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公开(公告)号：US09978734B2
公开(公告)日：2018-05-22
申请号：US15114118
申请日：2015-01-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Alexander Linkov , Britta Göötz , Georg Dirscherl
CPC classification number: H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.
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22.发明申请公开(公告)号：US20160351550A1
公开(公告)日：2016-12-01
申请号：US15114118
申请日：2015-01-26
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Matthias Sabathil , Alexander Linkov , Britta Göötz , Georg Dirscherl
IPC: H01L25/16 , H01L31/173 , H01L25/00 , H01L33/50 , H01L33/56
CPC classification number: H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.
Abstract translation: 发光装置包括发射半导体芯片，其在操作期间至少从主发射表面发射初级辐射，吸收主辐射的一部分并发射次级辐射的第一转换元件以及导致 对于一次辐射的一部分的方向改变，其中第一转换元件沿着与发射辐射的半导体芯片相邻的横向方向布置，偏转元件将主辐射的一部分引导到第一转换元件上，并且发光 在操作中的布置发射包括初级辐射和次级辐射的混合光。
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公开(公告)号：US09484508B2
公开(公告)日：2016-11-01
申请号：US14430539
申请日：2013-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Georg Dirscherl , Walter Wegleiter , Caroline Cassignol , Karl Weidner
CPC classification number: H01L33/56 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
Abstract translation: 本发明涉及一种具有载体元件（1）的光电子半导体元件，其上布置有具有至少一个有源层的光电子半导体芯片（2），其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片（2）被包含聚对二甲苯的保护层（3）覆盖。
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公开(公告)号：US20160155891A1
公开(公告)日：2016-06-02
申请号：US14900243
申请日：2014-06-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Ion Stoll , Thomas Schwarz , Markus Richter , Georg Dirscherl
CPC classification number: H01L33/005 , H01L24/24 , H01L25/167 , H01L27/15 , H01L33/44 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip embedded in a molded body such that an upper side of the optoelectronic semiconductor chip is at least partially not covered by the molded body, wherein a first metallization is arranged on an upper side of the molded body, wherein the first metallization is electrically insulated from the optoelectronic semiconductor chip, and a first material is arranged on the first metallization.
Abstract translation: 光电子部件包括嵌入到成型体中的光电半导体芯片，使得光电子半导体芯片的上侧至少部分地不被成型体覆盖，其中第一金属化被布置在成型体的上侧，其中 第一金属化与光电子半导体芯片电绝缘，并且第一材料布置在第一金属化上。
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