公开(公告)号：US08918971B2

公开(公告)日：2014-12-30

申请号：US13177898

申请日：2011-07-07

Applicant: Junya Fukuda

Inventor： Junya Fukuda

IPC: H01L21/52 ,  H03H3/02 ,  H01L21/78 ,  H01L21/50 ,  H03H3/04 ,  H03H9/10 ,  H01L27/146 ,  H01L51/56 ,  H01L23/055 ,  H03H9/21 ,  H03H9/24

CPC classification number: H01L21/52 ,  H01L21/50 ,  H01L21/78 ,  H01L23/055 ,  H01L27/14618 ,  H01L27/14632 ,  H01L51/56 ,  H01L2224/13 ,  H03H3/02 ,  H03H3/04 ,  H03H9/1021 ,  H03H9/21 ,  H03H9/2494 ,  H03H2003/026 ,  H03H2003/0492 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49798

Abstract: A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.

Abstract translation: 一种制造密封在其中的内容物的方法，包括：在第一晶片上的多个封装形成区域中形成空腔的步骤; 在将所述内容物排列在所述空腔中的同时，接合所述第一晶片和第二晶片的步骤; 以及利用激光照射接合的晶片构件并将封装分离成片的步骤，其特征在于，在所述空腔形成步骤中，在所述第一晶片的最外周的所述封装形成区域的外侧形成虚设空腔。

公开(公告)号：US08898874B2

公开(公告)日：2014-12-02

申请号：US12372251

申请日：2009-02-17

Applicant: Mitsuo Tomiyama ,  Takashi Kobayashi ,  Kazuyoshi Sugama

Inventor： Mitsuo Tomiyama ,  Takashi Kobayashi ,  Kazuyoshi Sugama

IPC: H03H3/02 ,  H03H9/15 ,  H03H9/05 ,  H03H9/10 ,  H03H9/21 ,  C30B29/18 ,  C30B33/08

CPC classification number: H03H3/02 ,  C30B29/18 ,  C30B33/08 ,  H03H9/0542 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: To fabricate a plurality of piezoelectric vibrating pieces while firmly preventing a defect, a crack, or a breakage from being brought about at a wafer in the midst of fabrication, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a plurality of piezoelectric vibrating pieces from a wafer S, the method including a film forming step of respectively forming metal films M on both faces of the wafer, a patterning step of removing a region of the metal film on an inner side of an outer peripheral end of the wafer by a constant distance H, thereafter, patterning the metal film M to outer shapes of the plurality of piezoelectric vibrating pieces, an outer shape forming step of forming outer shapes of the plurality of piezoelectric vibrating pieces at the wafer a size of which is reduced by an amount of the constant distance by selectively removing the wafer by wet etching by constituting a mask by the patterned metal film, and a removing step of removing the metal film.

Abstract translation: 为了制造多个压电振动片，同时在制造过程中牢固地防止缺陷，裂纹或破裂在晶片上产生，提供了一种制造压电振动片的方法，该压电振动片是一种制造方法 多个来自晶片S的压电振动片，所述方法包括在所述晶片的两个表面上分别形成金属膜M的成膜步骤，在外周的内侧除去所述金属膜的区域的图案化步骤 将晶片的端部恒定的距离H，然后将金属膜M图案化成多个压电振动片的外形，外形形成步骤，在晶片上形成多个压电振动片的外形尺寸 通过用图案化的金属膜构成掩模，通过湿法蚀刻选择性地去除晶片，减少了恒定距离的量， g去除金属膜的步骤。

公开(公告)号：US08884500B2

公开(公告)日：2014-11-11

申请号：US13357016

申请日：2012-01-24

Applicant: Takashi Kobayashi

Inventor： Takashi Kobayashi

IPC: H03H9/21 ,  H03H9/05 ,  H03H9/10 ,  G04C3/04 ,  G04R20/10

CPC classification number: H03H9/21 ,  G04C3/047 ,  G04R20/10 ,  H03H9/0542 ,  H03H9/1021

Abstract: A piezoelectric vibrating reed includes: a pair of vibrating arm portions arranged in a line; an outer groove portion and an inner groove portion formed on both principal surfaces of the vibrating arm portions so as to extend along the Y direction (longitudinal direction) of the vibrating arm portions; and a base portion to which the pair of vibrating arm portions are connected, in which a plurality of groove portions is formed so as to be arranged in a line in the X direction (width direction) of the vibrating arm portions.

Abstract translation: 一种压电振动片包括：一排布置成一条线的振动臂部分; 在所述振动臂部的两个主面上形成有沿所述振动臂部的Y方向（长度方向）延伸的外槽部和内槽部， 以及连接有一对振动臂部的基部，其中形成有多个槽部，以在振动臂部的X方向（宽度方向）上配置成一列。

公开(公告)号：US08749122B2

公开(公告)日：2014-06-10

申请号：US13050284

申请日：2011-03-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053 ,  H03H9/10 ,  H03H9/21

CPC classification number: H03H9/1021 ,  H03H9/02 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

Abstract: Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Abstract translation: 提供一种具有优异的气密性并且能够提高安装强度的真空封装和制造方法，以及压电振动器，振荡器，电子设备和无线电控制的钟表。 该封装包括：基板和盖基板，其形成在基底基板和盖基板之间，并且能够密封压电振动片，穿透电极在基板的厚度方向上贯通 以使空腔的内侧和外侧导电。 基底基板和盖基板在空腔附近的部分形成两个基板结合的接合区域。 在基底基板的角部形成有从基底基板的厚度方向观察盖基板的接合面露出的切口部。

公开(公告)号：US20140077663A1

公开(公告)日：2014-03-20

申请号：US14024874

申请日：2013-09-12

Applicant: SII Crystal Technology Inc.

Inventor： Takashi KOBAYASHI

IPC: H01L41/08 ,  H01L41/053

CPC classification number: H01L41/08 ,  H01L41/053 ,  H03H9/1021

Abstract: A piezoelectric vibrator including a package having a base member, a lid member forming a cavity with respect to the base member, and a piezoelectric vibrating piece mounted on a mount surface and housed inside the cavity, in which the piezoelectric vibrating piece has a pair of vibrating arm portions and a base portion cantilever-supporting base end portions of the pair of vibrating arm portions and being mounted on the mount surface, a concave portion for avoiding contact with respect to tip portions when the vibrating arm portions are displaced in a thickness direction is formed on the mount surface, contact portions contacted by main surfaces of the vibrating arm portions facing the mount surface, and clearance portions for avoiding contact with at least one edge-line portion of two edge-line portions where the main surface intersects with two side surfaces.

Abstract translation: 一种压电振动器，包括具有基座部件的封装，相对于基座部件形成空腔的盖部件和安装在安装面上并容纳在所述空腔内的压电振动片，所述压电振动片具有一对 所述振动臂部和所述一对振动臂部的基部悬臂支撑基端部安装在所述安装面上，当所述振动臂部在厚度方向上位移时，用于避免与所述尖端部接触的凹部 形成在安装表面上，与振动臂部分的主表面接触的接触部分面向安装表面，以及间隙部分，用于避免与主表面与两个边缘线相交的两个边缘线部分的至少一个边缘线部分接触 侧面。

公开(公告)号：US08653899B2

公开(公告)日：2014-02-18

申请号：US13398350

申请日：2012-02-16

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H03B5/30

CPC classification number: H03H9/1021 ,  G04C3/047 ,  G04R20/10 ,  H03H9/215

Abstract: A piezoelectric vibrator, an oscillator, an electronic device and a ratio timepiece are provided which are capable of increasing a capacitance C0 while achieving miniaturization and cost reduction. The piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed on which an excitation electrode is formed, and external electrodes. An electrode pattern for capacitance adjustment, which extends along a routing electrode, is provided extending from a routing electrode.

Abstract translation: 提供一种能够在实现小型化和降低成本的同时增加电容C0的压电振动器，振荡器，电子装置和比率时计。 压电振动器包括基底基板，盖基板，形成有激励电极的压电振动片和外部电极。 设置从布线电极延伸的沿着布线电极延伸的用于电容调整的电极图案。

公开(公告)号：US08633775B2

公开(公告)日：2014-01-21

申请号：US13035519

申请日：2011-02-25

Applicant: Yumi Yamaguchi ,  Kazuyoshi Sugama

Inventor： Yumi Yamaguchi ,  Kazuyoshi Sugama

IPC: H03H9/24 ,  H01L41/053 ,  H03B5/32

CPC classification number: H03H3/04 ,  H03H9/1021 ,  H03H9/215 ,  H03H2003/026 ,  H03H2003/0492

Abstract: Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films.

Abstract translation: 提供本发明的压电振动器的制造方法，所述压电振子包括具有一对振动臂部的音叉型压电振动片，容纳所述压电振动片的封装以及形成的一对调节膜 沿着与所述一对振动臂部中的每一个对应的振动臂部的纵向方向，压电振动器能够通过用激光照射调节膜来将包装中的真空度调节到一定程度以上，从而蒸发 部分调节膜。 该方法包括通过一对调节膜中的一对振动臂部的中心轴在对称位置照射激光的吸气处理。

公开(公告)号：US10608558B2

公开(公告)日：2020-03-31

申请号：US15704539

申请日：2017-09-14

Applicant: SII Crystal Technology Inc.

Inventor： Naoya Ichimura

IPC: H02N2/00 ,  H03H9/215 ,  H03H9/10 ,  H01L41/053 ,  H01L41/09 ,  H01L41/253 ,  H01L41/29 ,  H01L41/338 ,  H03H3/04 ,  H03H9/13

Abstract: There is provided a wafer making it possible to stably break off the piezoelectric vibrator element. The wafer includes a piezoelectric vibrator element, a frame part, and a connection part adapted to connect the piezoelectric vibrator element and the frame part to each other, and the connection part is provided with a guide part adapted to guide force, which is applied to the connection part from one surface side in the thickness direction of the connection part when breaking off the piezoelectric vibrator element from the frame part at the connection part, to at least one side in the width direction of the connection part.

公开(公告)号：US10263588B2

公开(公告)日：2019-04-16

申请号：US15156905

申请日：2016-05-17

Applicant: SII Crystal Technology Inc.

Inventor： Takashi Kobayashi

IPC: H01L41/22 ,  H03H9/02 ,  H03H9/205 ,  H03H3/04 ,  H03H9/21

Abstract: A method of manufacturing a piezoelectric vibrator element, a piezoelectric vibrator element, and a piezoelectric vibrator, superior in vibration characteristics, high in quality, and capable of suppressing a variation in frequency after a frequency adjustment, are provided. The method includes a first frequency adjustment step of performing ion milling on a weight metal film for a frequency adjustment formed on a surface of a tip part in each of a pair of vibrating arm parts, and a second frequency adjustment step of performing ion milling on the weight metal film at a lower etch rate than in the first frequency adjustment step after the first frequency adjustment step.

公开(公告)号：US09184726B2

公开(公告)日：2015-11-10

申请号：US14055331

申请日：2013-10-16

Applicant: SII Crystal Technology Inc.

Inventor： Takashi Kobayashi

IPC: H03H9/21 ,  H03H9/02 ,  H03H9/10

CPC classification number: H03H9/21 ,  H03H9/02157 ,  H03H9/1021

Abstract: A piezoelectric vibrating strip includes a pair of vibrating arm portions in parallel with a central axis therebetween, and a base portion integrally cantilevering base end portions of the pair of vibrating arm portions in a length direction. Each of the pair of vibrating arm portions has a first groove portion and a second groove portion in a main face, the first groove portion being placed closer to a leading end portion in the length direction of the vibrating arm portions and having a groove width along a width direction orthogonal to the length direction and a thickness direction of the vibrating arm portion. The second groove portion is closer to the base end portion than the first groove portion and has a groove width along the width direction. The groove width ratio of the second groove portion to the first groove portion is between 0.4 and 1.0.

Abstract translation: 压电振动片包括与它们之间的中心轴线平行的一对振动臂部分，以及在一对振动臂部分的长度方向上整体地悬置基部端部的基部。 所述一对振动臂部中的每一个在主面上具有第一槽部和第二槽部，所述第一槽部在所述振动臂部的长度方向上靠近前端部配置，并且沿着 与长度方向正交的宽度方向和振动臂部的厚度方向。 第二槽部比第一槽部更靠近基端部，并且沿宽度方向具有槽宽。 第二槽部与第一槽部的槽宽比为0.4〜1.0。