公开(公告)号：US06982437B2

公开(公告)日：2006-01-03

申请号：US10665662

申请日：2003-09-19

Applicant: Kendra Gallup ,  Brenton A. Baugh ,  Robert E. Wilson ,  James A. Matthews ,  James H. Williams ,  Tak Kui Wang

Inventor： Kendra Gallup ,  Brenton A. Baugh ,  Robert E. Wilson ,  James A. Matthews ,  James H. Williams ,  Tak Kui Wang

IPC: H01L33/00 ,  H01L31/0232

CPC classification number: H01S5/02288 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/423 ,  H01L2224/05599

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract translation: 用于表面发射激光器的封装将模具封装在子安装座和盖子之间。 可以使用允许将多个管芯附接到子安装晶片的晶片级封装工艺的晶片处理技术来形成子安装座和盖子，将分开的或作为盖子晶片的一部分的盖子附接到子安装晶片， 并切割结构以分离单个包装。 该盖包括透明板，该透明板可被加工成结合诸如透镜的光学元件。 安装在盖上的对准柱表示来自激光器的光信号的位置，并且紧密地配合在套筒的一端，而光纤连接器适合于另一端。

公开(公告)号：US06896238B2

公开(公告)日：2005-05-24

申请号：US10154169

申请日：2002-05-23

Applicant: Tak Kui Wang

Inventor： Tak Kui Wang

IPC: B81B3/00 ,  F15C5/00 ,  F16K99/00 ,  F16K31/145

CPC classification number: F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0055 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/008 ,  F16K2099/0084

Abstract: A micro-machined valve assembly includes a valve diaphragm that will not adhere to a valve seat during elevated temperature operation. The valve assembly has a valve seat, a diaphragm suspended over the valve seat, the diaphragm configured to contact the valve seat upon the application of an actuating pressure on the diaphragm. The diaphragm has a continuous film of a first material, where a portion of the first material in a region where the diaphragm contacts the valve seat includes a first metallic material. The absence of an adhesive or the addition of the metal layer extends the operating temperature of the valve by preventing adhesion of the diaphragm to the valve seat during high temperature operation. Selection of an appropriate material for the metal layer can improve chemical inertness of valve, thereby reducing the possibility that the material flowing through the valve will react with the metal.

Abstract translation: 微加工阀组件包括在高温操作期间不会粘附到阀座的阀膜。 阀组件具有阀座，悬挂在阀座上的隔膜，隔膜构造成在隔膜上施加致动压力时接触阀座。 隔膜具有第一材料的连续膜，其中隔膜接触阀座的区域中的第一材料的一部分包括第一金属材料。 没有粘合剂或金属层的添加通过在高温操作期间防止膜片粘附到阀座来延长阀的工作温度。 选择合适的金属层材料可以提高阀的化学惰性，从而降低流过阀门的材料与金属反应的可能性。

公开(公告)号：US06331678B1

公开(公告)日：2001-12-18

申请号：US09429051

申请日：1999-10-29

Applicant: Tak Kui Wang ,  Phillip W. Barth ,  Michel G. Goedert

Inventor： Tak Kui Wang ,  Phillip W. Barth ,  Michel G. Goedert

IPC: H05K100

CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0373 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A device with a multi-layered micro-component electrical connector. The multi-layer micro-component electrical connector includes a dielectric layer, a micro-mesh of a first electrical conductor secured to the dielectric layer, and a second electrical conductor secured to and contacting the micro-mesh to provide electrical communication. The dielectric layer has a dielectric layer thermal expansion coefficient and the first electrical conductor has a thermal expansion coefficient different from the dielectric layer thermal expansion coefficient. Due to the presence of the micro-mesh the device is operable at temperatures above 250° C. without delamination or blistering of the first electrical conductor from the dielectric layer.

Abstract translation: 具有多层微型电连接器的装置。 多层微组件电连接器包括介电层，固定到电介质层的第一电导体的微网和固定到微网并提供电连通的第二电导体。 电介质层具有介电层热膨胀系数，第一导电体的热膨胀系数不同于电介质层的热膨胀系数。 由于微网的存在，该装置可在高于250℃的温度下操作，而不会使第一电导体与电介质层分层或起泡。

公开(公告)号：US5767384A

公开(公告)日：1998-06-16

申请号：US521780

申请日：1995-08-30

Applicant: Tak Kui Wang ,  James W. Baker ,  Stephen M. Craig

Inventor： Tak Kui Wang ,  James W. Baker ,  Stephen M. Craig

IPC: F15D1/00 ,  G01F15/00 ,  G01M99/00 ,  G01N7/00 ,  G01N19/10 ,  G01N29/00 ,  G01N33/497

CPC classification number: F15D1/001 ,  G01F15/00 ,  Y10T137/0357

Abstract: A flow conditioning system includes a flow randomizing section for receiving an input fluid stream and for increasing the uniformity of the streamwise velocity components of the input fluid stream while randomizing the non-streamwise velocity components, so as to provide a randomized fluid stream; a flow expansion section for receiving the randomized fluid stream and damping the non-streamwise velocity components therein, so as to provide a damped fluid stream; and a flow straightening section for receiving the damped fluid stream and for dividing the damped fluid stream into multiple, parallel output substreams so as to provide a laminar flow profile in an output fluid stream.

公开(公告)号：US5744696A

公开(公告)日：1998-04-28

申请号：US814035

申请日：1997-03-10

Applicant: Tak Kui Wang ,  James Ward Baker ,  Terry A. Berger

Inventor： Tak Kui Wang ,  James Ward Baker ,  Terry A. Berger

IPC: G01N30/54 ,  B01D53/22 ,  B01D69/10 ,  B01D71/02 ,  C01B3/50 ,  G01N30/02 ,  G01N30/30 ,  F25D23/06

CPC classification number: B01D53/228 ,  B01D69/10 ,  B01D71/022 ,  C01B3/505 ,  G01N30/30 ,  G01N2030/025 ,  G01N2030/3007 ,  G01N2030/3084

Abstract: Sample analysis in a portable analytical instrument, preferably in the form of a gas chromatograph, benefits from temperature control of one or more thermal zones in the instrument by way of a thermal isolation system that includes a novel pumping assembly to effect a selective amount of thermal isolation of the thermal zone. The pumping assembly includes a pumping element in the form of a tubular or planar palladium structure. The pumping assembly makes use of the unique properties of palladium to allow selective control of a nominal gas pressure within a vacuum cavity. A component system, which may include a separation column and a thermal device for heating and/or cooling the component system, may be provided within the vacuum cavity. The thermal device and the pumping assembly are individually controlled by a control system. The pumping assembly may be operated to allow selective control of the thermal isolation of the thermal zone; alternatively, the component system may be subject to a controlled temperature by operating the thermal device. A sample mixture passing through the separation column may thereby be exposed to a desired temperature profile according to a selected program so that the sample will separate into its components for subsequent detection by a detector.

Abstract translation: 便携式分析仪器中的样品分析优选以气相色谱仪的形式受益于通过热隔离系统对仪器中的一个或多个热区进行温度控制，所述热隔离系统包括新颖的泵送组件以实现选择量的热 隔离热区。 泵送组件包括管状或平面钯结构形式的泵送元件。 泵送组件利用钯的独特性质来允许选择性地控制真空腔内的标称气体压力。 可以在真空腔内设置可包括分离塔和用于加热和/或冷却部件系统的热装置的部件系统。 热设备和泵组件由控制系统单独控制。 可以操作泵送组件以允许选择性地控制热区的热隔离; 或者，组件系统可以通过操作热装置而经受受控的温度。 因此，通过分离柱的样品混合物可以根据所选择的程序暴露于所需的温度分布，使得样品将分离成其组分以便随后由检测器检测。

公开(公告)号：US5663488A

公开(公告)日：1997-09-02

申请号：US456210

申请日：1995-05-31

Applicant: Tak Kui Wang ,  James W. Baker ,  Terry A. Berger

Inventor： Tak Kui Wang ,  James W. Baker ,  Terry A. Berger

IPC: G01N30/54 ,  B01D53/22 ,  B01D69/10 ,  B01D71/02 ,  C01B3/50 ,  G01N30/02 ,  G01N30/30 ,  G01N7/00

CPC classification number: B01D53/228 ,  B01D69/10 ,  B01D71/022 ,  C01B3/505 ,  G01N30/30 ,  G01N2030/025 ,  G01N2030/3007 ,  G01N2030/3084

Abstract: Sample analysis in a portable analytical instrument, preferably in the form of a gas chromatograph, benefits from temperature control of one or more thermal zones in the instrument by way of a thermal isolation system that includes a novel pumping assembly to effect a selective amount of thermal isolation of the thermal zone. The pumping assembly includes a pumping element in the form of a tubular or planar palladium structure. The pumping assembly makes use of the unique properties of palladium to allow selective control of a nominal gas pressure within a vacuum cavity. A component system, which may include a separation column and a thermal device for heating and/or cooling the component system, may be provided within the vacuum cavity. The thermal device and the pumping assembly are individually controlled by a control system. The pumping assembly may be operated to allow selective control of the thermal isolation of the thermal zone; alternatively, the component system may be subject to a controlled temperature by operating the thermal device. A sample mixture passing through the separation column may thereby be exposed to a desired temperature profile according to a selected program so that the sample will separate into its components for subsequent detection by a detector.

Abstract translation: 便携式分析仪器中的样品分析优选以气相色谱仪的形式受益于通过热隔离系统对仪器中的一个或多个热区进行温度控制，所述热隔离系统包括新颖的泵送组件以实现选择量的热 隔离热区。 泵送组件包括管状或平面钯结构形式的泵送元件。 泵送组件利用钯的独特性质来允许选择性地控制真空腔内的标称气体压力。 可以在真空腔内设置可包括分离塔和用于加热和/或冷却部件系统的热装置的部件系统。 热设备和泵组件由控制系统单独控制。 可以操作泵送组件以允许选择性地控制热区的热隔离; 或者，组件系统可以通过操作热装置而经受受控的温度。 因此，通过分离柱的样品混合物可以根据所选择的程序暴露于所需的温度分布，使得样品将分离成其组分以便随后由检测器检测。

公开(公告)号：US08376630B2

公开(公告)日：2013-02-19

申请号：US13222094

申请日：2011-08-31

Applicant: Tak Kui Wang ,  Chung-Yi Su

Inventor： Tak Kui Wang ,  Chung-Yi Su

IPC: G02B6/36 ,  G02B6/00

CPC classification number: G02B6/3817 ,  Y10T29/49174

Abstract: A hybrid RJ-45 plug is provided that has both an electrical coupling configuration and an optical coupling configuration. The electrical coupling configuration is an 8P8C electrical wiring configuration that complies with the RJ-45 electrical wiring standard. The optical coupling configuration includes an optics system that provides the plug with optical communications capabilities. The hybrid RJ-45 plug is backwards compatible with an existing RJ-45 jack that implements an RJ-45 electrical wiring standard. However, the hybrid RJ-45 plug is also configured to mate with an optical jack that has only optical communications capabilities and to mate with a hybrid RJ-45 jack that has both optical and electrical communications capabilities.

Abstract translation: 提供了具有电耦合配置和光耦合配置的混合RJ-45插头。 电气耦合配置是符合RJ-45电气接线标准的8P8C电气接线配置。 光耦合配置包括向插头提供光通信能力的光学系统。 混合RJ-45插头与实现RJ-45电气接线标准的现有RJ-45插孔向后兼容。 然而，混合RJ-45插头也配置为与仅具有光通信能力的光插孔配合，并与具有光和电通信功能的混合RJ-45插孔配合。

公开(公告)号：US20120189254A1

公开(公告)日：2012-07-26

申请号：US13013928

申请日：2011-01-26

Applicant: Tak Kui Wang ,  Chung-Yi Su

Inventor： Tak Kui Wang ,  Chung-Yi Su

IPC: G02B6/36 ,  H01R43/00

CPC classification number: G02B6/4246 ,  G02B6/3817 ,  G02B6/3885 ,  G02B6/4292 ,  Y10T29/49174

Abstract: An electrical-to-optical and optical-to-electrical converter plug device includes a plug-shaped housing assembly, electrical contact fingers, a substantially planar circuit substrate, an optics block, and one or more opto-electronic conversion devices mounted on the circuit substrate. The opto-electronic signal conversion device has a device optical axis oriented normal to the circuit substrate and electrically coupled to the contact fingers. The optics block has a device optical port aligned with the device optical axis. The optics block has a fiber optical port oriented perpendicularly to the device optical axis. The optics block includes an optical reflector interposed in an optical path between the device optical port and the fiber optical port for redirecting an optical signal at an angle of substantially 90 degrees between a device optical port and a corresponding fiber optical port. An optical fiber can be coupled to the fiber optical port.

Abstract translation: 电 - 光和光 - 电转换器插头装置包括插塞形外壳组件，电接触指，基本平面的电路基板，光学块和安装在电路上的一个或多个光电转换装置 基质。 光电信号转换装置具有与电路基板垂直的装置光轴并且电耦合到接触指。 光学块具有与器件光轴对准的器件光学端口。 光学块具有垂直于器件光轴取向的光纤端口。 光学块包括插入设备光端口和光纤光端口之间的光路中的光反射器，用于在设备光端口和对应的光纤端口之间以大致90度的角度重定向光信号。 光纤可以耦合到光纤光端口。

公开(公告)号：US07750356B2

公开(公告)日：2010-07-06

申请号：US11124457

申请日：2005-05-04

Applicant: Tak Kui Wang

Inventor： Tak Kui Wang

IPC: H01L21/00

CPC classification number: G02B6/4214 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/02208 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/0683 ,  H01L2924/00014

Abstract: An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded to the sub-mount to form the laser package. The lid is made of a middle wafer bonded to a top wafer. The middle wafer defines an opening that accommodates the edge-emitting laser, the collimating ball lens, and the mirror. The opening is defined by vertical sidewalls. The top wafer further includes a lens above the mirror.

Abstract translation: 光学封装包括子安装件，安装在子安装座上的边缘发射激光器，安装在邻近边缘发射激光器的子安装座上的准直球透镜，安装在邻近 准直球镜头 子安装座由底部晶片制成。 将盖子接合到子安装座以形成激光器封装。 盖子由与顶部晶片接合的中间晶片制成。 中间晶片限定了容纳边缘发射激光器，准直球透镜和反射镜的开口。 开口由垂直侧壁限定。 顶部晶片还包括镜子上方的透镜。

公开(公告)号：US07535949B2

公开(公告)日：2009-05-19

申请号：US11684375

申请日：2007-03-09

Applicant: Tak Kui Wang ,  Frank Z.-Y. Hu ,  Annette C. Grot

Inventor： Tak Kui Wang ,  Frank Z.-Y. Hu ,  Annette C. Grot

IPC: H01S3/08

CPC classification number: H01S5/423 ,  H01S5/18388

Abstract: A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

Abstract translation: 晶片级器件制造工艺在多个VCSEL的发射区域周围形成站立结构。 立体结构可以被成形为保持用于相应VCSEL的球透镜或其它光学元件，或者可以包括其上形成有光学元件的平台。 在芯片级或晶片级工艺期间连接到立式结构的球透镜适合于立式结构并自动对准。 光学元件的晶片级制造可以将光学元件与光刻工艺相关的精度对准。 可以在光刻形成区域的回流期间使用模制或复制工艺，印刷方法或表面张力来形成光学元件。