Abstract:
A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes performing a plurality of scan line cycles, wherein each scan line cycle can fill in gaps left by previous scan line cycles. This “delay and fill” scan allows large spacing between spots, thereby eliminating cross-talk at the detector plane. In one embodiment, the scan is begun and ended outside a desired scan area on the wafer to ensure full scan coverage.
Abstract:
An optical scanner for use in conjunction with an infrared spectrometer is disclosed. The optical scanner translates a beam of radiation to a stationary spot on a traveling sheet of material so that ample integration time within the spectrometer is achieved. The beam path impinges on the traveling web and the radiation is reflected off the traveling web back through the optical scanner and recombined at an interferometer. The beam of radiation is kept stationary with respect to both the traveling sheet and the carriage which houses the spectrometer.
Abstract:
A double-sided optical inspection system is presented which may detect and classify particles, pits and scratches on thin film disks or wafers in a single scan of the surface. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction on both surfaces of the wafer or thin film disk. The scattered light from radial and circumferential beams is separated via their polarization or by the use of a dichroic mirror together with two different laser wavelengths.
Abstract:
The present invention is directed towards a channel power monitor for monitoring channel power levels for each of N signal channels. The value of each channel power level is designated as p(nulli), where nulll is a channel parameter that characterizes each channel. An embodiment of the invention includes a variable channel attenuator having M attenuation profiles where MnullN, and where a k-th attenuation profile is characterized as a function of the channel parameter nulll by Ak(nulll). This embodiment also includes a detector for measuring a k-th integrated attenuated power level, the value of which is represented by Pk. An analysis unit receives all of the values Pk of the integrated attenuated power levels and thereupon derives the values p(nulll) of the channel power levels by solving a set of linear equations.
Abstract:
A method for three-dimensional (3D) image calibration for a spectral domain optical coherence tomography (OCT) system, the OCT system including a scanning arrangement for laterally scanning a sample light beam across a surface of a sample, an optical detection system for detecting light reflected back from the sample to obtain an optical image of the sample, and a reference light beam, the OCT system generating axially resolved optical information from the sample as the sample light beam is scanned laterally across the sample using optical path length differences (OPLD) between the reference light beam and the sample light beam, the method including: providing a calibration sample having a substrate having laterally arranged structural elements providing optical contrast, the structural elements having at least one of known dimensions or known position values on the substrate; scanning, using a first set of scanner parameters for the scanning arrangement, the sample light beam.
Abstract:
Provided is an image sensor including a plurality of pixels provided in an array, wherein each of the plurality of pixels includes a plurality of sub-pixels, and wherein the plurality of sub-pixels are provided such that electric charges, generated from pixels among the plurality of pixels provided perpendicular to a moving direction of an object, accumulate while moving in the moving direction of the object at a same speed as the object.
Abstract:
A system includes a vessel floating on a body of water. The system also includes at least one conduit extending from the vessel to below the body of water. The system also includes a scanning device disposed within the at least one conduit. The scanning device includes at least one two-dimensional (2D) line scanner and a rotary encoder coupled to the at least one 2D line scanner. The scanning device is configured to generate three-dimensional (3D) image data of a surface of the at least one conduit or at least one component disposed within the at least one conduit.
Abstract:
A system to generate multiple beam lines in an oblique angle multi-beam spot scanning wafer inspection system includes a beam scanning device configured to scan a beam of illumination, an objective lens oriented at an oblique angle relative to the surface of a sample and with an optical axis perpendicular to a first scanning direction on the sample, and one or more optical elements positioned between the objective lens and the beam scanning device. The one or more optical elements split the beam into two or more offset beams such that the two or more offset beams are separated in a least a second direction perpendicular to the first direction. The one or more optical elements further modify the phase characteristics of the two or more offset beams such that the two or more offset beams are simultaneously in focus on the sample during a scan.
Abstract:
Method has laser scanner for pixel-precise imaging of fluorescent samples having fluorescent dyes. The scanner has sample table, laser and first optical system providing laser beam for exciting the samples, scanner head with deflecting element for scanning sample, first lens, second optical system for forwarding emission beams triggered by the laser beam and deflected by first lens and deflecting element to a detector, position encoder emitting position signals indicating location of the scanner head, electronic element for filtering the detector signals with a time constant and an A/D converter for digitizing the filtered detector signals. The filtered detector signals and the position encoder signals are acquired independently, in parallel and continuously by a computer and are related to a common time base, the A/D conversion being carried out often so that each pixel of an image is always assigned more than one data point.
Abstract:
A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes performing a plurality of scan line cycles, wherein each scan line cycle can fill in gaps left by previous scan line cycles. This “delay and fill” scan allows large spacing between spots, thereby eliminating cross-talk at the detector plane. In one embodiment, the scan is begun and ended outside a desired scan area on the wafer to ensure full scan coverage.