Saddle bracket for solid state pressure gauge
    21.
    发明授权
    Saddle bracket for solid state pressure gauge 失效
    固定式压力表鞍座

    公开(公告)号:US06177727B1

    公开(公告)日:2001-01-23

    申请号:US09071185

    申请日:1998-05-01

    IPC分类号: H01L2714

    摘要: A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36). The saddle (34) has a plurality of sides (51, 52, 53, 54, 55) that form a semiconductor device receiving area (58). The semiconductor device (36) is inserted into the semiconductor device receiving area (58) and secured in the semiconductor device receiving area (58) using tabs (66, 67). The saddle (34) is coupled to the substrate (81) by fasteners (82,83).

    摘要翻译: 半导体部件(31)以及将半导体器件(36)耦合到基板(81)的方法。 半导体元件(31)包括鞍座(34)和半导体器件(36)。 鞍座(34)具有形成半导体器件接收区域(58)的多个侧面(51,52,53,54,55)。 半导体器件(36)被插入到半导体器件接收区域(58)中,并使用突片(66,67)固定在半导体器件接收区域(58)中。 鞍座(34)通过紧固件(82,83)联接到基板(81)。

    Collapsible suitcase
    22.
    发明授权
    Collapsible suitcase 失效
    可折叠手提箱

    公开(公告)号:US4126213A

    公开(公告)日:1978-11-21

    申请号:US820309

    申请日:1977-07-29

    IPC分类号: A45C5/14 A45C7/00 B65D5/14

    摘要: A collapsible suitcase wherein a bottom member has side walls foldably secured thereto with slide fasteners connecting each side wall to form a box-like enclosure. The pull rings of the slide fasteners are locked in closed position by a latch on each corner of an attachable top. The actual volume of the case can be varied according to the extent the slide fasteners are zippered. Rollers are mounted under the bottom of the case to facilitate transport.

    摘要翻译: 一种可折叠的手提箱,其中底部构件具有可折叠地固定到其上的侧壁,并具有连接每个侧壁的拉链,以形成盒状的外壳。 滑动紧固件的拉环通过可附接顶部的每个角上的闩锁锁定在关闭位置。 外壳的实际体积可以根据拉链拉链的程度而变化。 辊子安装在箱体的底部以方便运输。

    Method of making a dual port pressure sensor
    23.
    发明授权
    Method of making a dual port pressure sensor 有权
    制造双口压力传感器的方法

    公开(公告)号:US09021689B2

    公开(公告)日:2015-05-05

    申请号:US13151409

    申请日:2011-06-02

    摘要: A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.

    摘要翻译: 形成双端口压力传感器的方法包括在引线框架的标志中形成第一开口和第二开口。 密封剂被模制以保持引线框架,其中密封剂在标志的顶部之上,并且标记的底部被封装剂覆盖。 密封剂中的第一开口与标志中的第一开口对齐并且大于标志中的第一开口,并且密封剂中的第二开口与标记中的第二开口对齐。 压力传感器传感器连接到标志的底部以覆盖标志中的第一开口,其中压力传感器换能器基于在其顶侧接收的第一压力和接收到的第二压力而提供与压差的电可检测相关性 在它的底部。 集成电路附在标志的底部。 集成电路电耦合到压力传感器。 将盖子附接到密封剂以形成围绕标志底部的外壳。 压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力,并且通过密封剂中的第二开口,标志中的第二开口和外壳接收通过第二压力的第一压力。

    CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE
    25.
    发明申请
    CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE 有权
    过压封装中的电容式压力传感器

    公开(公告)号:US20140033814A1

    公开(公告)日:2014-02-06

    申请号:US13562853

    申请日:2012-07-31

    IPC分类号: H01L29/84 B60C23/04 H01L21/50

    摘要: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.

    摘要翻译: 提供了包覆成型的压力传感器封装。 压力传感器模具(Pcell)被封盖,使得Pcell具有增强的刚度以承受由模制密封剂产生的应力效应。 Pcell帽包括一个远离Pcell隔膜的孔,使得Pcell能够承受外部气体压力,同时将水分从隔膜引导出来。 凝胶不需要使用,相反,如果需要,可以在Pcell上沉积软膜以保护Pcell隔膜免受过多的水分。 Pcell帽可以采取例如虚拟硅晶片或功能ASIC的形式。

    DUAL PORT PRESSURE SENSOR
    27.
    发明申请
    DUAL PORT PRESSURE SENSOR 有权
    双口压力传感器

    公开(公告)号:US20120304777A1

    公开(公告)日:2012-12-06

    申请号:US13151404

    申请日:2011-06-02

    IPC分类号: G01L7/00

    摘要: A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.

    摘要翻译: 双端口压力传感器具有带有具有第一开口和第二开口的标志的引线框架。 引线框架具有具有第一开口和第二开口的标志。 密封剂保持引线框架。 密封剂在标志的顶部之上,标志的底部被封装剂覆盖。 密封剂中的第一开口与标志中的第一开口对准并且大于标志中的第一开口,并且密封剂中的第二开口与标记中的第二开口对齐。 压力传感器传感器连接到标志的底部并覆盖标志中的第一开口,并且基于在其顶侧接收的第一压力和在其底侧上接收的第二压力而提供与压力差的电可检测的相关性。 集成电路连接到标志的底部并且电耦合到压力传感器。 盖子形成与旗子底部的封闭物。 压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力,并且通过密封剂中的第二开口,标志中的第二开口和外壳接收通过第二压力的第一压力。

    METHOD OF MAKING A DUAL PORT PRESSURE SENSOR
    28.
    发明申请
    METHOD OF MAKING A DUAL PORT PRESSURE SENSOR 有权
    制造双口压力传感器的方法

    公开(公告)号:US20120304452A1

    公开(公告)日:2012-12-06

    申请号:US13151409

    申请日:2011-06-02

    IPC分类号: G01R3/00

    摘要: A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.

    摘要翻译: 形成双端口压力传感器的方法包括在引线框架的标志中形成第一开口和第二开口。 密封剂被模制以保持引线框架,其中密封剂在标志的顶部之上,并且标记的底部被封装剂覆盖。 密封剂中的第一开口与标志中的第一开口对齐并且大于标志中的第一开口,并且密封剂中的第二开口与标记中的第二开口对齐。 压力传感器传感器连接到标志的底部以覆盖标志中的第一开口,其中压力传感器换能器基于在其顶侧接收的第一压力和接收到的第二压力而提供与压差的电可检测相关性 在它的底部。 集成电路附在标志的底部。 集成电路电耦合到压力传感器。 将盖子附接到密封剂以形成围绕标志底部的外壳。 压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力,并且通过密封剂中的第二开口,标志中的第二开口和外壳接收通过第二压力的第一压力。