摘要:
A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.
摘要:
A plastic ferrule including a centering section having a tubular body. The tubular body is provided with an outer-circumferential centering reference surface and a center axis of the centering reference surface. The centering section includes a resinous outer tube part having the outer-circumferential centering reference surface and provided, along the center axis, with a coated-fiber holding bore for securely accommodating a coated optical fiber and a fixing bore extending from the coated-fiber holding bore, the outer tube part forming a tubular wall with a generally uniform thickness as a whole. The centering section also includes an inner tube part fixed to the fixing bore of the outer tube part and provided along the center axis with an uncoated-fiber holding bore, communicating with the coated-fiber holding bore, for securely accommodating an uncoated optical fiber.
摘要:
A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.
摘要:
A plug connector includes an electrically insulating body including a housing and a pair of arms; a plurality of pairs of first and second right-angled signal contact elements supported by the housing such that the first right-angled signal contact element is arranged above the second right-angled signal contact element, each of the right-angled signal contact elements having a substantially right-angled contact portion protruding backward from the housing and a leading portion inserted into the housing, the contact portion having a horizontal part and a vertical part; a plurality of ground contact elements supported by the housing and disposed alternately with the plurality of pairs of first and second right-angled plug signal contacts, each of the ground contact elements provided with two ground terminals; and upper and lower electrically insulating brackets assembled to the housing. The upper bracket covering the horizontal parts of the plurality of first signal contact elements, the lower bracket covering the horizontal parts of the plurality of second signal contact elements, and the lower bracket being provided with holes into which the vertical parts of the first and second signal contact elements and the ground terminals are inserted.
摘要:
A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion.
摘要:
A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.
摘要:
The object is to provide a transceiver module that is capable of performing a high-rate communication, and satisfies the demand at a moderate cost in a case where short distance communication is enough for transmitting or receiving signals.The transceiver module has a Re-timer 11, a control portion 12, a reference clock generating portion 13, a power portion 14 and a CX4 interface 15. The Re-timer 11 is coupled to a transceiver portion (Tx/Rx) 21 through an XAUI (10 Gigabit Media Independent Interface) interface 22, and is coupled to other component that is coupled to one end of a cable 150 for balanced transmission through the CX4 (10GBASE-CX4) interface 15.
摘要:
A plug connector includes an electrically insulating body including a housing and a pair of arms; a plurality of pairs of first and second right-angled signal contact elements supported by the housing such that the first right-angled signal contact element is arranged above the second right-angled signal contact element, each of the right-angled signal contact elements having a substantially right-angled contact portion protruding backward from the housing and a leading portion inserted into the housing, the contact portion having a horizontal part and a vertical part; a plurality of ground contact elements supported by the housing and disposed alternately with the plurality of pairs of first and second right-angled plug signal contacts, each of the ground contact elements provided with two ground terminals; and upper and lower electrically insulating brackets assembled to the housing. The upper bracket covering the horizontal parts of the plurality of first signal contact elements, the lower bracket covering the horizontal parts of the plurality of second signal contact elements, and the lower bracket being provided with holes into which the vertical parts of the first and second signal contact elements and the ground terminals are inserted.
摘要:
In an optical/electrical composite connector including a male connector and a female connector, the male connector includes a ferrule provided at an end portion of an optical fiber on a side of the male connector which is connected to the female connector, and an electrode terminal. The female connector includes a core to transmit an optical signal, a cladding to cover the core, an electric wiring provided on an outer wall surface of the cladding, a sleeve in which the ferrule is fitted, the sleeve provided at an end portion of the cladding on a side of the female connector which is connected to the male connector, and a lens provided in the sleeve. When the ferrule and the sleeve are fitted together, the electrode terminal and the electric wiring are electrically connected and the optical fiber and the core are optically connected through the lens.
摘要:
A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion.