公开(公告)号：US20220349551A1

公开(公告)日：2022-11-03

申请号：US17864018

申请日：2022-07-13

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  G02B19/00 ,  G02B3/00 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255

Abstract: A light-emitting device includes: a substrate comprising a base; a semiconductor laser element disposed on an upper surface of the base; a sealing member located above the base and fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens member fixed to the sealing member by adhesive, the lens member comprising a lens section through which light emitted from the semiconductor laser element passes. A space between the sealing member and the lens member is open to an area outside the light-emitting device.

公开(公告)号：US20220231484A1

公开(公告)日：2022-07-21

申请号：US17580551

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Toshiya IGATA ,  Eiichiro OKAHISA ,  Takeshi IMAI

IPC: H01S5/40

Abstract: A light emitting device includes: a base having a mounting face including a disposition region, a plurality of first wirings, and a plurality of second wirings; a plurality of light emitting elements, including one or more first light emitting elements, one or more second light emitting elements, and one or more third light emitting elements, disposed in two rows and N columns (N≥2) in the disposition region; one or more relay members, including one or more first relay members disposed in the region between the two rows of the light emitting elements; a plurality of first light emitting element wirings for electrically serially connecting the one or more first light emitting elements; a plurality of second light emitting element wirings for electrically serially connecting the one or more second light emitting elements; and a plurality of third light emitting element wirings for electrically serially connecting the one or more third light emitting elements. The first light emitting element wirings include wirings that are connected with the one or more first relay members.

公开(公告)号：US20210180766A1

公开(公告)日：2021-06-17

申请号：US17185640

申请日：2021-02-25

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  G02B19/00 ,  G02B3/00 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements disposed in a row direction and in a column direction on an upper surface of the base; a plurality of pairs of wires that penetrate the side wall in the row direction; and a lens array fixed to the substrate, the lens array comprising a plurality of lens sections disposed in the row direction and in the column direction above the plurality of semiconductor laser elements. Each laser beam that is emitted from the semiconductor laser elements and is incident on a light incident surface of the lens array has a beam shape with a greater width in the column direction than in the row direction.

公开(公告)号：US20190203908A1

公开(公告)日：2019-07-04

申请号：US16297415

申请日：2019-03-08

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  H01S5/40 ,  G02B3/00 ,  F21V5/04 ,  H01S5/00 ,  G02B19/00

CPC classification number: F21V5/007 ,  F21V5/04 ,  G02B3/0056 ,  G02B19/0057 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/4018 ,  H01S5/4025 ,  H01S5/405

Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

公开(公告)号：US20180183205A1

公开(公告)日：2018-06-28

申请号：US15854528

申请日：2017-12-26

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: H01S5/022 ,  H01S5/40 ,  B23K1/00

CPC classification number: H01S5/02272 ,  B23K1/0016 ,  H01S5/02292 ,  H01S5/4025 ,  H01S5/4031

Abstract: A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials.

公开(公告)号：US20180058645A1

公开(公告)日：2018-03-01

申请号：US15690038

申请日：2017-08-29

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Eiichiro OKAHISA

IPC: F21K9/64 ,  F21V5/00 ,  F21V9/16 ,  F21V31/00

CPC classification number: F21K9/64 ,  F21S41/16 ,  F21S41/176 ,  F21S41/285 ,  F21S41/43 ,  F21V5/008 ,  F21V5/02 ,  F21V9/30 ,  F21V11/08 ,  F21V31/005 ,  F21Y2115/30 ,  G02B19/0052 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/32341

Abstract: A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member. The light shielding member includes a protruded portion extending downward to a position that is lower than an upper end of the first optical member so as to face the exit-side lateral face of the first optical member.

公开(公告)号：US20170338628A1

公开(公告)日：2017-11-23

申请号：US15598182

申请日：2017-05-17

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Shigeru MATSUSHITA ,  Katsuya NAKAZAWA ,  Eiichiro OKAHISA ,  Kazuma KOZURU

IPC: H01S5/40 ,  H01S5/022 ,  H01S5/00 ,  H01S5/30 ,  H01S5/024

CPC classification number: H01S5/022 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/644 ,  H01S5/02216 ,  H01S5/02256 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02469 ,  H01S5/3013 ,  H01S5/4025

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

公开(公告)号：US20170030559A1

公开(公告)日：2017-02-02

申请号：US15221062

申请日：2016-07-27

Applicant: NICHIA CORPORATION

Inventor： Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V17/10 ,  F21V7/00 ,  F21V31/00 ,  F21K9/90

CPC classification number: F21V17/101 ,  F21K9/90 ,  F21V7/0083 ,  F21V15/01 ,  F21V29/00 ,  F21V31/005 ,  F21Y2105/00 ,  F21Y2115/30

Abstract: A light emitting device includes a base having a supporting part and a frame part disposed on an upper surface of the supporting part; a light emitting element mounted on the upper surface of the supporting part at a location interior of the frame part; a cover body fixed to an upper surface of the frame part and defining an opening at a location interior of the frame part in a top view; and a light-transmissive body covering the at least one opening. The cover body includes: a first portion disposed on the upper surface of the frame part, a second portion extending inward from the first portion and then bending and extending upward or downward so as to be spaced from an inner lateral surface of the frame part or a plane that includes an inner lateral surface of the frame part, and a third portion connected to the second portion and defining the opening.

Abstract translation: 发光装置包括具有支撑部的底座和设置在支撑部的上表面上的框架部; 发光元件，其安装在所述框架部的内部的所述支撑部的上表面上; 盖体固定在框架部分的上表面并且在俯视图中在框架部分的内部的位置处限定开口; 以及覆盖所述至少一个开口的透光体。 盖体包括：第一部分，设置在框架部分的上表面上，第二部分从第一部分向内延伸，然后弯曲并向上或向下延伸，以与框架部分的内侧表面间隔开，或 包括框架部分的内侧表面的平面和连接到第二部分并限定开口的第三部分。