004/027

摘要： A negative electrode for nonaqueous secondary batteries is disclosed. The negative electrode has a pair of current collecting surface layers of which the surfaces are adapted to be brought into contact with an electrolyte and at least one active material layer interposed between the surface layers. The active material layer contains particles of an active material having high capability of forming a lithium compound. The material constituting the surfaces is preferably present over the whole thickness of the active material layer to electrically connect the surfaces so that the electrode exhibits a current collecting function as a whole. The surface layers each preferably have a thickness of 0.3 to 10 μm.

摘要翻译： 公开了一种非水系二次电池用负极。 负极具有一对电流收集表面层​​，其表面适于与电解质接触，并且至少一个活性材料层置于表面层之间。 活性物质层含有形成锂化合物的能力高的活性物质的粒子。 构成表面的材料优选存在于活性材料层的整个厚度上，以电连接表面，使得电极整体呈现集电功能。 表面层各自优选具有0.3〜10μm的厚度。

公开(公告)号：US20060115735A1

公开(公告)日：2006-06-01

申请号：US10522791

申请日：2003-12-17

申请人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Shinichi Musha ,  Makoto Dobashi ,  Akihiro Modeki ,  Tomoyoshi Matsushima ,  Hitohiko Honda ,  Takeo Taguchi

发明人： Kiyotaka Yasuda ,  Yoshiki Sakaguchi ,  Shinichi Musha ,  Makoto Dobashi ,  Akihiro Modeki ,  Tomoyoshi Matsushima ,  Hitohiko Honda ,  Takeo Taguchi

IPC分类号： H01M4/64 ,  H01M4/66 ,  H01M4/58 ,  H01M4/04

CPC分类号： H01M4/1395 ,  H01M4/0452 ,  H01M4/134 ,  H01M4/38 ,  H01M4/386 ,  H01M4/387 ,  H01M4/405 ,  H01M10/052 ,  H01M2004/021

摘要： An anode for nonaqueous secondary batteries is disclosed. The anode has a pair of current collecting surface layers of which the surfaces are adapted to be brought into contact with an electrolytic solution and at least one active material layer interposed between the surface layers. The active material layer contains particles of an active material having high capability of forming a lithium compound. The material constituting the surfaces is preferably present over the whole thickness of the active material layer to electrically connect the surfaces so that the electrode exhibits a current collecting function as a whole. The surface layers each preferably have a thickness of 0.3 to 10 μm.

摘要翻译： 公开了一种用于非水二次电池的阳极。 阳极具有一对电流收集表面层​​，其表面适于与电解液接触，并且介于表面层之间的至少一个活性材料层。 活性物质层含有形成锂化合物的能力高的活性物质的粒子。 构成表面的材料优选存在于活性材料层的整个厚度上，以电连接表面，使得电极整体呈现集电功能。 表面层各自优选具有0.3〜10μm的厚度。

公开(公告)号：US20060087794A1

公开(公告)日：2006-04-27

申请号：US11259354

申请日：2005-10-27

申请人： Tomohiro Sakata ,  Kazuko Taniguchi ,  Makoto Dobashi

发明人： Tomohiro Sakata ,  Kazuko Taniguchi ,  Makoto Dobashi

IPC分类号： H01G4/005

CPC分类号： H05K1/162 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2203/0723

摘要： It is an object to provide a capacitor layer forming material useful for a printed wiring board with a substrate of fluorine resin, liquid-crystal polymer or the like, which is fabricated by hot-pressing at 300 to 400° C., and showing no deterioration in strength after the hot-pressing. In order to achieve the object, the capacitor layer forming material, comprising a first electroconductive layer used for forming an upper electrode and second electroconductive layer used for forming a lower electrode with a dielectric layer in-between for a printed wiring board, has the second electroconductive layer made of a composite foil comprising a copper layer coated with one or more layers of, plated hard nickel, plated cobalt and plated nickel/cobalt alloy.

摘要翻译： 本发明的目的是提供一种用于印刷线路板的电容器层形成材料，其具有氟树脂，液晶聚合物等的基材，其通过在300-400℃下热压而制成，并且不显示 热压后的强度变差。 为了实现该目的，电容器层形成材料包括用于形成上电极的第一导电层和用于形成用于印刷电路板的介电层之间的下电极的第二导电层，具有第二导电层 导电层由复合箔制成，包括涂覆有一层或多层电镀硬镍，镀钴和镀镍/钴合金的铜层。