公开(公告)号：US20220339920A1

公开(公告)日：2022-10-27

申请号：US17725573

申请日：2022-04-21

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： JIA-HAO WU ,  TING-I LIU ,  MENG-YING TSAI

IPC: B32B27/28 ,  B32B27/08 ,  B32B27/32 ,  B32B15/08

Abstract: A polyimide composite film for use in a flexible metal clad substrate, comprising: a polyimide base material film; a fluorine polymer layer, formed on at least one surface of the polyimide base material film, comprising polyimide resins and fluorine polymers, wherein the polyimide resin accounts for 2 to 20 wt % of the total solid content of the fluorine polymer layer, the aromatic functional group ratio of the polyimide resin in the fluorine polymer layer is greater than 35%, and the absorption onset wavelength (λonset) of the ultraviolet-visible spectrum is greater than 360 nm; a thickness ratio of the polyimide base material film to one layer of the fluorine polymer layers is 8:1 to 1:4; and a total thickness of the polyimide composite film is between 18 and 175 microns. Thus, the polyimide composite film has a low dielectric constant, low loss factor, and has good drilling processability.

公开(公告)号：US20130279126A1

公开(公告)日：2013-10-24

申请号：US13670015

申请日：2012-11-06

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Yi Chen ,  Wu-Yung Yang ,  Chih-Wei Lin

IPC: C08G73/10 ,  H05K7/06 ,  H01L31/0216 ,  B32B15/08 ,  B05D5/12

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/18 ,  B32B2457/206 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1085 ,  C08G73/22 ,  C09D179/08 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/31681

Abstract: An aromatic polyimide film can be formed from a plurality of monomers comprising an aromatic dianhydride, and a first aromatic diamine selected from a group consisting of formulae (I) and (II): and wherein X and Y are respectively selected from the group consisting of oxygen, nitrogen and sulfur, and R and R′ are respectively selected from the group consisting of NH2, wherein the aromatic polyimide film has an average linear coefficient of thermal expansion equal to or below about 5 ppm/° C. in a temperature range between about 50° C. and about 500° C.

Abstract translation: 芳族聚酰亚胺膜可以由多种包含芳族二酐的单体和选自式（I）和（II）的第一芳族二胺形成：其中X和Y分别选自 氧，氮和硫，R和R'分别选自NH 2，其中芳族聚酰亚胺膜的平均线性热膨胀系数等于或低于约5ppm /℃，在 约50℃和约500℃

公开(公告)号：US20130158195A1

公开(公告)日：2013-06-20

申请号：US13600293

申请日：2012-08-31

Applicant: Chung-Yi Chen ,  Sheng-Yu Huang ,  Wei-Dun Jhuang

Inventor： Chung-Yi Chen ,  Sheng-Yu Huang ,  Wei-Dun Jhuang

IPC: C08L79/08 ,  C08K3/04 ,  B29C41/00 ,  C08G73/16

CPC classification number: C08J5/18 ,  C08G73/1046 ,  C08J2379/08 ,  C08J2479/08 ,  C09D179/08 ,  Y10T428/2982

Abstract: A polyimide film with low gloss comprising a polyimide base polymer constituting the film, and a polyimide powder distributed in the film, the polyimide film having a 60° gloss value smaller or equal to about 50. The polyimide powder used as delustrant can have an average particle size between about 0.5 μm and about 15 μm. Embodiments described herein also include methods of preparing the polyimide film and the delustrant.

Abstract translation: 包含构成膜的聚酰亚胺基础聚合物的聚酰亚胺薄膜和分布在该膜中的聚酰亚胺粉末，聚酰亚胺薄膜的光泽度小于或等于约50°。用作消光剂的聚酰亚胺粉末可具有平均粒径 粒度在约0.5μm至约15μm之间。 本文所述的实施方案还包括制备聚酰亚胺膜和消光剂的方法。

公开(公告)号：US20130032970A1

公开(公告)日：2013-02-07

申请号：US13599550

申请日：2012-08-30

Applicant: Sheng-Yu Huang ,  Chung-Yi Chen

Inventor： Sheng-Yu Huang ,  Chung-Yi Chen

IPC: B29D7/01

CPC classification number: C08G73/1039 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08

Abstract: A process of manufacturing a white polyimide film comprising performing condensation polymerization of monomers comprising diamine and dianhydride components to obtain a solution; adding a dehydrant, a catalyst and a coloration filler into the solution to obtain a precursor solution; coating a layer of the precursor solution on a support; and baking the coated layer of the precursor solution to form a white polyimide film. The diamine component can include 2,2′-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay.

Abstract translation: 一种制造白色聚酰亚胺膜的方法，包括进行包含二胺和二酐组分的单体的缩聚以获得溶液; 向溶液中加入脱水剂，催化剂和着色填料，得到前体溶液; 将一层前体溶液涂覆在载体上; 并烘烤前体溶液的涂层以形成白色聚酰亚胺膜。 二胺组分可包括2,2'-双（三氟甲基）联苯胺，二酐组分可包括3,3'，4,4'-联苯四羧酸二酐和2,2-双[4-（3,4-二羧基苯氧基） 苯基]丙烷二酐。 着色填料可以包括TiO2，Al2O3，CaCO3，CaSO4，SiO2，BN，AlN和粘土。

公开(公告)号：US20230416480A1

公开(公告)日：2023-12-28

申请号：US18336050

申请日：2023-06-16

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-HUA LI ,  JIA-HAO WU

IPC: C08J5/18 ,  C08G73/10 ,  C08K3/04 ,  C08L79/08

CPC classification number: C08J5/18 ,  C08G73/1007 ,  C08G73/105 ,  C08G73/1071 ,  C08G73/1042 ,  C08J2379/08 ,  C08L79/08 ,  C08K2201/005 ,  C08L2205/12 ,  C08L2205/22 ,  C08K3/04

Abstract: A high-modulus black matte polyimide film is provided, the high-modulus black matte polyimide film includes polyimide in an amount from 75 to 93 wt % of the high-modulus matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide; carbon black in an amount from 2 to 8 wt % of the high-modulus matte polyimide film; and liquid crystal polymer micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 20 wt % of the high-modulus matte polyimide film, wherein the high-modulus matte polyimide film has a gloss value at 60° being less than 50.

公开(公告)号：US20210198528A1

公开(公告)日：2021-07-01

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-CHI HSU ,  CHUN-TING LAI ,  CHIH-WEI LIN

IPC: C09J7/38 ,  H01L33/00

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

公开(公告)号：US10212821B2

公开(公告)日：2019-02-19

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  C03C17/34 ,  H01L21/683 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H01L23/498 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US09914841B2

公开(公告)日：2018-03-13

申请号：US14165274

申请日：2014-01-27

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chih-Wei Lin ,  Wu-Yung Yang

IPC: C08K3/04 ,  C08K3/36 ,  B32B5/16 ,  B32B27/20 ,  C08L79/08 ,  C09D7/00 ,  B29C41/24 ,  H05K9/00 ,  C08J3/22 ,  C08K3/00 ,  C08K5/00 ,  B29K105/00 ,  B29K79/00 ,  C08K13/02

CPC classification number: C09D7/42 ,  B29C41/24 ,  B29K2079/08 ,  B29K2105/0032 ,  C08J3/226 ,  C08J2379/08 ,  C08J2479/08 ,  C08K3/013 ,  C08K5/0041 ,  C08K13/02 ,  H05K9/0084 ,  Y10T428/254 ,  C08K3/0033 ,  C08L79/08

Abstract: A colored matting powder includes particles containing a polyimide obtained by reacting diamine and dianhydride monomers at a substantially equal molar ratio, and a pigment incorporated with the polyimide, a portion of the pigment being located at an outer surface of the particles. Moreover, a colored polyimide film is also described as incorporating the colored matting powder, and can exhibit low gloss, low transparency and good insulation.

公开(公告)号：US20150064484A1

公开(公告)日：2015-03-05

申请号：US14292254

申请日：2014-05-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Wen-Hsuan Chung ,  Mei-Hui Lee

IPC: C08L79/08 ,  H05K1/05 ,  H05K1/03

CPC classification number: H05K1/053 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08L2205/025 ,  C09D179/08 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0154 ,  Y10T428/31681 ,  C08K5/0041 ,  C08L79/08 ,  C08K3/013

Abstract: A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion.

Abstract translation: 着色的聚酰亚胺膜包括通过二胺单体与二酐单体反应而得到的聚酰亚胺聚合物，其中二胺单体是氧化二苯胺（ODA）和苯二胺（PDA）单体，二酐单体是均苯四酸二酐（PMDA）; 由聚酰亚胺颗粒组成的消光剂; 和一种或多种着色颜料。 本文所述的聚酰亚胺膜具有低光泽度，低透明度和低热膨胀系数。

公开(公告)号：US20140050935A1

公开(公告)日：2014-02-20

申请号：US14060131

申请日：2013-10-22

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Yi CHEN ,  Chih-Wei LIN ,  Chi-Huan LO ,  Shihan TAI

IPC: C09D179/08

CPC classification number: C09D179/08 ,  C08G73/10 ,  C08J5/18 ,  C08J2379/08 ,  C08J2479/08 ,  C08K13/02 ,  C08L79/08 ,  Y10T428/31721

Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.

Abstract translation: 聚酰亚胺膜包括聚酰亚胺基层聚酰亚胺层和分散在聚酰亚胺基聚合物中的聚酰亚胺粉末，该聚酰亚胺粉末是通过二胺与二酸酐的摩尔比为约1:0.950至约1:0.995 。 此外，聚酰亚胺膜可以具有至少包含层叠在聚酰亚胺层的表面上的第二聚酰亚胺层的多层结构。 第二聚酰亚胺还可以包含聚酰亚胺粉末，其重量比小于第二聚酰亚胺层的总重量的约20重量％。 本文所述的实施方案还包括制备聚酰亚胺膜的方法。