摘要:
The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide.The present invention also relates to a block copolymer obtainable from this process.The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.
摘要:
The invention relates to a thermoplastic molding composition containing at least one polyester, a compound of the formula (I) a mixture of compounds of the formula (II) and optionally additional compounds and additives. The invention further relates to the use of the thermoplastic molding composition for the producing fibers, foils and moldings. The invention further relates to fibers, foils and moldings containing the thermoplastic molding composition.
摘要:
The thermoplastic molding composition comprises a) as component A, from 3 to 78% by weight of one or more styrene copolymers which have no units derived from maleic anhydride, b) as component B, from 15 to 90% by weight of one or more polyamides, c) as component C, from 5 to 50% by weight of one or more impact-modifying graft rubbers without olefinic double bonds in the rubber phase, d) as component D, from 1 to 25% by weight of one or more styrene copolymers which have, based on the entire component D, from 0.5 to 5% by weight of units derived from maleic anhydride, e) as component E, from 1 to 30% by weight of one or more further rubbers based on olefinic monomers without core-shell structure, and having at least 0.1% by weight of functional monomers, f) as component F, from 0 to 50% by weight of one or more fibrous or particulate fillers, g) as component G, from 0 to 40% by weight of further additives, where the entire amount of components A to E and, if appropriate, F and G is 100% by weight.
摘要:
The thermoplastic molding composition comprises: a) as component A, from 0 to 97.9% by weight of one or more (methyl)styrene-acrylonitrile copolymers which do not have any units derived from maleic anhydride, and which have an intrinsic viscosity smaller than 85 ml/g, b) as component B, from 1 to 98.9% by weight of one or more (methyl)styrene-acrylonitrile copolymers which have, based on the entire component B, from 0.5 to 5% by weight of units derived from maleic anhydride, c) as component C, from 1 to 75% by weight of glass fibers, d) from 0.1 to 20% by weight of one or more flow promoters, selected from d1) as component D1, at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), d2) as component D2, at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, d3) as component D3, alkyl acrylate oligomers with a weight-average molar mass in the range from 1200 to 4000 g/mol, e) as component E, from 0 to 40% by weight of further fillers, or rubbers, and/or further additives, where the total amount of components A to D and, if present, E is 100% by weight.
摘要:
The present invention relates to the use of a molding composition for producing a feed container consisting essentially of a copolymer composed of (A) from 5 to 60% by weight of units of the formula (I) (B) from 40 to 95% by weight of units of the formula (II) where the total of the proportions by weight is 100% by weight, based on the copolymer, and where the demolding force of the molding composition is from 1800 to 2800 N.
摘要:
The invention relates to thermoplastic molding compounds, containing a) 3 to 91.9 wt % of one or more styrene copolymers as component A, b) 3 to 91 wt % of one or more polyamides as component B, c) 3 to 50 wt % of one or more graft natural rubbers as component C, d) 0.1 to 25 wt % of one or more compatibilizers as component D, and e) 2 to 30 wt % of ethylene-1-octene copolymer having functional groups as component E, said thermoplastic molding compounds having improved low-temperature toughness.
摘要:
Semiconductor wafers of silicon are produced by pulling a single crystal growing on a phase boundary from a melt contained in a crucible and cutting of semiconductor wafers therefrom, wherein during pulling of the single crystal, heat is delivered to a center of the phase boundary and a radial profile of a ratio V/G from the center to an edge of the phase boundary is controlled, G being the temperature gradient perpendicular to the phase boundary and V being the pull rate. The radial profile of the ratio V/G is controlled so that the effect of thermomechanical stress in the single crystal adjoining the phase boundary, is compensated with respect to creation of intrinsic point defects. The invention also relates to defect-free semiconductor wafers of silicon, which can be produced economically by this method.
摘要:
The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) as component A, at least one polyamide or copolyamide, or one polymer blend comprising polyamide, b) as component B, from 3 to 20% by weight of carbon black or graphite, or a mixture thereof, c) as component C, from 0.1 to 3% by weight of ionic liquids.
摘要:
The present invention relates to thermoplastic molding compositions comprising a mixture composed of (A) at least one methyl methacrylate polymer, (B) at least one copolymer, obtainable via polymerization of a mixture, composed of (B1) at least one vinylaromatic monomer, and (B2) at least one vinyl cyanide, as monomers, (C) at least one graft polymer, obtainable from a core, and a first graft shell, and a second graft shell, (D) at least one polybutyl acrylate whose molar mass is from 1700 to 4000 g/mol (determined as Mw by means of gel permeation chromatography), and (E) if appropriate conventional additives, as component (E), to a process for preparation of these thermoplastic molding compositions, to the use of this thermoplastic molding composition for production of moldings, and also to the use of styrene-methyl methacrylate copolymers whose molar mass is from 1700 to 4000 g/mol (determined as Mw by means of gel permeation chromatography) for improvement of flowability and for reduction of the dependency of notched impact strength and haze values of thermoplastic molding compositions on injection-molding conditions.
摘要:
The present invention relates to binders for the preforming process to which textile structures are subjected when structural materials are produced by the RIM or RTM method, where the binder composed of an amorphous polyimide is spray applied in a solvent onto the textile structure or onto the textile, and is used as binder for the preforming process. The present invention further relates to a process for producing moldings made of fiber-reinforced composite materials.