公开(公告)号：US09076737B2

公开(公告)日：2015-07-07

申请号：US12487925

申请日：2009-06-19

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L2224/73265

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基底侧的基底条; 在所述基底条中部分地形成具有大致球形的端子体; 将设备附接到终端主体并在基座顶侧附近，该设备的设备安装侧在终端主体的顶部下方; 将设备连接器附接到所述设备和所述终端主体的顶部; 在所述设备连接器，所述设备以及所述终端主体的顶部上施加密封剂; 并且移除提供从密封剂部分露出的终端体的基底条。

公开(公告)号：US08569872B2

公开(公告)日：2013-10-29

申请号：US12166169

申请日：2008-07-01

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.

摘要翻译： 集成电路封装系统包括：提供具有预定义插槽的管芯焊盘和连接到管芯焊盘的集成电路; 使用接合线将集成电路连接到管芯焊盘; 用封装封装集成电路和接合线; 并且沿着单个轴将模具垫与部分锯隔离槽分隔开，并进入侧垫和模具附接垫。

公开(公告)号：US08455988B2

公开(公告)日：2013-06-04

申请号：US12168803

申请日：2008-07-07

申请人： Jose Alvin Caparas ,  Zigmund Ramirez Camacho

发明人： Jose Alvin Caparas ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming an external interconnect; forming a terminal having a cavity adjacent to and downset from a portion the external interconnect; connecting a first integrated circuit with the external interconnect; and forming an encapsulation over the first integrated circuit with cavity filled with the encapsulation, the terminal extending from the encapsulation, and the external interconnect partially exposed from the encapsulation.

摘要翻译： 集成电路封装系统包括：形成外部互连; 形成具有与所述外部互连的一部分相邻并且从所述外部互连的一部分折下的腔的端子; 将第一集成电路与外部互连连接; 以及在第一集成电路上形成封装，其中填充有封装的腔体，从封装延伸的端子和部分地从封装暴露的外部互连。

公开(公告)号：US20120241927A1

公开(公告)日：2012-09-27

申请号：US13071760

申请日：2011-03-25

申请人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

发明人： JunMo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Jose Alvin Caparas ,  Shariff Dzafir

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在其上形成具有再分布线的基板; 将集成电路安装到基板上; 以及在覆盖集成电路的衬底和通过透明封装看到的再分配线和集成电路上模制透明封装。

公开(公告)号：US20100320589A1

公开(公告)日：2010-12-23

申请号：US12487925

申请日：2009-06-19

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/488 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L2224/73265

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基底侧的基底条; 在所述基底条中部分地形成具有大致球形的端子体; 将设备附接到所述终端主体并且在所述基座顶侧上方，所述设备的设备安装侧在所述终端主体的顶部下方; 将设备连接器附接到所述设备和所述终端主体的顶部; 在所述设备连接器，所述设备以及所述终端主体的顶部上施加密封剂; 并且移除提供从密封剂部分露出的终端体的基底条。

公开(公告)号：US20100140766A1

公开(公告)日：2010-06-10

申请号：US12709073

申请日：2010-02-19

申请人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

发明人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。

公开(公告)号：US07700404B2

公开(公告)日：2010-04-20

申请号：US11536544

申请日：2006-09-28

申请人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

发明人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

IPC分类号： H01L23/48

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。

公开(公告)号：US20100001384A1

公开(公告)日：2010-01-07

申请号：US12166169

申请日：2008-07-01

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.

摘要翻译： 集成电路封装系统包括：提供具有预定义插槽的管芯焊盘和连接到管芯焊盘的集成电路; 使用接合线将集成电路连接到管芯焊盘; 用封装封装集成电路和接合线; 并且沿着单个轴将模具垫与部分锯隔离槽分隔开，并进入侧垫和模具附接垫。

公开(公告)号：US20090302442A1

公开(公告)日：2009-12-10

申请号：US12474757

申请日：2009-05-29

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49551 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.

摘要翻译： 一种制造集成电路管芯封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。

公开(公告)号：US20080237816A1

公开(公告)日：2008-10-02

申请号：US11694921

申请日：2007-03-30

申请人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.

摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。