公开(公告)号：US5458981A

公开(公告)日：1995-10-17

申请号：US148861

申请日：1993-11-08

Applicant: Masahiro Abe ,  Tsutomu Nanataki ,  Shinsuke Yano

Inventor： Masahiro Abe ,  Tsutomu Nanataki ,  Shinsuke Yano

IPC: C04B35/46 ,  C03C14/00 ,  C04B35/462 ,  C04B35/465 ,  H01B3/02 ,  H01B3/12 ,  H05K1/03 ,  B32B9/00

CPC classification number: C04B35/465 ,  C03C14/004 ,  C04B35/462 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24926

Abstract: A method of producing a dielectric ceramic composition is disclosed which includes the steps of: preparing a main ceramic composition comprising BaO, TiO.sub.2 and RE.sub.2 O.sub.3 (where RE represents at least one rare earth metal) as major components; calcining a mixture of starting materials which give the main ceramic composition, at a temperature of 1050.degree. C. or higher, to provide a calcined mixture; finely pulverizing the calcined mixture to provide a calcined ceramic powder having an average grain size of not larger than 0.8 .mu.m; and adding, as at least a part of a secondary component, a B.sub.2 O.sub.3 powder or a glass powder containing B.sub.2 O.sub.3, to the main ceramic composition. Also disclosed are a dielectric resonator and dielectric filter using such a dielectric ceramic composition as produced according to the above method, and a method of producing such a dielectric resonator or filter.

Abstract translation: 公开了一种制备电介质陶瓷组合物的方法，其包括以下步骤：制备包含BaO，TiO 2和RE 2 O 3（其中RE表示至少一种稀土金属）作为主要组分的主要陶瓷组合物; 在1050℃或更高的温度下煅烧得到主要陶瓷组合物的起始材料的混合物，以提供煅烧混合物; 将煅烧后的混合物粉碎，得到平均粒径不大于0.8μm的煅烧陶瓷粉末; 并将作为至少一部分次要成分的B 2 O 3粉末或含有B 2 O 3的玻璃粉末添加到主要陶瓷组合物中。 还公开了使用根据上述方法制造的这种介电陶瓷组合物的介质谐振器和介质滤波器以及制造这种介质谐振器或滤波器的方法。

公开(公告)号：US5407863A

公开(公告)日：1995-04-18

申请号：US798706

申请日：1991-11-29

Applicant: Toshihiko Katsura ,  Masahiro Abe ,  Tomoyuki Iguchi

Inventor： Toshihiko Katsura ,  Masahiro Abe ,  Tomoyuki Iguchi

IPC: H01L23/52 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H01L23/532 ,  H01L21/44

CPC classification number: H01L21/2855 ,  H01L21/32051 ,  H01L23/53214 ,  H01L2924/0002 ,  Y10S438/927

Abstract: To improve electromigration resistance and stress migration resistance, when a film is formed by depositing Al or Al alloy on a semiconductor substrate, the film is formed stepwise by stepwise changing the heating temperature of the semiconductor substrate at at least two stages.

Abstract translation: 为了提高耐迁移性和耐应力迁移性，当通过在半导体衬底上沉积Al或Al合金形成膜时，通过在至少两个阶段逐步改变半导体衬底的加热温度而逐步形成膜。

公开(公告)号：US5055906A

公开(公告)日：1991-10-08

申请号：US653481

申请日：1991-02-12

Applicant: Yasukazu Mase ,  Masahiro Abe ,  Tomie Yamamoto

Inventor： Yasukazu Mase ,  Masahiro Abe ,  Tomie Yamamoto

IPC: H01L21/312 ,  H01L21/31 ,  H01L21/314 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/5329 ,  H01L23/5226 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/12044

Abstract: A semiconductor device has a first interconnection pattern formed on a semiconductor substrate, and a second interconnection pattern located in and over a through hole formed at a composite insulating layer structure. The composite insulating layer structure is constituted by a first inorganic insulating film and an organic insulating film. At a peripheral region of the second interconnection pattern, the organic insulating film is partially eliminated to form an eliminated portion. The semiconductor device also has a second inorganic insulating film which is formed over the organic insulating film and is directly formed on the first inorganic insulating film, via the eliminated portion.

公开(公告)号：US5044311A

公开(公告)日：1991-09-03

申请号：US431243

申请日：1989-11-03

Applicant: Yasukazu Mase ,  Masahiro Abe

Inventor： Yasukazu Mase ,  Masahiro Abe

IPC: C23C16/44 ,  C23C16/50 ,  C23C16/509 ,  H01J37/32 ,  H01L21/205 ,  H01L21/31

CPC classification number: H01J37/32477 ,  C23C16/5096 ,  H01J37/32743 ,  H01J2237/3321

Abstract: A plasma chemical vapor deposition apparatus comprises a reaction chamber, electrodes provided in the reaction chamber and a side wall constituting part of the reaction chamber and having a wafer access opening, at least the side wall having its surface portion covered with an insulating member. The insulating member prevents abnormal discharge between the electrodes and side wall.

公开(公告)号：US4760995A

公开(公告)日：1988-08-02

申请号：US27224

申请日：1987-03-02

Applicant: Shuzo Fukuda ,  Masahiro Abe ,  Shiro Fukunaka ,  Michio Nakayama ,  Shuji Kaneto ,  Masayuki Yamazaki ,  Kouichiro Arima

Inventor： Shuzo Fukuda ,  Masahiro Abe ,  Shiro Fukunaka ,  Michio Nakayama ,  Shuji Kaneto ,  Masayuki Yamazaki ,  Kouichiro Arima

IPC: C21D9/56

CPC classification number: C21D9/56

Abstract: This invention relates to a continuously treating line for a steel band, having a heating furnace by directly flaming. For heating the steel band with causing reduction, the heating furnace of directly flaming system is provided with a plurality of heating burners of reduction system which may form non-equilibrium range of the air and the fuel in a flame, that is, a reduction range, wherein the heating burners are positioned at predetermined arrangement with respect to the steel band and at a certain pitch predetermined in relation with an inner diameter of the burner in a line running direction.The treating line has said heating furnace constructed as mentioned above and a subsequent atmosphere furnace, and said atmosphere furnace may be provided with a sealing chamber having various means for avoiding invasion of the outer air.The line has, in order, a pre-heating furnace, said heating furnace and an indirectly heating furnace, and it may be furnished with intermediate chambers between respective furnaces for preventing the furnace gas from moving, and further may be furnished with an after-burning chamber for perfectly burning a combustion exhaust gas to be supplied to the pre-heating chamber.

Abstract translation: PCT No.PCT / JP86 / 00352 Sec。 371日期1987年3月2日 102（e）日期1987年3月2日PCT申请日1986年7月10日PCT公布。 公开号WO87 / 00555 日本1987年1月29日。本发明涉及一种钢带的连续处理线，其具有通过直接燃烧的加热炉。 为了减少钢带的加热，直接燃烧系统的加热炉具有多个可在火焰中形成空气和燃料的非平衡范围的还原系统的加热燃烧器，即减少范围 其中，所述加热燃烧器相对于所述钢带以预定的布置定位，并且以相对于所述燃烧器的内径在线运行方向上预定的一定间距定位。 处理管线具有如上所述构造的加热炉和随后的气氛炉，并且所述气氛炉可以设置有具有用于避免外部空气侵入的各种装置的密封室。 该线依次具有预热炉，所述加热炉和间接加热炉，并且可以在相应的炉之间设置有用于防止炉气移动的中间室，并且还可以具有后加热炉， 燃烧室，用于完全燃烧将被供应到预热室的燃烧废气。

公开(公告)号：US4689388A

公开(公告)日：1987-08-25

申请号：US824545

申请日：1986-01-23

Applicant: Kiyomiki Hirai ,  Koji Takeuchi ,  Hiroshi Sakamoto ,  Masahiro Abe

Inventor： Kiyomiki Hirai ,  Koji Takeuchi ,  Hiroshi Sakamoto ,  Masahiro Abe

IPC: C08G59/18 ,  C08G59/40 ,  C08G59/60 ,  C08G59/64

CPC classification number: C08G59/182 ,  C08G59/40 ,  C08G59/4014 ,  C08G59/4035

Abstract: A curable epoxy resin composition, comprising (1) an alicyclic epoxy resin having an average of more than one epoxy group per molecule, (2) a polybasic acid hydrazide, and (3) a latent curing agent for said epoxy resin which comprises an addition product obtained by reacting (a) a polyfunctional epoxy compound with (b) a compound having at least one functional group in the molecule selected from the group consisting of OH, SH, COOH and CONHNH.sub.2 together with a tertiary amino group, or by reacting said components (a) and (b) with (c) an organic compound which has more than two active hydrogen atoms in the molecule, said reactions occurring under conditions in which the ratio of (a) to (b) or (a) to (b) and (c) ranges from 0.8 to 2.5 equivalents of (a) per equivalent of the total active hydrogen atoms in component (b) and in components (b) and (c), the molar ratio of (c) to (b) being 0.2:1 to 1:1, and said addition product having a softening point of 60.degree. to 180.degree. C.

Abstract translation: 一种可固化环氧树脂组合物，其包含（1）每分子平均具有多于一个环氧基的脂环族环氧树脂，（2）多元酸酰肼，和（3）所述环氧树脂的潜在性固化剂，其包含加成物 通过使（a）多官能环氧化合物与（b）在选自OH，SH，COOH和CONHNH 2的分子中具有至少一个官能团的化合物与叔氨基反应，或通过使所述 组分（a）和（b）与（c）在分子中具有多于两个活性氢原子的有机化合物，所述反应在（a）至（b）或（a）与（ b）和（c）各组分（b）和（b）和（c）中每一当量总活性氢原子的（a）的0.8至2.5当量，（c）与（b） ）为0.2:1至1:1，所述加成产物的软化点为60-180℃。

公开(公告)号：US4636832A

公开(公告)日：1987-01-13

申请号：US837663

申请日：1986-03-04

Applicant: Masahiro Abe ,  Masaharu Aoyama ,  Takashi Ajima ,  Toshio Yonezawa

Inventor： Masahiro Abe ,  Masaharu Aoyama ,  Takashi Ajima ,  Toshio Yonezawa

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/14

CPC classification number: H01L24/85 ,  H01L23/5329 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/19043 ,  H01L2924/20752

Abstract: A semiconductor device with a bonding section comprising a semiconductor substrate, a silicon layer formed on the semiconductor substrate with a first insulating layer interposed therebetween, and a bonding pad formed on the silicon layer with a second insulating layer interposed therebetween. The silicon layer has substantially the same size as the bonding pad. When a lead line is bonded to the bonding pad, the silicon layer lessens the stress caused by the bonding.

Abstract translation: 一种具有接合部分的半导体器件，包括半导体衬底，在半导体衬底上形成有第一绝缘层的硅层，以及形成在硅层上并具有介于其间的第二绝缘层的接合焊盘。 硅层具有与焊盘大致相同的尺寸。 当引线与接合焊盘接合时，硅层减小由接合引起的应力。

公开(公告)号：US4610079A

公开(公告)日：1986-09-09

申请号：US705844

申请日：1985-02-26

Applicant: Masahiro Abe ,  Masafumi Miyagawa ,  Hatsuo Nakamura ,  Toshio Yonezawa

Inventor： Masahiro Abe ,  Masafumi Miyagawa ,  Hatsuo Nakamura ,  Toshio Yonezawa

IPC: H01L21/301 ,  H01L21/304

CPC classification number: H01L21/3043 ,  Y10S148/028 ,  Y10T225/12 ,  Y10T29/4979 ,  Y10T29/49792

Abstract: A method of dicing a semiconductor wafer in which a physical discontinuity is formed on the surface of the wafer on both sides of a dicing line to limit the spreading of cracks and chips generated during dicing. Thereafter, the semiconductor wafer is diced to separate the pellets.

Abstract translation: 一种切割半导体晶片的方法，其中在切割线两侧的晶片表面上形成物理不连续，以限制在切割期间产生的裂纹和碎片的扩展。 此后，切割半导体晶片以分离颗粒。

公开(公告)号：US4542202A

公开(公告)日：1985-09-17

申请号：US532901

申请日：1983-09-16

Applicant: Koji Takeuchi ,  Masahiro Abe ,  Nobuo Ito ,  Kiyomiki Hirai

Inventor： Koji Takeuchi ,  Masahiro Abe ,  Nobuo Ito ,  Kiyomiki Hirai

IPC: C08G59/18 ,  C08G59/40 ,  C08G59/52 ,  C08G59/64 ,  C08G59/66

CPC classification number: C08G59/18 ,  C08G59/182 ,  C08G59/4035 ,  C08G59/52 ,  C08G59/64 ,  C08G59/66

Abstract: An addition product obtained by reacting (a) a polyfunctional epoxy compound and (b) a compound having at least one functional group of OH group, SH group, COOH group and CONHNH.sub.2 group together with a tertiary amino group in the molecule, and an addition product obtained (a), (b) and (c) an organic compound having two or more active hydrogen atoms in the molecule (excluding a compound having an epoxy group or tertiary amino group) are good curing agents for epxoy resin. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.

Abstract translation: 通过使（a）多官能性环氧化合物与（b）具有至少一个OH基，SH基，COOH基和CONHNH 2官能团的化合物与分子中的叔氨基一起反应而得到的加成产物， 得到的（a），（b）和（c）分子中具有两个以上活性氢原子的有机化合物（不包括具有环氧基或叔氨基的化合物）的产物是epxoy树脂的良好固化剂。 固化剂可用于配制新型可储存的单组分，可热固化的环氧树脂基组合物。

公开(公告)号：US4465830A

公开(公告)日：1984-08-14

申请号：US537328

申请日：1983-10-03

Applicant: Koji Takeuchi ,  Nobuo Ito ,  Masahiro Abe ,  Kiyomiki Hirai

Inventor： Koji Takeuchi ,  Nobuo Ito ,  Masahiro Abe ,  Kiyomiki Hirai

IPC: C07D233/72 ,  C07D233/74 ,  C07D233/76 ,  C08G59/54 ,  C08G59/44

CPC classification number: C08G59/54 ,  C07D233/74 ,  C07D233/76

Abstract: Hydrazides of the formula ##STR1## are good curing agents for epoxy resin, in the formula R.sub.1 and R.sub.2 being each hydrogen atom, C.sub.1 -C.sub.8 alkyl radical or --CH.sub.2 CH.sub.2 SCH.sub.3, R being hydrogen atom or methyl radical. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resins-based compositions.

Abstract translation: 式“IMAGE”的酰肼是环氧树脂的良好固化剂，式R1和R2各自为氢原子，C1-C8烷基或-CH2CH2SCH3，R为氢原子或甲基。 固化剂可用于配制新型可储存的单组分，可热固化的环氧树脂基组合物。