公开(公告)号：US20140151237A1

公开(公告)日：2014-06-05

申请号：US14065720

申请日：2013-10-29

Applicant: Microfabrica Inc.

Inventor： Dennis R. Smalley

IPC: C25D5/02 ,  G06F17/50

CPC classification number: C25D5/02 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y50/02 ,  B81B2201/042 ,  B81C1/00126 ,  B81C1/0038 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  G06F17/5072 ,  H01L21/2885 ,  H01L21/76885 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract translation: 通过沉积第一材料，选择性地蚀刻第一材料（例如经由掩模），沉积第二材料以填充由蚀刻产生的空隙，然后平坦化沉积物以便结合层，电化学地制造多层结构 被创建并且之后向之前形成的层添加附加层。 第一和第二沉积可以是毯子或选择类型。 用于形成连续层的形成过程的重复可以在有或没有变化（例如：在图案上的变化;与沉积，蚀刻和/或平面化操作相关联的数量或存在或参数的变化）中重复，操作顺序或沉积的材料 ）。 其他实施例使用使用与其它层相关联地沉积的材料与一些层相关联地沉积材料的操作形成多层结构。

公开(公告)号：US12196782B2

公开(公告)日：2025-01-14

申请号：US17968601

申请日：2022-10-18

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

公开(公告)号：US20240094257A1

公开(公告)日：2024-03-21

申请号：US17968601

申请日：2022-10-18

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

CPC classification number: G01R1/07314 ,  G01R1/06722 ,  G01R1/06738 ,  G01R3/00

Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

公开(公告)号：US20240094255A1

公开(公告)日：2024-03-21

申请号：US17507598

申请日：2021-10-21

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Dennis R. Smalley

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

CPC classification number: G01R1/07314 ,  G01R1/06722 ,  G01R1/06738 ,  G01R3/00

Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

公开(公告)号：US20240017990A1

公开(公告)日：2024-01-18

申请号：US18301162

申请日：2023-04-14

Applicant: Microfabrica Inc.

Inventor： Duy P. Le ,  Rulon J. Larsen ,  Jeffrey A. Thompson ,  Uri Frodis ,  Dale S. McPherson ,  Kleun Kim ,  Mahmood Samiee ,  Nina C. Levy ,  Dennis R. Smalley

IPC: B81C99/00

CPC classification number: B81C99/003 ,  B81C99/004 ,  B81C2201/0105 ,  B81C2201/013

Abstract: Electronic test probes formed in a batch have a plurality of multi-material layers wherein at least one of the materials is a sacrificial material and at least one other material is a structural material. Successfully formed or good test probes are separated from unsuccessfully formed or bad test probes

公开(公告)号：US20230314474A1

公开(公告)日：2023-10-05

申请号：US18295755

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R3/00

CPC classification number: G01R1/06722 ,  G01R1/06727 ,  G01R3/00

Abstract: A method of forming a probe, comprises providing a first and a second probe modules, having respective compliant element functionally joining respective probes arm that directly or indirectly holds a first and a second tips and forming the probe by laterally and longitudinally aligning the first and second probe modules with their respective tips pointing away from each other.

公开(公告)号：US09919472B1

公开(公告)日：2018-03-20

申请号：US14280517

申请日：2014-05-16

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Rulon J. Larsen, III ,  Uri Frodis ,  Kieun Kim ,  Dennis R. Smalley

IPC: B23K20/00 ,  B29C65/48

CPC classification number: B23K20/00 ,  B23K20/10 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/04 ,  B23K2103/14 ,  B23K2103/26 ,  B23K2103/50 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

Abstract: Embodiments are directed to methods of producing devices using modified multi-layer, multi-material electrochemical fabrication processes and/or using a laser cutting processes wherein individual layers or layer groups are formed and then stacked and bonded to produce prototypes or production parts. The methods can reduce the cost and lead time of prototyping when compared with previous multi-layer, multi-material electrochemical fabrication processes and can also reduce the lead time of production quantities, by allowing multiple layers of a multilayer device to be formed simultaneously, e.g. in parallel on the same wafer. Additionally, these methods may be used to extend the maximum height to which parts may practically be made. Finally, the methods allow geometries that are impossible, impractical or difficult to release (e.g. microfluidic devices such as pumps or parts with long, narrow channels) to be fabricated in multiple pieces and then joined after full or partial release.

公开(公告)号：US20170263994A1

公开(公告)日：2017-09-14

申请号：US15387362

申请日：2016-12-21

Applicant: Microfabrica Inc.

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P3/06 ,  C25D5/02 ,  C25D1/00 ,  C25D5/10

CPC classification number: H01P3/06 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

公开(公告)号：US09614266B2

公开(公告)日：2017-04-04

申请号：US14675147

申请日：2015-03-31

Applicant: Microfabrica Inc.

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P3/06 ,  C25D1/00 ,  C25D5/02 ,  C25D5/10

CPC classification number: H01P3/06 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

公开(公告)号：US20160258075A1

公开(公告)日：2016-09-08

申请号：US15091537

申请日：2016-04-05

Applicant: Microfabrica Inc.

Inventor： Dennis R. Smalley ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard

IPC: C25D1/00 ,  H05K3/46 ,  C25D1/20

CPC classification number: A61N1/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  H05K3/467 ,  H05K3/4682

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract translation: 用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供将第一导电材料的至少一部分与 （1）第一导电材料的其它部分，（2）第二导电材料或（3）另一种电介质材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄。 在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。