ADHESIVE TAPE FOR BONDING TO SURFACE COATING MATERIALS

    公开(公告)号:US20230312994A1

    公开(公告)日:2023-10-05

    申请号:US18128627

    申请日:2023-03-30

    Applicant: tesa SE

    Abstract: Adhesive tapes suitable for bonding to clearcoat materials and exhibiting a good shear strength and a bond strength compatible with requirements. Methods apply the adhesive tapes onto clearcoat materials. The adhesive tapes comprise a carrier layer and a layer of pressure-sensitive adhesive, arranged on the outside in the structure of the adhesive tape. The layer of pressure-sensitive adhesive comprises: at least one polymer selected from poly(meth)acrylates and polydiene block copolymers, or at least one blend of at least one poly(meth)acrylate and at least one polydiene block copolymer; and a tackifier resin component comprising at least one terpene phenolic resin, wherein the terpene phenolic resin has a softening temperature as determined by the ring-and-ball method according to ASTM E28, of not more than 140° C.

    Water Vapor-Blocking Adhesive Compound Having Highly Functionalized Poly(meth)acrylate

    公开(公告)号:US20190169470A1

    公开(公告)日:2019-06-06

    申请号:US16097779

    申请日:2017-03-15

    Applicant: TESA SE

    Abstract: The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.

    PRESSURE-SENSITIVE ADHESIVE COMPOUND AND REDETACHABLE SELF-ADHESIVE PRODUCTS COMPRISING THE PRESSURE-SENSITIVE ADHESIVE COMPOUND

    公开(公告)号:US20250101269A1

    公开(公告)日:2025-03-27

    申请号:US18884544

    申请日:2024-09-13

    Applicant: TESA SE

    Abstract: Pressure-sensitive adhesive compound containing: a) at least 28% by weight and at most 60% by weight of an elastomer component, wherein i. the elastomer component contains at least 60% by weight and preferably at most 90% by weight, based in each case on the elastomer component, of at least one hydrogenated polyvinylaromatic-polydiene block copolymer having a polyvinylaromatic fraction of at least 18% by weight and a peak molecular weight of 100 000 to 500 000 g/mol, determined according to GPC (Test Ia), ii. the polydiene blocks are substantially fully hydrogenated, iii. the hydrogenated polyvinylaromatic-polydiene block copolymer has an ABA structure, (AB)nZ structure with n=2 or radial (AB)n structure or radial (AB)n—Z structure with n≥3, wherein A=polyvinylaromatic, B=ethylene and butylene or ethylene and propylene and Z=derivative of a coupling substance, and wherein the ethylene fraction in the B blocks is preferably at least 50% by weight, and iv. the elastomer component contains at least 36% by weight, and preferably not more than 50% by weight, more preferably not more than 45% by weight, of at least one kind of a hydrogenated diblock copolymer having an A′B′ structure or (A′B′)nZ structure with n=1, wherein A′=polyvinylaromatic, B′=ethylene and butylene or ethylene and propylene, Z=derivative of a coupling substance, and A′=A and B′=B are possible, b) a tackifier resin component, c) optionally a plasticizer component, d) optionally at least 2.5% by weight to 22% by weight, preferably at least 4% by weight up to 18% by weight, of a reinforcing component which is at least one resin having an MMAP value between −10° C. and +30° C., preferably between 0° C. and +20° C., and a softening point of at least 140° C., e) optionally further adjuvants, the fraction of the elastomer component being based on the total weight of the pressure-sensitive adhesive compound.

Patent Agency Ranking