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    Stacked microelectronic assemblies and methods therefor
    1.
    发明申请
    Stacked microelectronic assemblies and methods therefor 有权
    堆叠的微电子组件及其方法

    公开(公告)号：US20080042250A1

    公开(公告)日：2008-02-21

    申请号：US11506472

    申请日：2006-08-18

    申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

    发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

    IPC分类号： H01L23/02

    CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

    摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

    Stack microelectronic assemblies
    2.
    发明授权
    Stack microelectronic assemblies 有权
    堆叠微电子组件

    公开(公告)号：US07545029B2

    公开(公告)日：2009-06-09

    申请号：US11506472

    申请日：2006-08-18

    申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

    发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

    IPC分类号： H01L23/02 ,  H05K7/00 ,  H01L21/00

    CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

    摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

    Assembly including vertical and horizontal joined circuit panels
    5.
    发明授权
    Assembly including vertical and horizontal joined circuit panels 有权
    组装包括垂直和水平连接电路板

    公开(公告)号：US07489524B2

    公开(公告)日：2009-02-10

    申请号：US11143201

    申请日：2005-06-02

    申请人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    发明人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    IPC分类号： H05K1/11

    CPC分类号： H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

    摘要： An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    摘要翻译： 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

    Meditation support
    6.
    发明授权
    Meditation support 有权

    公开(公告)号：US09668584B2

    公开(公告)日：2017-06-06

    申请号：US11606612

    申请日：2006-11-30

    申请人： Ronald Green

    发明人： Ronald Green

    IPC分类号： A47C16/04 ,  A47C15/00 ,  A47C7/02

    CPC分类号： A47C15/004 ,  A47C7/021 ,  A47C16/04

    摘要： Mediation sitting cushions and mats allow the user to meditate in comfort for great lengths of time, avoiding stress and pain often caused by traditional meditation cushions and mats. The layered mediation sitting cushions and mats combine a slow recovery visco-elastic foam (“VEF”), having load deformation properties and densities, with one or more base layers of a batting support. The sitting cushions and mats enable a person seated in traditional meditative positions to achieve a comfortable posture, regardless of the meditator's size or weight. The sitting cushions and mats also allow people to meditate in traditional cross-legged or kneeling postures comfortably, without irritation or pain. The mediation sitting cushions and mats also maintain of the pelvis in a neutral or slightly anterior position, resulting in proper alignment of the pelvis and spine, which minimizes the muscular and ligamentous strain caused by sitting in stillness for long periods of time.

    Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor
    7.
    发明授权
    Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor 有权
    具有具有与信号导体相对的凹部的参考导体的低损耗RF传输线

    公开(公告)号：US07855623B2

    公开(公告)日：2010-12-21

    申请号：US11821540

    申请日：2007-06-22

    申请人： Ronald Green ,  Belgacem Haba ,  David William Wallis ,  Nicholas J. Colella

    发明人： Ronald Green ,  Belgacem Haba ,  David William Wallis ,  Nicholas J. Colella

    IPC分类号： H01P3/08

    CPC分类号： H01P3/085 ,  H01P1/184 ,  H01P1/20372 ,  H01P5/16 ,  H01P11/00 ,  H05K1/0219 ,  H05K1/024 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/4913

    摘要： A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.

    摘要翻译： 具有高传播速度和低有效介电损耗的传输结构。 该结构包括电介质，布置在电介质下方的第一参考导体，布置在电介质上方的信号导体和设置在信号导体上的第二参考导体。 第二参考导体具有面向信号导体的凹部，凹部限定第二参考导体和信号导体之间的间隙。 间隙可以填充有大约相当于1（1）的相对介电常数的空气。 由于间隙的物理和介电常数特性，该结构集中在间隙中的电场，导致大约（接近）一（1）的有效介电常数和大约等于零（0）的有效介电损耗。 因此，该结构表现出大致等于光速的传播速度。

    RF power-control circuit
    8.
    发明授权
    RF power-control circuit 失效
    射频功率控制电路

    公开(公告)号：US5003270A

    公开(公告)日：1991-03-26

    申请号：US336816

    申请日：1989-04-12

    申请人： Russell Braathen ,  Ronald Green

    发明人： Russell Braathen ,  Ronald Green

    IPC分类号： H03G1/04 ,  H03G3/20

    CPC分类号： H03G3/3042 ,  H03G1/04

    摘要： An improved circuit for controlling the output power level of a radio frequency (RF) amplifier is disclosed. The circuit samples the output of an RF amplifier. The sample is amplitude modulated at a preselected modulation frequency and is passed to a detector. In repsonse to the amplitude modulated signal, the detector produces a signal whose amplitude is indicative of the RF amplifier's output power and whose frequency is the modulation frequency. The amplitude of the signal produced by the detector is then compared to a reference amplitude and the difference (error signal) is used to control the gain of the RF amplifier.

    摘要翻译： 公开了一种用于控制射频（RF）放大器的输出功率电平的改进电路。 电路对RF放大器的输出进行采样。 样本以预选的调制频率进行幅度调制，并被传送到检测器。 在响应于幅度调制信号的情况下，检测器产生一个信号，其幅度表示RF放大器的输出功率，其频率是调制频率。 然后将由检测器产生的信号的幅度与参考幅度进行比较，差值（误差信号）用于控制RF放大器的增益。

    RF power-control circuit
    9.
    发明授权
    RF power-control circuit 失效
    射频功率控制电路

    公开(公告)号：US4952886A

    公开(公告)日：1990-08-28

    申请号：US208411

    申请日：1988-06-17

    申请人： Russell Braathen ,  Ronald Green

    发明人： Russell Braathen ,  Ronald Green

    IPC分类号： H03F1/30 ,  H03G1/04 ,  H03G3/20 ,  H03G3/30

    CPC分类号： H03G1/04 ,  H03G3/3042

    摘要： An improved circuit for controlling the output power level of a radio frequency (RF) amplifier is disclosed. The circuit samples the output of an RF amplifier. The sample is amplitude modulated at a preselected modulation frequency and is passed to a detector. In response to the amplitude modulated signal, the detector produces a signal whose amplitude is indicative of the RF amplifier's output power and whose frequency is the modulation frequency. The amplitude of the signal produced by the detector is then compared to a reference amplitude and the difference (error signal) is used to control the gain of the RF amplifier.

    Bingo indicator
    10.
    发明授权
    Bingo indicator 失效
    宾果指示器

    公开(公告)号：US4572510A

    公开(公告)日：1986-02-25

    申请号：US670215

    申请日：1984-11-07

    申请人： Ronald Green

    发明人： Ronald Green

    IPC分类号： A63F3/06 ,  G09F21/02

    CPC分类号： G09F21/02 ,  A63F3/06

    摘要： A vertically elongated, hollow and lightweight housing including top and bottom walls and a plurality of interconnected sidewall portions extending between and connecting the top and bottom walls is provided. At least one of the sidewall portions has indicia thereon indicating a winning bingo game situation and the bottom wall includes a central opening formed therein about which a depending tubular neck integral with the bottom wall is disposed. An elongated wand is also provided including upper and lower ends and a mid-length portion extending between and connecting the upper and lower ends. The wand is slidingly telescopingly received through the neck and the upper and lower ends are slightly diametrically enlarged in relation to the mid-length portion of the wand. The upper and lower ends are tightly slidingly receivable through the neck and the mid-length portion of the wand is freely slidable through the neck. The lower end of the wand includes a diametrical enlargement thereon of greater transverse dimension than the outside diameter of the neck and the length of the wand is such that the upper end face thereof abuts against the inner surface of the top wall of the housing when the enlargement is in close juxtaposition with the lower end of the neck.

    摘要翻译： 提供了一种垂直细长的，中空且轻质的壳体，其包括顶壁和底壁以及在顶壁和底壁之间延伸并连接顶壁和底壁之间的多个相互连接的侧壁部分。 侧壁部分中的至少一个在其上具有指示胜利的宾果游戏状况的标记，并且底壁包括形成在其中的中心开口，与底壁一体形成的垂直管状颈部沿着该开口设置。 还设置有细长的棒，其包括上端和下端以及在其上端和下端之间延伸并连接的中长度部分。 魔杖通过颈部滑动地伸缩，并且上端和下端相对于魔杖的中长部分略微径向扩大。 上端和下端可以通过颈部紧紧滑动地接收，并且魔杖的中长部分可以通过颈部自由滑动。 棒的下端包括比颈部的外径更大的横向尺寸的直径扩大，并且杆的长度使得其上端面抵靠壳体的顶壁的内表面抵靠壳体的顶壁的内表面 扩大与颈部下端紧密并列。