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公开(公告)号：US20080042250A1
公开(公告)日：2008-02-21
申请号：US11506472
申请日：2006-08-18
IPC分类号： H01L23/02
CPC分类号： H01L23/66 , H01L25/105 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/09701 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.
摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。
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22.发明授权公开(公告)号：US07332799B2
公开(公告)日：2008-02-19
申请号：US11319961
申请日：2005-12-28
申请人： Ronald Green
发明人： Ronald Green
CPC分类号： H01L23/50 , H01L23/66 , H01L24/48 , H01L2223/6622 , H01L2223/6627 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/1903 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together functioning as a capacitor. In a particular embodiment, the laterally adjacent traces provide shunt capacitance to compensate for an inductance in a signal path to the chip which includes the signal-bearing conductive trace. In a variation thereof, a transmission line or waveguide is provided which includes the signal-bearing conductive trace and reference trace. In further variations, transmission lines are provided which include one or more metal layers of a package element, separated from each other by a thickness of a dielectric element included in the package element or the air gap between the package and a circuit panel.
摘要翻译： 提供了一种封装芯片，其包括封装元件，信号承载导电迹线在该封装元件上具有与电介质元件的同一面上的参考导电迹线（例如，接地迹线）的边缘横向相邻的边缘，两个迹线在一起 用作电容器。 在特定实施例中，横向相邻迹线提供并联电容以补偿包括信号承载导电迹线的芯片的信号路径中的电感。 在其变型中，提供了包括信号承载导电迹线和参考迹线的传输线或波导。 在另外的变型中，提供传输线，其包括一个或多个封装元件的金属层，它们彼此隔开包含在封装元件中的电介质元件的厚度或封装元件与电路板之间的气隙。
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公开(公告)号：US20070074349A1
公开(公告)日：2007-04-05
申请号：US11606612
申请日：2006-11-30
申请人： Ronald Green
发明人： Ronald Green
IPC分类号： A47C27/00
CPC分类号： A47C15/004 , A47C7/021 , A47C16/04
摘要： Mediation sitting cushions and mats allow the user to meditate in comfort for great lengths of time, avoiding stress and pain often caused by traditional meditation cushions and mats. The layered mediation sitting cushions and mats combine a slow recovery visco-elastic foam (“VEF”), having load deformation properties and densities, with one or more base layers of a batting support. The sitting cushions and mats enable a person seated in traditional meditative positions to achieve a comfortable posture, regardless of the meditator's size or weight. The sitting cushions and mats also allow people to meditate in traditional cross-legged or kneeling postures comfortably, without irritation or pain. The mediation sitting cushions and mats also maintain of the pelvis in a neutral or slightly anterior position, resulting in proper alignment of the pelvis and spine, which minimizes the muscular and ligamentous strain caused by sitting in stillness for long periods of time.
摘要翻译： 调音座垫和垫子允许使用者在很长一段时间内舒适地冥想，避免经常由传统冥想垫子和垫子引起的压力和痛苦。 坐垫和垫子的分层调解将具有负载变形性能和密度的缓慢恢复的粘弹性泡沫（“VEF”）与一个或多个击球支架的基层组合。 坐垫和垫子使坐在传统冥想位置的人能够实现舒适的姿势，而不管冥想者的大小或重量如何。 坐垫和垫子还允许人们舒适地坐在传统的腿部或跪姿中，没有刺激或疼痛。 坐在坐垫和垫子上的调停也将骨盆保持在中立或稍微向前的位置，导致骨盆和脊柱的适当对准，从而最大限度地减少长时间坐在静息中引起的肌肉和韧带。
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公开(公告)号：US20050258529A1
公开(公告)日：2005-11-24
申请号：US11023826
申请日：2004-12-28
申请人： Ronald Green , David Tuckerman , Ron Barnett
发明人： Ronald Green , David Tuckerman , Ron Barnett
IPC分类号： H01L23/02 , H01L23/14 , H01L23/48 , H01L23/492 , H01L23/538 , H01L23/66 , H01L25/065 , H01L25/16 , H01L25/18
CPC分类号： H01L25/18 , H01L23/145 , H01L23/4922 , H01L23/5387 , H01L23/66 , H01L25/0657 , H01L25/162 , H01L25/165 , H01L2224/05009 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/01019 , H01L2924/01068 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025
摘要： A microelectronic package is provided in which a first chip having active elements, e.g. amplifying elements, and passive elements, e.g. resistors, capacitors and inductors, is mounted in electrical communication with a microelectronic element having conductive patterns opposing a front face of the first chip. Absorptive material patterns are disposed between the conductive patterns of the microelectronic element and at least some of the passive elements while leaving at least some of the active elements exposed so as to attenuate radio frequency energy propagated by wave between the passive devices and conductive patterns of the microelectronic element. A packaged chip is also provided in which a chip is disposed beneath a package element, the chip having an opening which extends between a front face and a rear face of the chip, a conductor being disposed in the opening which is conductively connected to a conductive element of the package element.
摘要翻译： 提供一种微电子封装，其中具有有源元件的第一芯片，例如， 放大元件和无源元件，例如 电阻器，电容器和电感器安装成与具有与第一芯片的前表面相对的导电图案的微电子元件电连通。 吸收材料图案设置在微电子元件的导电图案和至少一些无源元件之间，同时使至少一些有源元件暴露，以便衰减由无源器件和无源器件的导电图案之间的波传播的射频能量 微电子元件。 还提供了一种封装芯片，其中芯片设置在封装元件下方，芯片具有在芯片的前表面和后表面之间延伸的开口，导体设置在开口中，该导体导电地连接到导电 包元素的元素。
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公开(公告)号：US5310381A
公开(公告)日：1994-05-10
申请号：US101853
申请日：1993-08-04
申请人： Ronald Green
发明人： Ronald Green
CPC分类号： A47J37/0694
摘要： A campfire skewer consisting of an elongate member having a first end, a second end, a first portion adjacent the first end, and a second portion adjacent the second end. The first portion has a first axis and the second portion is offset from the first axis. The first and has means for impaling food. A hand grip is rotatably mounted on the first portion of the elongate member. By holding the hand grip and manipulating the second portion of the elongate member the elongate member can be made to rotate in a rotisserie-like fashion.
摘要翻译： 由具有第一端，第二端，与第一端相邻的第一部分和与第二端相邻的第二部分的细长构件组成的营火串。 第一部分具有第一轴线，第二部分偏离第一轴线。 第一个并且具有刺激食物的手段。 手柄可旋转地安装在细长构件的第一部分上。 通过握持手柄并操纵细长构件的第二部分，细长构件可以制成为旋转式衣服样旋转。
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公开(公告)号：US4759251A
公开(公告)日：1988-07-26
申请号：US054535
申请日：1987-05-27
申请人： Rocco A. Giglio , John Plank , Frank Willard , Ronald Green
发明人： Rocco A. Giglio , John Plank , Frank Willard , Ronald Green
IPC分类号： G10D9/04
CPC分类号： G10D9/043
摘要： A split-E mechanism is provided for use on a flute having a right-hand steel, a left-hand steel, a first hinge rotatably mounted on the right-hand steel, a first key coupled to the first hinge, a second hinge rotatably mounted on the left-hand steel, and a second key. The split-E mechanism includes an actuator for actuating the second key in response to rotation of the second hand relative to the left-hand steel. The mechanism also includes a bridge device for interconnecting the first and second hinges for rotating the second hinge in response to actuation of the first key to operate the actuator.
摘要翻译： 提供了一种分裂E机构，用于具有右手钢，左手钢，可旋转地安装在右手钢上的第一铰链，与第一铰链相连的第一键的第二铰链， 安装在左手钢上，第二个键。 分裂E机构包括用于响应于秒针相对于左手钢的旋转来致动第二键的致动器。 该机构还包括用于互连第一和第二铰链以响应于第一键的致动而旋转第二铰链以操作致动器的桥接装置。
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公开(公告)号：US07583165B2
公开(公告)日：2009-09-01
申请号：US11319849
申请日：2005-12-28
申请人： Ronald Green
发明人： Ronald Green
摘要： A cavity resonator is provided which includes a shielded enclosure enclosing a volume and a unitary conductor disposed within the volume, the unitary conductor having a first inductor portion and a transmission line portion. The transmission line portion is included in a transmission line having a reference conductor separated from the transmission line portion by a dielectric element. An active semiconductor device is coupled to the unitary conductor, and is operable to conduct a current to the unitary conductor at a resonant frequency of the unitary conductor.
摘要翻译： 提供一种空腔谐振器，其包括封闭体积的屏蔽外壳和设置在该体积内的整体导体，该单体导体具有第一电感部分和传输线部分。 传输线部分包括在具有通过介电元件与传输线部分分离的参考导体的传输线中。 有源半导体器件耦合到单一导体，并且可操作以以单一导体的谐振频率将电流传导到单一导体。
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公开(公告)号：US07545029B2
公开(公告)日：2009-06-09
申请号：US11506472
申请日：2006-08-18
CPC分类号： H01L23/66 , H01L25/105 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/09701 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.
摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。
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公开(公告)号：US20060284414A1
公开(公告)日：2006-12-21
申请号：US11377937
申请日：2006-03-16
申请人： Ronald Green , William Turnau , Joseph Schutte , David Malone , Michael Andre
发明人： Ronald Green , William Turnau , Joseph Schutte , David Malone , Michael Andre
IPC分类号： F16L35/00
CPC分类号： F16L37/091 , E03C1/021 , F16L37/144 , Y10T137/598
摘要： A stub-out assembly includes a stub-out conduit that defines a major diameter and a minor diameter. The minor diameter defines an attachment groove for receipt of a mount housing and a valve housing. The mount housing includes a multitude of circumferential fingers which each include a barbed end that engage a corresponding internal groove within the valve housing of the valve assembly. The mount housing fits over the minor diameter and a retainer in the mount housing is aligned with the attachment groove. The retainer includes a partially annular set of conduit attachment legs and a set of housing attachment legs. The conduit attachment legs engage the attachment groove to axially retain the conduit therein. The housing attachment legs each include a barbed end which engage a corresponding surface located within the slot.
摘要翻译： 排出组件包括限定大直径和小直径的排出管道。 小直径限定用于接收安装壳体和阀壳体的附接凹槽。 安装壳体包括多个圆周指状物，每个圆周指状物包括与阀组件的阀壳体内的相应内部凹槽接合的倒钩端。 安装壳体适合于小直径，并且安装壳体中的保持器与附接槽对准。 保持器包括部分环形的导管附接支腿和一组壳体附接支腿。 导管附接支腿接合连接槽以将导管轴向保持在其中。 壳体附接腿各自包括与位于槽内的对应表面接合的倒钩端。
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公开(公告)号：US20060248349A1
公开(公告)日：2006-11-02
申请号：US11447177
申请日：2006-06-06
申请人： Alicemarie Rathjen , Jacquelyn Appell Wheeler , Jack Strauss , Alex Fordyce , John Harding , Lois Harding , William Kimmerly , Ronald Green , Xavier Thomas , Keith Dieterich
发明人： Alicemarie Rathjen , Jacquelyn Appell Wheeler , Jack Strauss , Alex Fordyce , John Harding , Lois Harding , William Kimmerly , Ronald Green , Xavier Thomas , Keith Dieterich
IPC分类号： H04K1/00
摘要： Method and system for preparing a personal genetic profile includes collecting genetic data from an individual, assigning the data to a coordinate system, storing the data, and providing access for retrieval by the individual from whom the genetic data were collected, after receipt of an Identifier that adequately authenticates the identity of the data requestor. Locations of genetic markers are provided as three-dimensional coordinates, described with matrix relationships that are consistent with the primary and secondary chemical structure of molecular constituents of a DNA chain for the individual.
摘要翻译： 用于准备个人遗传图谱的方法和系统包括从个体收集遗传数据，将数据分配给坐标系统，存储数据，以及在收到遗传数据的个体之后，在收到标识符 充分认证数据请求者的身份。 提供遗传标记的位置作为三维坐标，用与个体的DNA链的分子组分的一级和二级化学结构一致的矩阵关系描述。
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