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    SYSTEMS FOR MATERIAL DEPOSITION
    21.
    发明申请
    SYSTEMS FOR MATERIAL DEPOSITION 有权

    公开(公告)号：US20210129433A1

    公开(公告)日：2021-05-06

    申请号：US16949113

    申请日：2020-10-14

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan ,  Daniel Liptz

    IPC: B29C64/209 ,  B29C64/227 ,  B33Y30/00

    Abstract: Systems for material deposition. One such system includes a number of containers arranged relative to one another in a conical or other shape, pointing toward a common deposition point. When not actively depositing material, the containers are held at a distance from the deposition point. Another system has a rod disposed within a container and a flexible tip on the rod seals a material exit of the container when biased closed. Pressurized gas introduced into the container forces the rod away from the material exit and material from the container. In yet another system, a container includes a barrel adapter having a one-way air valve that seals the container and creates a vacuum, preventing material from leaking from the container. Upon application of a pressurized gas, the one-way valve is forced open and material is deposited from the container. The valve closes automatically in the absence of the gas.

    KIT AND SYSTEM FOR LASER-INDUCED MATERIAL DISPENSING
    22.
    发明申请
    KIT AND SYSTEM FOR LASER-INDUCED MATERIAL DISPENSING 审中-公开

    公开(公告)号：US20200222938A1

    公开(公告)日：2020-07-16

    申请号：US16838245

    申请日：2020-04-02

    Applicant: IO Tech Group LTD.

    Inventor： Michael ZENOU

    IPC: B05D3/06 ,  B41J2/48 ,  G02B6/35 ,  G02B6/42 ,  G02B6/26

    Abstract: The laser-induced dispensing system incudes a cartridge assembly having a supply reel for supplying a foil having a light transmissive layer wound around the supply reel, and a take-up reel for taking up the foil. There is provided a coating device for coating the foil by a donor material during a motion of the foil. The laser-induced dispensing system also includes a irradiation head having optics configured for focusing a laser beam. Additionally, a controller, for controlling the cartridge assembly to establish motion of the foil, and the optics to focus the laser beam onto the foil at a location downstream the outlet of the coating device so as to release droplets of the donor material from the foil is provided.

    KIT AND SYSTEM FOR LASER-INDUCED MATERIAL DISPENSING
    25.
    发明申请
    KIT AND SYSTEM FOR LASER-INDUCED MATERIAL DISPENSING 审中-公开

    公开(公告)号：US20180015502A1

    公开(公告)日：2018-01-18

    申请号：US15648980

    申请日：2017-07-13

    Applicant: IO TECH GROUP LTD.

    Inventor： Michael ZENOU

    IPC: B05D3/06 ,  G02B6/26 ,  G02B6/04 ,  G02B6/42 ,  G02B6/028

    CPC classification number: B05D3/06 ,  B41J2/48 ,  G02B6/0288 ,  G02B6/04 ,  G02B6/262 ,  G02B6/3512 ,  G02B6/3548 ,  G02B6/3598 ,  G02B6/4206 ,  G02B6/4214

    Abstract: A laser-induced dispensing system for material processing is disclosed. The laser-induced dispensing system includes a fiber bundle having optical fibers. The optical fibers have first ends arranged at the first interface and second ends arranged at the second interface. Additionally, optics that direct laser beams transmitted from the second interface by the optical fibers toward a material to be deposited a substrate is provided. The optics is configured to focus the laser beams on the material to be deposited, thereby causing the material to be deposited to be released onto the substrate. Each of the optical fibers having a first end that is adjacent to a first end of another of the optical fibers at the first interface have a second end that is non-adjacent to a second end of the another of the optical fibers at the second interface.

    PCB PRODUCTION BY LASER SYSTEMS
    26.
    发明公开
    PCB PRODUCTION BY LASER SYSTEMS 审中-公开

    公开(公告)号：US20240324101A1

    公开(公告)日：2024-09-26

    申请号：US18678263

    申请日：2024-05-30

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

    CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

    PCB production by laser systems
    27.
    发明授权
    PCB production by laser systems 有权

    公开(公告)号：US11877398B2

    公开(公告)日：2024-01-16

    申请号：US17249217

    申请日：2021-02-24

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

    CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

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