公开(公告)号：US08735931B2

公开(公告)日：2014-05-27

申请号：US12907348

申请日：2010-10-19

申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

公开(公告)号：USRE43200E1

公开(公告)日：2012-02-21

申请号：US12029220

申请日：2008-02-11

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L23/48

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US08013352B2

公开(公告)日：2011-09-06

申请号：US12684614

申请日：2010-01-08

申请人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

发明人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

公开(公告)号：US07887225B2

公开(公告)日：2011-02-15

申请号：US11822331

申请日：2007-07-05

申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

IPC分类号： F21V8/00

CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。

公开(公告)号：US07678592B2

公开(公告)日：2010-03-16

申请号：US11680847

申请日：2007-03-01

申请人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

发明人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

摘要： In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

摘要翻译： 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。

公开(公告)号：US07501656B2

公开(公告)日：2009-03-10

申请号：US11491947

申请日：2006-07-25

申请人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

发明人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

公开(公告)号：US20080128736A1

公开(公告)日：2008-06-05

申请号：US12007297

申请日：2008-01-09

申请人： Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

发明人： Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

公开(公告)号：US07338823B2

公开(公告)日：2008-03-04

申请号：US11444397

申请日：2006-06-01

申请人： Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

发明人： Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

IPC分类号： H01L21/00 ,  H01L21/48

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。 封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。 具有反射层的模制部件在其一侧形成透光表面。 本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

公开(公告)号：USRE44811E1

公开(公告)日：2014-03-18

申请号：US13330239

申请日：2011-12-19

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US08435808B2

公开(公告)日：2013-05-07

申请号：US13281079

申请日：2011-10-25

申请人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

发明人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

摘要翻译： 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。