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    Microfluidic assembly and methods of forming same
    27.
    发明授权
    Microfluidic assembly and methods of forming same 有权

    公开(公告)号：US10357964B2

    公开(公告)日：2019-07-23

    申请号：US15917231

    申请日：2018-03-09

    Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS (MALTA) LTD

    Inventor： Simon Dodd ,  Ivan Ellul ,  Christopher Brincat

    IPC: B41J2/14 ,  B41J2/01 ,  B41J2/045

    Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

    Microfluidic die on a support with at least one other die
    28.
    发明授权
    Microfluidic die on a support with at least one other die 有权

    公开(公告)号：US10118391B2

    公开(公告)日：2018-11-06

    申请号：US15253618

    申请日：2016-08-31

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Simon Dodd

    IPC: B41J2/14

    Abstract: The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.

    Microfluidic system with single drive signal for multiple nozzles
    29.
    发明授权
    Microfluidic system with single drive signal for multiple nozzles 有权
    具有多个喷嘴的单驱动信号的微流体系统

    公开(公告)号：US09358567B2

    公开(公告)日：2016-06-07

    申请号：US14310886

    申请日：2014-06-20

    Applicant: STMicroelectronics, Inc.

    Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

    IPC: B05B17/06 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

    CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

    Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。

    MICROFLUIDIC DELIVERY SYSTEM AND METHOD
    30.
    发明申请
    MICROFLUIDIC DELIVERY SYSTEM AND METHOD 有权
    微流体输送系统及方法

    公开(公告)号：US20160101429A1

    公开(公告)日：2016-04-14

    申请号：US14975200

    申请日：2015-12-18

    Applicant: STMicroelectronics, Inc.

    Inventor： Simon Dodd ,  Joseph Edward Scheffelin ,  Dave S. Hunt ,  Timothy James HOEKSTRA ,  Faiz SHERMAN ,  Stephan Gary Bush

    IPC: B05B9/00 ,  B05B9/03 ,  A61L9/03 ,  B05B1/14

    CPC classification number: A61L9/03 ,  A61L2/00 ,  A61L9/00 ,  B05B17/0684

    Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.

    Abstract translation: 一个或多个实施方案涉及分配流体的微流体递送系统。 微流体递送系统可以以各种方向提供。 在一个实施例中，微流体输送系统是垂直的，使得被排出的流体与重力相反。 在另一个实施方案中，微流体递送系统侧向定向，使得被排出的流体具​​有水平分量。 在另一个实施方案中，微流体递送系统面向下。

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