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21.发明授权公开(公告)号：US09096424B2
公开(公告)日：2015-08-04
申请号：US14312307
申请日：2014-06-23
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
IPC: H04R25/00 , B81C1/00 , B81B7/00 , H04R1/28 , H04R19/00 , H04R19/04 , B81B3/00 , H04R1/04 , H04R1/06 , H04R1/08
CPC classification number: B81C1/00158 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48479 , H01L2924/00014 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/06 , H04R1/086 , H04R1/2838 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2224/48471 , H01L2224/4554 , H01L2924/00012
Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.
Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。
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22.发明申请公开(公告)号：US20130334627A1
公开(公告)日：2013-12-19
申请号：US13916416
申请日：2013-06-12
Inventor： Sebastiano Conti , Benedetto Vigna
CPC classification number: B81B3/0021 , B81C1/00158 , H01L2224/48091 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H01L2924/00014
Abstract: Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.
Abstract translation: 这里描述的是一种半导体集成器件组件，其设想为：限定内部空间的封装; 包括半导体材料的第一裸片; 以及与第一模具不同的第二模具，还包括半导体材料; 第一模具和第二模具耦合到面向内部空间的封装的内表面。 第二模具成形为使得第一模具在内表面上部分地以悬臂方式悬挂在第一模具上方的部分重叠距离。
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公开(公告)号：US11353503B2
公开(公告)日：2022-06-07
申请号：US16451660
申请日：2019-06-25
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Paolo Aranzulla , Fabiano Frigoli , Massimo Greppi , Marco Camerani , Sebastiano Conti , Guglielmo Roccasalvo , Enrico Rosario Alessi , Massimiliano Pesaturo
Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.
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24.发明授权公开(公告)号：US11254561B2
公开(公告)日：2022-02-22
申请号：US16730480
申请日：2019-12-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Bruno Murari , Sebastiano Conti
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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公开(公告)号：US10962431B2
公开(公告)日：2021-03-30
申请号：US16220498
申请日：2018-12-14
Applicant: STMicroelectronics S.R.L.
Inventor： Enri Duqi , Sebastiano Conti , Sonia Costantini
Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.
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Patent Agency Ranking
公开(公告)号：US10101578B2
公开(公告)日：2018-10-16
申请号：US15368184
申请日：2016-12-02
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Carminati , Enri Duqi , Sebastiano Conti
Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.
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27.发明授权公开(公告)号：US09914639B2
公开(公告)日：2018-03-13
申请号：US15074755
申请日：2016-03-18
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Sebastiano Conti
CPC classification number: B81B7/0054 , B81B3/0051 , B81B7/0048 , B81B7/008 , B81B2201/0264 , B81C1/00325 , H01L2224/48091 , H01L2924/00014
Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
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公开(公告)号：US09843868B2
公开(公告)日：2017-12-12
申请号：US15017514
申请日：2016-02-05
Applicant: Omron Corporation , STMICROELECTRONICS S.R.L.
Inventor： Takashi Kasai , Shobu Sato , Yuki Uchida , Igino Padovani , Filippo David , Sebastiano Conti
CPC classification number: H04R19/04 , B81B3/0021 , H04R1/023 , H04R1/086 , H04R3/00 , H04R3/005 , H04R19/005 , H04R19/016 , H04R31/00 , H04R2201/003 , H04R2499/11
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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公开(公告)号：US09540229B2
公开(公告)日：2017-01-10
申请号：US14962945
申请日：2015-12-08
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giuseppe Bruno , Sebastiano Conti , Mario Chiricosta , Michele Vaiana , Calogero Marco Ippolito , Mario Maiore , Daniele Casella
IPC: B81B7/00
CPC classification number: B81B7/007 , B81B7/02 , B81B2201/0264 , B81B2201/0292 , B81B2207/094 , G01L19/0092 , G01N27/223 , H01L23/3121 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.
Abstract translation: 包装传感器组件包括：具有至少一个开口的包装结构; 湿度传感器和压力传感器，其容纳在包装结构内并通过开口与外部流体连通;以及控制电路，可操作地耦合到湿度传感器和压力传感器; 其中所述湿度传感器和所述控制电路集成在第一芯片中，并且所述压力传感器集成在与所述第一芯片不同的第二芯片中并且被结合到所述第一芯片。
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30.发明申请PRESSURE SENSOR GENERATING A TRANSDUCED SIGNAL WITH REDUCED AMBIENT TEMPERATURE DEPENDENCE, AND MANUFACTURING METHOD THEREOF 审中-公开压力传感器产生具有降低环境温度依赖性的转换信号及其制造方法公开(公告)号：US20160370242A1
公开(公告)日：2016-12-22
申请号：US14980373
申请日：2015-12-28
Applicant: STMicroelectronics S.R.L.
Inventor： Enri Duqi , Sebastiano Conti , Sonia Costantini
Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.
Abstract translation: 设计用于检测压力传感器外部环境环境压力值的压力传感器包括：第一衬底，其具有掩埋腔和悬挂在掩埋腔上的膜; 具有凹部的第二基板，气密地联接到所述第一基板，使得所述凹部限定其内部压力值提供压力参考值的密封空腔; 以及至少部分地形成在所述第一基板中并且被配置为将所述掩埋腔布置成与所述压力传感器外部的环境连通的通道。 膜作为密封腔中的压力参考值与埋入腔中的环境压力值之间的压力差的函数发生偏转。
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