公开(公告)号：US12051681B2

公开(公告)日：2024-07-30

申请号：US17374868

申请日：2021-07-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS (ALPS) SAS

Inventor： Deborah Cogoni ,  David Auchere ,  Laurent Schwartz ,  Claire Laporte

IPC: H01L25/16 ,  H01G4/38

CPC classification number: H01L25/165 ,  H01G4/385

Abstract: A device for regulating a voltage of an electric current supplying an integrated circuit resting on a substrate. The integrated circuit comprises a ground terminal and a power supply terminal able to receive the electric current. The regulation device comprises a first cover covering the integrated circuit, a second cover covering the integrated circuit. The first cover is electrically connected to the power supply terminal of the integrated circuit. The second cover is electrically connected to the ground terminal of the integrated circuit. The first cover and the second cover are connected together by a capacitive connection.

公开(公告)号：US11557566B2

公开(公告)日：2023-01-17

申请号：US16835793

申请日：2020-03-31

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/552

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US10897822B2

公开(公告)日：2021-01-19

申请号：US16815554

申请日：2020-03-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fabien Quercia ,  David Auchere ,  Norbert Chevrier ,  Fabien Corsat

IPC: H05K1/18 ,  H05K3/34

Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.

公开(公告)号：US10257943B2

公开(公告)日：2019-04-09

申请号：US15926583

申请日：2018-03-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Laurent Marechal

IPC: H05K1/18 ,  H05K3/42 ,  H01L23/64 ,  H01L23/498

Abstract: An electronic device includes a substrate having an external surface, and an integrated circuit over the external surface of the substrate. The substrate is provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links include an impedance-compensating inductor on an external surface of the substrate.

公开(公告)号：US20170338543A1

公开(公告)日：2017-11-23

申请号：US15668816

申请日：2017-08-04

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L21/3105 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

公开(公告)号：US09748159B2

公开(公告)日：2017-08-29

申请号：US15050289

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： Yvon Imbs ,  Laurent Schwarz ,  David Auchere ,  Laurent Marechal

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/3121 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73257 ,  H01L2224/8538 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

公开(公告)号：US20170092557A1

公开(公告)日：2017-03-30

申请号：US15050289

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： Yvon Imbs ,  Laurent Schwarz ,  David Auchere ,  Laurent Marechal

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/768 ,  H01L23/66 ,  H01L21/3105 ,  H01L21/56 ,  H01L23/498 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73257 ,  H01L2224/8538 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

公开(公告)号：US20170062299A1

公开(公告)日：2017-03-02

申请号：US15050253

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/3105 ,  H01L23/66 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L21/3105 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

Abstract translation: 电子设备包括具有安装面和电连接网络的支撑板。 集成电路芯片安装在安装面上并连接到电气连接网络。 封装块嵌入集成电路芯片。 由导电材料制成的附加元件至少部分地嵌入在封装块内。 附加导电元件具有平行于支撑板延伸的主要部分，并具有与集成电路芯片电连接的次级部分。 在密封块中形成开口，并且次级部分延伸到该开口中以形成电连接。 附加导电元件可以是天线。