Abstract:
Adhesive tapes suitable for bonding to clearcoat materials and exhibiting a good shear strength and a bond strength compatible with requirements. Methods apply the adhesive tapes onto clearcoat materials. The adhesive tapes comprise a carrier layer and a layer of pressure-sensitive adhesive, arranged on the outside in the structure of the adhesive tape. The layer of pressure-sensitive adhesive comprises: at least one polymer selected from poly(meth)acrylates and polydiene block copolymers, or at least one blend of at least one poly(meth)acrylate and at least one polydiene block copolymer; and a tackifier resin component comprising at least one terpene phenolic resin, wherein the terpene phenolic resin has a softening temperature as determined by the ring-and-ball method according to ASTM E28, of not more than 140° C.
Abstract:
Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic.
Abstract:
The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.
Abstract:
Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic
Abstract:
A self-adhesive compound comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90° C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90° C., d) a soft resin, and e) additional additives as applicable.
Abstract:
A laminate made of two rigid substrates and an adhesive film arranged between them, at least one of the substrates being transparent, the thickness of the adhesive film being not greater than 80 μm and the adhesive film comprising at least one adhesive layer made of an adhesive compound to which one or more plasticizers are added, at least one of which is a reactive plasticizer.
Abstract:
Pressure-sensitive adhesive compound containing: a) at least 28% by weight and at most 60% by weight of an elastomer component, wherein i. the elastomer component contains at least 60% by weight and preferably at most 90% by weight, based in each case on the elastomer component, of at least one hydrogenated polyvinylaromatic-polydiene block copolymer having a polyvinylaromatic fraction of at least 18% by weight and a peak molecular weight of 100 000 to 500 000 g/mol, determined according to GPC (Test Ia), ii. the polydiene blocks are substantially fully hydrogenated, iii. the hydrogenated polyvinylaromatic-polydiene block copolymer has an ABA structure, (AB)nZ structure with n=2 or radial (AB)n structure or radial (AB)n—Z structure with n≥3, wherein A=polyvinylaromatic, B=ethylene and butylene or ethylene and propylene and Z=derivative of a coupling substance, and wherein the ethylene fraction in the B blocks is preferably at least 50% by weight, and iv. the elastomer component contains at least 36% by weight, and preferably not more than 50% by weight, more preferably not more than 45% by weight, of at least one kind of a hydrogenated diblock copolymer having an A′B′ structure or (A′B′)nZ structure with n=1, wherein A′=polyvinylaromatic, B′=ethylene and butylene or ethylene and propylene, Z=derivative of a coupling substance, and A′=A and B′=B are possible, b) a tackifier resin component, c) optionally a plasticizer component, d) optionally at least 2.5% by weight to 22% by weight, preferably at least 4% by weight up to 18% by weight, of a reinforcing component which is at least one resin having an MMAP value between −10° C. and +30° C., preferably between 0° C. and +20° C., and a softening point of at least 140° C., e) optionally further adjuvants, the fraction of the elastomer component being based on the total weight of the pressure-sensitive adhesive compound.
Abstract:
A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
Abstract:
The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.
Abstract:
Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.