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101 条记录 (耗时 0.02 秒)

    PMR write with flux choking area
    22.
    发明授权
    PMR write with flux choking area 有权

    公开(公告)号：US08085498B2

    公开(公告)日：2011-12-27

    申请号：US12586249

    申请日：2009-09-17

    申请人： Zhigang Bai ,  Yue Liu ,  Kowang Liu ,  Yan Wu ,  Moris Dovek

    发明人： Zhigang Bai ,  Yue Liu ,  Kowang Liu ,  Yan Wu ,  Moris Dovek

    IPC分类号： G11B5/127

    CPC分类号： G11B5/3116 ,  G11B5/1278 ,  G11B5/3163

    摘要： A PMR writer having a trailing shield structure is disclosed in which a flux choking layer (FCL) formed adjacent to the ABS provides a means to limit the amount of flux flowing from the trailing shield to a first write shield (WS1) near the write pole tip thereby significantly reducing adjacent track erasure. The FCL has a substantially smaller thickness than a top section of the trailing shield to which it is attached along a side opposite the ABS. As a result, pole tip protrusion is reduced compared to prior art PMR writers. The FCL contacts a trailing side of WS1 at the ABS and one or both of the trailing sides of the WS1 and FCL may be tapered or perpendicular with respect to the ABS. The top trailing shield section, FCL, and WS1 may be comprised of NiFe, CoFe, CoFeNi, or alloys thereof.

    Side shielded magnetoresistive(MR) read with perpendicular magnetic free layer
    23.
    发明申请
    Side shielded magnetoresistive(MR) read with perpendicular magnetic free layer 有权
    侧面屏蔽磁阻（MR）用垂直磁性自由层读取

    公开(公告)号：US20110273802A1

    公开(公告)日：2011-11-10

    申请号：US12799924

    申请日：2010-05-05

    申请人： Yuchen Zhou ,  Kunliang Zhang ,  Zhigang Bai

    发明人： Yuchen Zhou ,  Kunliang Zhang ,  Zhigang Bai

    IPC分类号： G11B5/33

    CPC分类号： G11B5/398 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  G01R33/093 ,  G01R33/098 ,  G11B5/3906 ,  G11B5/3909 ,  G11B5/3912 ,  G11B2005/3996 ,  H01F10/30 ,  H01F10/3259 ,  H01F10/3286 ,  H01F10/3295 ,  H01F41/307 ,  H01L43/02 ,  H01L43/08

    摘要： A MR sensor is disclosed that has a free layer (FL) with perpendicular magnetic anisotropy (PMA) which eliminates the need for an adjacent hard bias structure to stabilize free layer magnetization and minimizes shield-FL interactions. In a TMR embodiment, a seed layer, free layer, junction layer, reference layer, and pinning layer are sequentially formed on a bottom shield. After patterning, a conformal insulation layer is formed along the sensor sidewall. Thereafter, a top shield is formed on the insulation layer and includes side shields that are separated from the FL by a narrow read gap. The sensor is scalable to widths

    摘要翻译： 公开了具有垂直磁各向异性（PMA）的自由层（FL）的MR传感器，其不需要相邻的硬偏置结构来稳定自由层磁化并使屏蔽-FL相互作用最小化。 在TMR实施例中，种子层，自由层，结层，参考层和钉扎层依次形成在底部屏蔽上。 在图案化之后，沿传感器侧壁形成保形绝缘层。 此后，在绝缘层上形成顶部屏蔽，并且包括通过狭窄的读取间隙与FL分离的侧面屏蔽。 当PMA大于FL自扫描场时，传感器可缩放到宽度<50 nm。 有效偏置场对传感器纵横比相当不敏感，这使得高条纹和窄宽度传感器成为高RA TMR配置的可行方法。 侧面屏蔽可以延伸到种子层平面以下。

    External field robustness of read/write head shields
    24.
    发明申请
    External field robustness of read/write head shields 有权
    读/写头屏蔽的外部场强鲁棒性

    公开(公告)号：US20110097602A1

    公开(公告)日：2011-04-28

    申请号：US12589598

    申请日：2009-10-26

    申请人： Zhigang Bai ,  Yuchen Zhou ,  Joe Smyth ,  Moris Dovek ,  Yan Wu

    发明人： Zhigang Bai ,  Yuchen Zhou ,  Joe Smyth ,  Moris Dovek ,  Yan Wu

    IPC分类号： G11B5/33 ,  B44C1/22

    CPC分类号： G11B5/1278 ,  G11B5/315 ,  G11B5/6011 ,  Y10T428/1171

    摘要： An improved magnetic shield for a perpendicular magnetic write head is disclosed. Its main feature is a pair of tabs at the shield's bottom corners. Said tabs are significantly wider at their point of attachment to the shield than further away from the shield. The end portions of each tab slope upwards (away from the ABS) at an angle of about ten degrees. A process for manufacturing the shield is also disclosed.

    摘要翻译： 公开了用于垂直磁写头的改进的磁屏蔽。 它的主要特征是盾牌底角上的一对标签。 所述突片在其远离屏蔽件的位置处与屏蔽件的连接点明显更宽。 每个翼片的端部以大约十度的角度向上（远离ABS）倾斜。 还公开了一种用于制造屏蔽的工艺。

    Wrap-around shielded writer with highly homogeneous shield material
    25.
    发明申请
    Wrap-around shielded writer with highly homogeneous shield material 有权
    带有高度均匀的屏蔽材料的环绕屏蔽作者

    公开(公告)号：US20110097601A1

    公开(公告)日：2011-04-28

    申请号：US12589597

    申请日：2009-10-26

    申请人： Zhigang Bai ,  Yan Wu ,  Moris Dovek ,  Cherng Chyi Han

    发明人： Zhigang Bai ,  Yan Wu ,  Moris Dovek ,  Cherng Chyi Han

    IPC分类号： G11B5/33

    CPC分类号： G11B5/6082 ,  G11B5/112 ,  G11B5/1278 ,  G11B5/315 ,  G11B5/3163 ,  Y10T428/1171

    摘要： A perpendicular magnetic recording (PMR) head is fabricated with a main pole shielded laterally by a pair of side shields, shielded above by a trailing shield and shielded optionally below by a leading shield. The shields and the seed layers on which they are formed are formed of materials having substantially the same physical characteristics including the same material composition, the same hardness, the same response to processes such as ion beam etching (IBE), chemical mechanical polishing (CMP), mechanical lapping, such as the slider ABS lapping, the same coefficient of thermal expansion (CTE) as well as the same Bs. Optionally, the trailing shield may be formed on a high Bs seed layer to provide the write head with improved down-track performance.

    摘要翻译： 垂直磁记录（PMR）头被制造成具有由一对侧屏蔽横向屏蔽的主极，屏蔽在后面并由屏蔽罩屏蔽并且被前屏蔽罩屏蔽。 其形成的屏蔽层和种子层由具有相同物理特性的材料形成，包括相同的材料组成，相同的硬度，对离子束蚀刻（IBE），化学机械抛光（CMP） ），机械研磨，如滑块ABS研磨，相同的热膨胀系数（CTE）以及相同的Bs。 可选地，后屏蔽可以形成在高Bs种子层上，以向写头提供改进的下行轨迹性能。

    Cleaning mechanism for semiconductor singulation saws
    26.
    发明授权
    Cleaning mechanism for semiconductor singulation saws 有权
    半导体单片锯清洗机构

    公开(公告)号：US09498898B2

    公开(公告)日：2016-11-22

    申请号：US14555562

    申请日：2014-11-26

    申请人： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    发明人： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    IPC分类号： B28D7/02 ,  H01L21/67 ,  B28D5/02 ,  B28D1/04

    CPC分类号： B28D7/02 ,  B28D1/04 ,  B28D5/022 ,  H01L21/67046 ,  H01L21/67092

    摘要： A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.

    摘要翻译： 清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。 清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料 的锯片。 清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。

    Perpendicular magnetic recording write head
    27.
    发明授权
    Perpendicular magnetic recording write head 有权
    垂直磁记录头

    公开(公告)号：US09478236B1

    公开(公告)日：2016-10-25

    申请号：US13631808

    申请日：2012-09-28

    申请人： Feng Liu ,  Jinqiu Zhang ,  Zhigang Bai ,  Yugang Wang

    发明人： Feng Liu ,  Jinqiu Zhang ,  Zhigang Bai ,  Yugang Wang

    IPC分类号： G11B5/147

    CPC分类号： G11B5/147 ,  G11B5/1278 ,  G11B5/3116

    摘要： A main pole of a perpendicular magnetic recording write head is disclosed with a non-rectangular shape at the air bearing surface and a rectangular shape behind the air bearing surface. The main pole transitions from the non-rectangular shape to a rectangular shape at a distance of 10 nm to 100 nm behind the air bearing surface. The main pole includes leading and trailing beveled surfaces that extend from the non-rectangular shape of the pole at the air bearing surface toward the rectangular shape transition.

    摘要翻译： 公开了一种垂直磁记录写头的主极，在空气轴承表面具有非矩形形状，在空气轴承表面后面呈矩形形状。 主极在空气轴承表面后方10nm到100nm的距离处从非矩形形状转变为矩形。 主杆包括从空气轴承表面上的极的非矩形形状向矩形形状转变延伸的前后倾斜表面。

    Die edge seal employing low-K dielectric material
    28.
    发明授权
    Die edge seal employing low-K dielectric material 有权
    使用低K电介质材料的密封边缘密封

    公开(公告)号：US09406625B2

    公开(公告)日：2016-08-02

    申请号：US14555558

    申请日：2014-11-26

    申请人： Zhijie Wang ,  Zhigang Bai ,  Jiyong Niu ,  Dehong Ye ,  Huchang Zhang

    发明人： Zhijie Wang ,  Zhigang Bai ,  Jiyong Niu ,  Dehong Ye ,  Huchang Zhang

    IPC分类号： H01L23/544 ,  H01L27/118 ,  H01L41/338 ,  H01L23/00 ,  H01L23/58 ,  H01L21/78 ,  H01L21/66

    CPC分类号： H01L23/562 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor wafer has a multi-stage structure that damps and contains nascent cracks generated during dicing and inhibits moisture penetration into the active region of a die. The wafer includes an array of die regions separated by scribe lanes. The die regions include an active region and a first ring that surrounds the active region. A portion of the first ring includes a low-k dielectric material. A second ring includes a stack of alternating layers of metal and interlayer dielectric (ILD) material. A dummy metal region around the rings includes a stacked dummy metal features and surrounds the active region. A regular or irregular staggered arrangement of saw grid process control (SGPC) features reduces mechanical stress during dicing.

    摘要翻译： 半导体晶片具有多级结构，其能够阻止并包含切割期间产生的新生裂纹并且抑制水分渗透到模具的有源区域。 该晶片包括由划线所隔开的芯片区域阵列。 管芯区域包括有源区和围绕有源区的第一环。 第一环的一部分包括低k电介质材料。 第二环包括金属和层间电介质（ILD）材料的交替层叠。 围绕环的虚设金属区域包括堆叠的虚拟金属特征并围绕有源区域。 锯格过程控制（SGPC）特征的规则或不规则交错排列降低了切割时的机械应力。

    CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
    30.
    发明申请
    CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS 有权
    用于半导体谐振器的清洁机构

    公开(公告)号：US20150367529A1

    公开(公告)日：2015-12-24

    申请号：US14555562

    申请日：2014-11-26

    申请人： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    发明人： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    IPC分类号： B28D7/02 ,  B08B1/04 ,  B28D1/04 ,  H01L21/67 ,  B28D5/02

    CPC分类号： B28D7/02 ,  B28D1/04 ,  B28D5/022 ,  H01L21/67046 ,  H01L21/67092

    摘要： A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.

    摘要翻译： 清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。 清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料 的锯片。 清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。