公开(公告)号：US20050194694A1

公开(公告)日：2005-09-08

申请号：US11070089

申请日：2005-03-03

申请人： Nobuaki Takahashi

发明人： Nobuaki Takahashi

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L25/0657 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15165 ,  H01L2924/15172 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising the multi-chip stack structure that involves improved degree of freedom in routing arrangement and has reduced thickness is provided. A semiconductor device, comprising: a substrate; a lower semiconductor chip provided on the substrate; an upper semiconductor chip provided on the lower semiconductor chip; and a silicon spacer with a rerouting disposed between the lower semiconductor chip and the upper semiconductor chip, and including a protruding portion protruding farther outward than an outer periphery of the lower semiconductor chip, is provided. Second electrode pads provided on the protruding portion and first electrode pads provided on the lower semiconductor chip are connected via interconnects including through electrodes of the silicon spacer with the rerouting.

摘要翻译： 提供了包括提高了布线布置自由度并且具有减小的厚度的多芯片堆叠结构的半导体器件。 一种半导体器件，包括：衬底; 设置在所述基板上的下半导体芯片; 设置在下半导体芯片上的上半导体芯片; 以及具有布置在下半导体芯片和上半导体芯片之间的重新布线的硅衬垫，并且包括比下半导体芯片的外周更向外突出的突出部分。 设置在突出部分上的第二电极焊盘和设置在下半导体芯片上的第一电极焊盘通过包括通过硅衬垫的电极与重新布线的互连而连接。

公开(公告)号：US06732404B2

公开(公告)日：2004-05-11

申请号：US09730706

申请日：2000-12-06

申请人： Hidetoshi Fukuoka ,  Nobuaki Takahashi

发明人： Hidetoshi Fukuoka ,  Nobuaki Takahashi

IPC分类号： A47L514

CPC分类号： A47L9/0411 ,  A47L9/08 ,  A47L9/246 ,  A47L9/2805 ,  A47L9/2842 ,  A47L9/2889

摘要： Pressurized filtered exhaust air from a motorized fan in a vacuum cleaner body passes on an exhaust path to a floor suction tool. The exhaust air is directed by the floor suction tool generally parallel to the surface to be cleaned to agitate dust and thus to improve cleaning performance. An electric motor in the floor suction tool drives a rotation brush. The exhaust air is also directed toward the rotation brush in the floor suction tool in a direction to add rotation force to the rotation brush. Feeder lines to the electric motor pass through the exhaust path so that the feeder lines are exposed only to filtered air. Passing the feeder lines through the exhaust path avoids the necessity to make special provision for the feeder lines. The exhaust path passes along a hose, and may optionally pass along one or more extension pipes on its way to the floor suction tool.

摘要翻译： 来自真空吸尘器主体的电动风扇的加压过滤的排出空气通过排气通道进入地板抽吸工具。 废气通过地板抽吸工具大致平行于要清洁的表面引导，以搅拌灰尘，从而提高清洁性能。 地板抽吸工具中的电动马达驱动旋转刷。 废气也沿着向旋转刷增加旋转力的方向朝向地板吸引工具中的旋转刷。 馈电线到电动机通过排气路径，使得馈线仅暴露于过滤空气中。 将送料线通过排气通道，避免了对送料线进行特殊处理的必要性。 排气通道沿着软管通过，并且可以可选地沿着一个或多个延伸管道在其到达地板抽吸工具的路上通过。

公开(公告)号：US06488407B1

公开(公告)日：2002-12-03

申请号：US09527243

申请日：2000-03-17

申请人： Masayuki Kitamura ,  Eisuke Morisaki ,  Nobuaki Takahashi ,  Takashi Shigeoka

发明人： Masayuki Kitamura ,  Eisuke Morisaki ,  Nobuaki Takahashi ,  Takashi Shigeoka

IPC分类号： G01J500

CPC分类号： G01J5/0003 ,  G01J5/0007 ,  G01J5/08 ,  G01J5/0818 ,  G01J5/0887 ,  G01J5/0896 ,  G01J2005/0051 ,  G01J2005/0077

摘要： The present invention intends to improve the accuracy of temperature measurement when measuring the temperature of a semiconductor wafer by a radiation thermometer on the basis of the idea of virtual blackbody simulated by multiple reflection of light. A system includes a wafer (W), a circular reflector 1 of a radius R disposed opposite to the wafer (W), and a probe (2) disposed in a through hole formed in the reflector (1). The probe (2) is a through hole. The radiation intensity of radiation passed the through hole is determined by image data provided by a CCD camera disposed behind the back surface of the reflector (1). An error in measured radiation intensity of radiation falling the probe (2) due to light that enters a space between the wafer (W) and the reflector (1) and a space between the reflector (1) and the probe (2) and light leaks from the same spaces is corrected, the emissivity of the wafer (W) is calculated and the temperature of the wafer (W) is determined.

摘要翻译： 本发明旨在通过基于由多次反射光模拟的虚拟黑体的想法，通过辐射温度计测量半导体晶片的温度来提高温度测量的精度。 系统包括晶片（W），与晶片（W）相对设置的半径为R的圆形反射器1和设置在形成于反射器（1）中的通孔中的探针（2）。 探针（2）是通孔。 通过通孔的辐射的辐射强度由设置在反射器（1）的后表面后面的CCD照相机提供的图像数据确定。 由于进入晶片（W）和反射器（1）之间的空间的光以及反射器（1）和探针（2）之间的空间以及光线（2）引起的探测器（2）的测量辐射强度的误差 校正相同空间的泄漏，计算晶片的发射率（W），并确定晶片（W）的温度。

公开(公告)号：US06192550B1

公开(公告)日：2001-02-27

申请号：US09493068

申请日：2000-01-28

申请人： Atsuo Hamada ,  Kazumasa Kamatani ,  Kazuyoshi Yoshimi ,  Atsushi Okuda ,  Souji Sakata ,  Naoki Suetsugu ,  Syuzou Ueyama ,  Nobuaki Takahashi

发明人： Atsuo Hamada ,  Kazumasa Kamatani ,  Kazuyoshi Yoshimi ,  Atsushi Okuda ,  Souji Sakata ,  Naoki Suetsugu ,  Syuzou Ueyama ,  Nobuaki Takahashi

IPC分类号： A47L910

CPC分类号： A47L9/108 ,  A47L5/28 ,  A47L9/1608 ,  A47L9/1666 ,  A47L9/1683 ,  A47L9/1691 ,  A47L9/20

摘要： A dust-collecting device for a vacuum cleaner comprising a dust-collecting case which is fitted into a suction path extending from a suction nozzle to a motor fan and from which accumulated dust can be discharged by opening a bottom lid of the dust-collecting case, and a cylindrical filter fitted into the dust-collecting case. The filter is arranged to be rotatable, a spiral rib is formed at an outer periphery of the filter, and the device is equipped with a rotating means for rotating the filter. Dust which cannot be discharge by its own weight since it is in a compressed state can be pushed out through the spiral rib formed on the outer periphery of the filter by rotating the filter, so that dust accumulated within the dust-collecting case in a compressed state can be easily discharged.

摘要翻译： 一种用于真空吸尘器的集尘装置，包括集尘箱，该集尘箱装配到从吸嘴延伸到电动机风扇的吸入路径中，通过打开集尘箱的底盖可以排出积聚的灰尘 和装配在集尘箱中的圆筒形过滤器。 过滤器被布置成可旋转，在过滤器的外周形成螺旋肋，并且该装置配备有用于旋转过滤器的旋转装置。 通过旋转过滤器，通过自身重量而不能排出的粉尘可以通过形成在过滤器的外周上的螺旋形肋被推出，使得积聚在集尘箱内的灰尘被压缩 状态可以轻松放电。

公开(公告)号：US6132334A

公开(公告)日：2000-10-17

申请号：US945271

申请日：1997-10-27

申请人： Atsushi Tabata ,  Masato Kaigawa ,  Nobuaki Takahashi

发明人： Atsushi Tabata ,  Masato Kaigawa ,  Nobuaki Takahashi

IPC分类号： F16H61/00 ,  F16H61/04 ,  F16H61/06 ,  B60K41/06 ,  F02D29/02

CPC分类号： F16H63/502 ,  B60W10/04 ,  B60W10/10 ,  B60W30/19 ,  F16H61/061 ,  B60W2510/0638 ,  B60W2540/16 ,  B60W2710/021 ,  F16H2061/0087 ,  Y10T477/693762

摘要： A control system for an automatic transmission, which is capable of controlling the hydraulic pressures for frictional engagement units when a predetermined shift is performed such that a first frictional engagement unit is engaged and a second frictional engagement unit is released, being connected to a power source, the revolving speed of which is temporarily raised when a predetermined shift down is performed, the control unit for the automatic transmission for a vehicle being structured such that shift which is performed by engaging and releasing the two frictional engagement units is judged, whether the judged shift is shift down in which the revolving speed of the power source is temporarily raised or shift down in which the revolving speed of the power source is not raised is judged, and the contents of control of the hydraulic pressures for the frictional engagement units are changed between shift down in which the revolving speed of the power source is temporarily raised and shift down in which the revolving speed of the power source is not raised.

摘要翻译： PCT No.PCT / JP97 / 00567 Sec。 371日期1997年10月27日第 102（e）日期1997年10月27日PCT 1997年2月27日提交一种自动变速器控制系统，其能够在执行预定换档时控制摩擦接合单元的液压，使得第一摩擦接合单元 并且第二摩擦接合单元被释放，连接到电源，当执行预定的换档时，其转速暂时升高，用于车辆的自动变速器的控制单元被构造成使得位移为 判断通过卡合和释放两个摩擦接合单元执行的判断，判断的变速是否偏移，其中电源的转速暂时上升或下降，其中电源的转速不升高， 并且用于摩擦接合单元的液压的控制的内容在其中旋转支架的下降之间改变 电源暂时升高和下降，电源的转速不会升高。

公开(公告)号：US5691739A

公开(公告)日：1997-11-25

申请号：US363016

申请日：1994-12-23

申请人： Hidetsugu Kawamori ,  Nobuaki Takahashi

发明人： Hidetsugu Kawamori ,  Nobuaki Takahashi

IPC分类号： G02F1/133 ,  G09G3/36 ,  G09G3/20

CPC分类号： G09G3/3622 ,  G09G3/3681 ,  G09G3/3692 ,  G09G3/3696 ,  G09G2320/0209

摘要： A driving device, which drives a display section that consists of a plurality of liquid crystal display elements that are connected to signal lines and scanning lines and that are disposed in the form of matrix, includes a scanning-line driver, a signal-line driver, and a compensating device. The scanning-line driver is for releasing to the scanning lines a scanning signal for selecting the scanning lines successively. The signal-line drive is for releasing to the signal lines a display signal for displaying images in synchronism with the scanning signal. Finally, the compensating device which, during a compensating period that follows a display period during which display signals corresponding to one picture are transmitted to the signal lines, applies to each liquid crystal display element a compensating voltage or compensating pulses that is capable of cancelling a lowering in an effective value of a driving voltage for the liquid crystal display elements during the display period. With this arrangement, since the lowering of the effective value of the driving voltage is cancelled, it becomes possible to display liquid crystal images in high quality.

摘要翻译： 驱动由多个与信号线和扫描线连接并且以矩阵形式配置的液晶显示元件的显示部分的驱动装置包括扫描线驱动器，信号线驱动器 和补偿装置。 扫描线驱动器用于向扫描线释放用于连续选择扫描线的扫描信号。 信号线驱动器用于向信号线释放用于与扫描信号同步地显示图像的显示信号。 最后，补偿装置在与显示周期相对应的显示周期的补偿期间内向信号线发送，对每个液晶显示元件施加补偿电压或补偿脉冲，该补偿电压能够抵消 在显示期间降低液晶显示元件的驱动电压的有效值。 通过这种布置，由于驱动电压的有效值的降低被消除，所以可以高质量地显示液晶图像。

公开(公告)号：US5657313A

公开(公告)日：1997-08-12

申请号：US514127

申请日：1995-08-11

申请人： Nobuaki Takahashi ,  Susumu Takahashi ,  Kenji Sugiyama

发明人： Nobuaki Takahashi ,  Susumu Takahashi ,  Kenji Sugiyama

IPC分类号： H04L27/26 ,  H04L27/34

CPC分类号： H04L27/2662 ,  H04L27/2602 ,  H04L27/2657 ,  H04L27/2675

摘要： A signal transmitting apparatus using orthogonal frequency division multiplexing includes an inverse fast Fourier transform circuit for converting a digital information signal into a first multi-value QAM modulation signal. A guard interval setting circuit is operative for periodically generating a guard interval signal equal to a time segment of the first multi-value QAM modulation signal, and inserting the guard interval signal into the first multi-value QAM modulation signal to convert the first multi-value QAM modulation signal into a second multi-value QAM modulation signal. A clock signal generating circuit is operative for generating a first clock signal which drives the inverse fast Fourier transform circuit, and generating a second dock signal which drives the guard interval setting circuit. The inverse fast Fourier transform circuit includes a device for generating a pilot signal which corresponds to a given-order carrier, and adding the pilot signal to the first multi-value QAM modulation signal. The pilot signal has a predetermined frequency and an angle modulation component which remains constant over a plurality of symbol periods. The pilot signal corresponding to a given integer times its wavelength or a given odd number times its half wavelength is present in a guard interval occupied by the guard interval signal in the second multi-value QAM modulation signal. The pilot signal is continuously present over the guard interval and another interval.

摘要翻译： 使用正交频分复用的信号发送装置包括用于将数字信息信号转换为第一多值QAM调制信号的快速傅立叶逆变换电路。 保护间隔设置电路用于周期性地产生等于第一多值QAM调制信号的时间段的保护间隔信号，并将保护间隔信号插入到第一多值QAM调制信号中， 值QAM调制信号转换成第二多值QAM调制信号。 时钟信号发生电路用于产生驱动逆快速傅里叶变换电路的第一时钟信号，并产生驱动保护间隔设定电路的第二停靠信号。 逆快速傅里叶变换电路包括用于产生对应于给定阶载波的导频信号并将导频信号加到第一多值QAM调制信号的装置。 导频信号具有在多个符号周期内保持恒定的预定频率和角度调制分量。 对应于给定整数乘以其波长或给定奇数乘以其半波长的导频信号存在于由第二多值QAM调制信号中的保护间隔信号所占据的保护间隔中。 导频信号连续出现在保护间隔和另一个间隔之间。

公开(公告)号：US5616094A

公开(公告)日：1997-04-01

申请号：US562386

申请日：1995-11-24

申请人： Kazumasa Tsukamoto ,  Masahiko Ando ,  Akira Fukatsu ,  Toshiyuki Mae ,  Motoyuki Sakai ,  Tetsuo Hamajima ,  Masato Kaigawa ,  Kagenori Fukumura ,  Hidehiro Oba ,  Yasuo Hojo ,  Atsushi Tabata ,  Nobuaki Takahashi

发明人： Kazumasa Tsukamoto ,  Masahiko Ando ,  Akira Fukatsu ,  Toshiyuki Mae ,  Motoyuki Sakai ,  Tetsuo Hamajima ,  Masato Kaigawa ,  Kagenori Fukumura ,  Hidehiro Oba ,  Yasuo Hojo ,  Atsushi Tabata ,  Nobuaki Takahashi

IPC分类号： F16H61/02 ,  F16H61/06 ,  F16H61/00

CPC分类号： F16H61/061 ,  F16H61/065 ,  F16H2061/0253 ,  F16H2061/0258 ,  F16H61/0206 ,  F16H61/067 ,  Y10T477/693635 ,  Y10T477/6937 ,  Y10T477/69377

摘要： A hydraulic control system for an automatic transmission includes a regulator valve in a hydraulic circuit for supplying pressure to a servo of a frictional engagement element. The regulator valve has an input port, an output port and a drain port. A valve member of the regulator valve includes a pressure receiving area fed with a feedback pressure from the portion of the hydraulic circuit between the regulator valve and the servo, and another pressure receiving area selectively fed with pressure from a signal pressure source. A further pressure receiving area, having a surface area different from the another pressure receiving area, is constantly fed pressure from the signal pressure source.

摘要翻译： 用于自动变速器的液压控制系统包括用于向摩擦接合元件的伺服器提供压力的液压回路中的调节阀。 调节阀具有输入端口，输出端口和排放端口。 调节阀的阀构件包括供给来自调节阀和伺服器之间的液压回路部分的反馈压力的压力接收区域和选择性地供给来自信号压力源的压力的另一压力接收区域。 具有不同于另一压力接收区域的表面积的另外的压力接收区域从信号压力源恒定地供给压力。

公开(公告)号：US5600180A

公开(公告)日：1997-02-04

申请号：US505152

申请日：1995-07-21

申请人： Teruo Kusaka ,  Naoji Senba ,  Atsushi Nishizawa ,  Nobuaki Takahashi

发明人： Teruo Kusaka ,  Naoji Senba ,  Atsushi Nishizawa ,  Nobuaki Takahashi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1579

摘要： A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.

摘要翻译： 在半导体集成电路芯片上形成有用于通过凸块与电路板接合的半导体集成电路芯片上的凸块的密封结构，其中多个焊盘形成在半导体集成电路芯片上。 每个垫在其上形成有凸块。 提供涂覆材料以涂覆上述多个凸块的至少表面。 该材料由具有足够小的硬度的绝缘材料制成，用于在将芯片接合到电路板上时形成变形，从而使每个凸块的至少顶部与设置在电路板上的焊盘接触。

公开(公告)号：US5528456A

公开(公告)日：1996-06-18

申请号：US341933

申请日：1994-11-15

申请人： Nobuaki Takahashi

发明人： Nobuaki Takahashi

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/433 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195

摘要： The invention provides a package with an improved semiconductor device heat transfer structure including a semiconductor integrated circuit chip mounted on a substrate, a package for receiving the semiconductor integrated circuit chips mounted on the substrate, a radiator being attached to the package for radiation of a heat to an exterior and for sealing the package and a foil which made of a heat conductive material has corrugations having top portions in contact with the chip and bottom portions in contact with the radiator for transferring the heat from the semiconductor integrated circuit chip to the radiator.

摘要翻译： 本发明提供了一种具有改进的半导体器件传热结构的封装，其包括安装在基板上的半导体集成电路芯片，用于接收安装在基板上的半导体集成电路芯片的封装，散热器附接到封装以辐射热量 到外部并用于密封包装，并且由导热材料制成的箔具有波纹，其具有与芯片接触的顶部和与散热器接触的底部，用于将热量从半导体集成电路芯片传送到散热器。