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公开(公告)号：US07842960B2
公开(公告)日：2010-11-30
申请号：US11516533
申请日：2006-09-06
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).
摘要翻译： 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳（40）中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /（m·K）的值。
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公开(公告)号：US20080266858A1
公开(公告)日：2008-10-30
申请号：US12172705
申请日：2008-07-14
CPC分类号： G09F13/22 , F21S4/20 , F21V21/002 , F21Y2115/10 , G09F9/33 , G09F13/0404 , G09F13/0413 , Y10S362/80 , Y10S362/812
摘要： An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).
摘要翻译： 照明标志（88）包括柔性电源线（100），其包括围绕包含在绝缘护套内的第一和第二平行导体（112,114），其限定了平行导体（112,114）之间恒定的间隔距离。 多个发光二极管（LED）装置（102）固定到电缆（100）上。 每个LED器件（102）包括LED（104），其具有与第一并联导体（112）电连通的正极引线（130），以及负极引线（130P
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公开(公告)号：US07399105B2
公开(公告)日：2008-07-15
申请号：US11787325
申请日：2007-04-16
IPC分类号： F21V21/00
CPC分类号： G09F13/22 , F21S4/20 , F21V21/002 , F21Y2115/10 , G09F9/33 , G09F13/0404 , G09F13/0413 , Y10S362/80 , Y10S362/812
摘要： An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).
摘要翻译： 照明标志（88）包括柔性电源线（100），其包括围绕包含在绝缘护套内的第一和第二平行导体（112,114），其限定了平行导体（112,114）之间恒定的间隔距离。 多个发光二极管（LED）装置（102）固定到电缆（100）上。 每个LED器件（102）包括LED（104），其具有与第一并联导体（112）电连通的正极引线（130），以及负极引线（130P
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公开(公告)号：US07224000B2
公开(公告)日：2007-05-29
申请号：US10831862
申请日：2004-04-26
IPC分类号： H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译： 发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410） ，14,16,212,412）。 透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。 与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。 密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。
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公开(公告)号：US07915061B2
公开(公告)日：2011-03-29
申请号：US12129925
申请日：2008-05-30
IPC分类号： H01L21/00
CPC分类号： H01L33/56 , H01L33/501 , H01L33/54
摘要： An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.
摘要翻译： 说明性照明装置包括：发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括：用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括：用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。
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公开(公告)号：US07217012B2
公开(公告)日：2007-05-15
申请号：US10484674
申请日：2002-05-24
IPC分类号： F21V21/00
CPC分类号： G09F13/22 , F21S4/20 , F21V21/002 , F21Y2115/10 , G09F9/33 , G09F13/0404 , G09F13/0413 , Y10S362/80 , Y10S362/812
摘要： An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130p) electrically communicating with the first parallel conductor (112) and a negative lead (130p) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).
摘要翻译： 照明标志（88）包括柔性电源线（100），其包括围绕包含在绝缘护套内的第一和第二平行导体（112,114），其限定了平行导体（112,114）之间恒定的间隔距离。 多个发光二极管（LED）装置（102）固定到电缆（100）上。 每个LED器件（102）包括具有与第一并联导体（112）电连通的正极引线（130p）的LED（104）和与第二平行导体（114）电连通的负引线（130p）。 模板（92）限定所选择的形状，并且电线（100）布置在模板（92）上。 远离模板（92）设置的功率调节电子器件（210,220）与电源线（100）的第一和第二平行导体（112,114）电连通。 功率调节电子器件（210,220）经由并联导体（112,114）为LED器件（102）供电。
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27.发明授权Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip 失效支持嵌入式导电芯片附件材料，用于倒装芯片接合发光芯片公开(公告)号：US07635869B2
公开(公告)日：2009-12-22
申请号：US11520905
申请日：2006-09-14
申请人： Boris Kolodin , Michael Hsing , Stanton Earl Weaver, Jr. , Ivan Eliashevich , Srinath K. Aanegola
发明人： Boris Kolodin , Michael Hsing , Stanton Earl Weaver, Jr. , Ivan Eliashevich , Srinath K. Aanegola
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
摘要翻译： 在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。 支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。 导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。 附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。 可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。
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公开(公告)号：US20080067537A1
公开(公告)日：2008-03-20
申请号：US11520905
申请日：2006-09-14
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
摘要翻译： 在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。 支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。 导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。 附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。 可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。
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公开(公告)号：US20080054280A1
公开(公告)日：2008-03-06
申请号：US11516533
申请日：2006-09-06
CPC分类号： H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).
摘要翻译： 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 布置在大致保形壳（40）中的导热填料有效地将复合壳材料的热导率提高到高于0.3W /（m.K）的值。
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