Photoelectric conversion device and fabrication method thereof
    21.
    发明授权
    Photoelectric conversion device and fabrication method thereof 失效
    光电转换装置及其制造方法

    公开(公告)号:US08704083B2

    公开(公告)日:2014-04-22

    申请号:US13022827

    申请日:2011-02-08

    IPC分类号: H01L31/075

    摘要: In a thin film photoelectric conversion deice fabricated by addition of a catalyst element with the use of a solid phase growth method, defects such as a short circuit or leakage of current are suppressed. A catalyst material which promotes crystallization of silicon is selectively added to a second silicon semiconductor layer formed over a first silicon semiconductor layer having one conductivity type, the second silicon semiconductor layer is partly crystallized by a heat treatment, a third silicon semiconductor layer having a conductivity type opposite to the one conductivity type is stacked, and element isolation is performed at a region in the second silicon semiconductor layer to which a catalyst material is not added, so that a left catalyst material is prevented from being diffused again, and defects such as a short circuit or leakage of current are suppressed.

    摘要翻译: 在通过使用固相生长法添加催化剂元素制造的薄膜光电转换元件中,抑制诸如电流的短路或泄漏的缺陷。 促进硅结晶的催化剂材料选择性地添加到形成在具有一种导电类型的第一硅半导体层上的第二硅半导体层中,第二硅半导体层通过热处理部分结晶,具有导电性的第三硅半导体层 与一种导电类型相反的类型堆叠,并且在不添加催化剂材料的第二硅半导体层中的区域处进行元件隔离,从而防止左催化剂材料再次扩散,并且缺陷如 抑制电流的短路或泄漏。

    Optical sensor device including amplifier circuit and feedback resistor
    22.
    发明授权
    Optical sensor device including amplifier circuit and feedback resistor 有权
    光传感器装置包括放大电路和反馈电阻

    公开(公告)号:US08461509B2

    公开(公告)日:2013-06-11

    申请号:US13271300

    申请日:2011-10-12

    IPC分类号: H01J40/14

    摘要: In an optical sensor device employing an amorphous silicon photodiode, an external amplifier IC and the like are required due to low current capacity of the sensor element in order to improve the load driving capacity. It to increase in cost and mounting space of the optical sensor device. In addition, noise may easily superimpose since the photodiode and the amplifier IC are connected to each other over a printed circuit board. According to the invention, an amorphous silicon photodiode and an amplifier configured by a thin film transistor are formed integrally over a substrate so that the load driving capacity is improved while reducing cost and mounting space. Superimposing noise can also be reduced.

    摘要翻译: 在采用非晶硅光电二极管的光学传感器装置中,由于传感器元件的低电流容量需要外部放大器IC等,以提高负载驱动能力。 这导致光学传感器装置的成本和安装空间的增加。 此外,由于光电二极管和放大器IC在印刷电路板上彼此连接,噪声可能容易地叠加。 根据本发明,非晶硅光电二极管和由薄膜晶体管构成的放大器一体地形成在基板上,从而提高负载驱动能力,同时降低成本和安装空间。 叠加噪音也可以减少。

    Semiconductor device and method of manufacturing semiconductor device
    23.
    发明授权
    Semiconductor device and method of manufacturing semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US08227886B2

    公开(公告)日:2012-07-24

    申请号:US12358449

    申请日:2009-01-23

    IPC分类号: H01L31/09

    摘要: An object is to reduce the breakage of appearance such as a crack, a split and a chip by external stress of a semiconductor device. Another object is that manufacturing yield of a thin semiconductor device increases. The semiconductor device includes a plurality of semiconductor integrated circuits mounted on the interposer. Each of the plurality of semiconductor integrated circuits includes a light transmitting substrate which have a step on the side surface and in which the width of one section of the light transmitting substrate is narrower than that of the other section of the light transmitting substrate when the light transmitting substrate is divided at a plane including the step, a semiconductor element layer including a photoelectric conversion element provided on one surface of the light transmitting substrate, and a chromatic color light transmitting resin layer which covers the other surface of the light transmitting substrate and a part of the side surface. The colors of the chromatic color light transmitting resin layers are different in each of the plurality of semiconductor integrated circuits.

    摘要翻译: 目的是通过半导体器件的外部应力来减少裂纹,裂纹和芯片的外观破损。 另一个目的是提高薄半导体器件的制造成品率。 半导体器件包括安装在插入器上的多个半导体集成电路。 所述多个半导体集成电路中的每一个都包括透光基板,所述透光基板在所述侧表面具有台阶,并且所述透光基板的一部分的宽度比所述透光基板的另一部分的宽度窄,当所述光 发送基板在包括该台阶的平面处被分割,包括设置在透光基板的一个表面上的光电转换元件的半导体元件层和覆盖透光基板的另一个表面的彩色透光树脂层和 侧面的一部分。 多色半导体集成电路中的彩色透光树脂层的颜色不同。

    SEMICONDUCTOR DEVICE
    24.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20120086006A1

    公开(公告)日:2012-04-12

    申请号:US13271272

    申请日:2011-10-12

    IPC分类号: H01L31/0232

    摘要: Techniques are provided for obtaining a photoelectric conversion device having a favorable spectral sensitivity characteristic and reduced variation in output current without a contamination substance mixed into a photoelectric conversion layer or a transistor, and for obtaining a highly reliable semiconductor device including a photoelectric conversion device. A semiconductor device may include, over an insulating surface, a first electrode; a second electrode; a color filter between the first electrode and the second electrode; an overcoat layer covering the color filter; and a photoelectric conversion layer over the overcoat layer, where one end portion of the photoelectric conversion layer is in contact with the first electrode, and where an end portion of the color filter lies inside the other end portion of the photoelectric conversion layer.

    摘要翻译: 提供了用于获得具有良好的光谱灵敏度特性和减少的输出电流变化的光电转换装置的技术,而没有混入光电转换层或晶体管中的污染物质,并且用于获得包括光电转换装置的高度可靠的半导体装置。 半导体器件可以在绝缘表面上包括第一电极; 第二电极; 在第一电极和第二电极之间的滤色器; 覆盖滤色器的外涂层; 以及在所述外涂层上的光电转换层,其中所述光电转换层的一个端部与所述第一电极接触,并且所述滤色器的端部位于所述光电转换层的另一端部的内部。

    Photoelectric conversion device, manufacturing method thereof and semiconductor device
    25.
    发明授权
    Photoelectric conversion device, manufacturing method thereof and semiconductor device 有权
    光电转换装置及其制造方法以及半导体装置

    公开(公告)号:US08138004B2

    公开(公告)日:2012-03-20

    申请号:US12821201

    申请日:2010-06-23

    IPC分类号: H01L21/00

    摘要: A manufacturing method of a photoelectric conversion device includes the following steps: forming a first electrode over a substrate; and, over the first electrode, forming a photoelectric conversion layer that includes a first conductive layer having one conductivity, a second semiconductor layer, and a third semiconductor layer having a conductivity opposite to the one conductivity of the second semiconductor layer over the first electrode. The manufacturing method further includes the step of removing a part of the second semiconductor layer and a part of the third semiconductor layer in a region of the photoelectric conversion layer so that the third semiconductor layer does not overlap the first electrode.

    摘要翻译: 光电转换装置的制造方法包括以下步骤:在基板上形成第一电极; 并且在所述第一电极上形成光电转换层,所述光电转换层包括具有一个导电性的第一导电层,第二半导体层和具有与所述第一电极上的所述第二半导体层的一个电导率相反的导电性的第三半导体层。 该制造方法还包括在光电转换层的区域中去除第二半导体层的一部分和第三半导体层的一部分的步骤,使得第三半导体层不与第一电极重叠。

    Semiconductor device
    26.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08049157B2

    公开(公告)日:2011-11-01

    申请号:US12949301

    申请日:2010-11-18

    摘要: The present invention provides a photoelectric conversion device capable of detecting light from weak light to strong light and relates to a photoelectric conversion device having a photodiode having a photoelectric conversion layer; an amplifier circuit including a transistor; and a switch, where the photodiode and the amplifier circuit are electrically connected to each other by the switch when intensity of entering light is lower than predetermined intensity so that a photoelectric current is amplified by the amplifier circuit to be outputted, and the photodiode and part or all of the amplifier circuits are electrically disconnected by the switch so that a photoelectric current is reduced in an amplification factor to be outputted. According to such a photoelectric conversion device, light from weak light to strong light can be detected.

    摘要翻译: 本发明提供一种能够检测弱光到强光的光的光电转换装置,涉及具有光电转换层的光电二极管的光电转换装置; 包括晶体管的放大器电路; 以及开关,其中当入射光的强度低于预定强度时,光电二极管和放大器电路通过开关彼此电连接,使得光电流被放大器电路放大以输出,并且光电二极管和部分 或者所有的放大器电路都被开关电断开,使得放大系数中的光电流减小以被输出。 根据这样的光电转换装置,能够检测弱光到强光的光。

    PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE
    28.
    发明申请
    PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE 有权
    光电转换装置及其半导体装置的制造方法

    公开(公告)号:US20100330729A1

    公开(公告)日:2010-12-30

    申请号:US12821201

    申请日:2010-06-23

    IPC分类号: H01L31/18 H01L31/0232

    摘要: The present invention provides a photoelectric conversion device in which a leakage current is suppressed. A photoelectric conversion device of the present invention comprises: a first electrode over a substrate; a photoelectric conversion layer including a first conductive layer having one conductivity, a second semiconductor layer, and a third semiconductor layer having a conductivity opposite to the one conductivity of the second semiconductor layer over the first electrode, wherein an end portion of the first electrode is covered with the first semiconductor layer; an insulating film, and a second electrode electrically connected to the third semiconductor film with the insulating film therebetween, over the insulating film, are formed over the third semiconductor film, and wherein a part of the second semiconductor layer and a part of the third semiconductor layer is removed in a region of the photoelectric conversion layer, which is not covered with the insulating film.

    摘要翻译: 本发明提供抑制漏电流的光电转换装置。 本发明的光电转换装置包括:基板上的第一电极; 光电转换层,包括具有一个导电性的第一导电层,第二半导体层和具有与第一电极上的第二半导体层的一个导电率相反的导电性的第三半导体层,其中第一电极的端部为 覆盖第一半导体层; 在所述第三半导体膜上形成绝缘膜和在所述绝缘膜上与所述第三半导体膜电绝缘膜电连接的第二电极,并且其中所述第二半导体层的一部分和所述第三半导体的一部分 在光电转换层的未被绝缘膜覆盖的区域中去除层。

    SEMICONDUCTOR DEVICE
    29.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20090121119A1

    公开(公告)日:2009-05-14

    申请号:US12350271

    申请日:2009-01-08

    IPC分类号: H03F3/08

    摘要: The present invention provides a photoelectric conversion device capable of detecting light from weak light to strong light and relates to a photoelectric conversion device having a photodiode having a photoelectric conversion layer; an amplifier circuit including a transistor; and a switch, where the photodiode and the amplifier circuit are electrically connected to each other by the switch when intensity of entering light is lower than predetermined intensity so that a photoelectric current is amplified by the amplifier circuit to be outputted, and the photodiode and part or all of the amplifier circuits are electrically disconnected by the switch so that a photoelectric current is reduced in an amplification factor to be outputted. According to such a photoelectric conversion device, light from weak light to strong light can be detected.

    摘要翻译: 本发明提供一种能够检测弱光到强光的光的光电转换装置,涉及具有光电转换层的光电二极管的光电转换装置; 包括晶体管的放大器电路; 以及开关,其中当入射光的强度低于预定强度时,光电二极管和放大器电路通过开关彼此电连接,使得光电流被放大器电路放大以输出,并且光电二极管和部分 或者所有的放大器电路都被开关电断开,使得放大系数中的光电流减小以被输出。 根据这样的光电转换装置,能够检测弱光到强光的光。

    Photoelectric conversion device and manufacturing method of the same, and a semiconductor device
    30.
    发明授权
    Photoelectric conversion device and manufacturing method of the same, and a semiconductor device 有权
    光电转换装置及其制造方法以及半导体装置

    公开(公告)号:US07492028B2

    公开(公告)日:2009-02-17

    申请号:US11276036

    申请日:2006-02-10

    IPC分类号: H01L27/14

    摘要: A photo-sensor having a structure which can suppress electrostatic discharge damage is provided. Conventionally, a transparent electrode has been formed over the entire surface of a light receiving region; however, in the present invention, the transparent electrode is not formed, and a p-type semiconductor layer and an n-type semiconductor layer of a photoelectric conversion layer are used as an electrode. Therefore, in the photo-sensor according to the present invention, resistance is increased an electrostatic discharge damage can be suppressed. In addition, positions of the p-type semiconductor layer and the n-type semiconductor layer, which serve as an electrode, are kept away; and thus, resistance is increased and withstand voltage can be improved.

    摘要翻译: 提供了具有可以抑制静电放电损坏的结构的光传感器。 通常,在光接收区域的整个表面上形成透明电极; 然而,在本发明中,不形成透明电极,并且使用光电转换层的p型半导体层和n型半导体层作为电极。 因此,在根据本发明的光电传感器中,电阻增加可以抑制静电放电损坏。 此外,用作电极的p型半导体层和n型半导体层的位置被保留; 因此,电阻增加,并且可以提高耐受电压。