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    Optoelectronic assembly and method of making the same
    22.
    发明授权
    Optoelectronic assembly and method of making the same 有权
    光电组装及其制作方法

    公开(公告)号：US06376268B1

    公开(公告)日：2002-04-23

    申请号：US09334146

    申请日：1999-06-15

    Applicant: Jean-Marc Verdiell

    Inventor： Jean-Marc Verdiell

    IPC: H01L2100

    CPC classification number: G02B6/423 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4267 ,  G02B6/4268 ,  G02B6/4272 ,  G02B6/4273 ,  G02B6/4274 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: An optoelectronic assembly having an insulating substrate with a planar surface and a metal layer bonded to the planar surface such that selected regions of the substrate are exposed and a step is produced between the substrate and a top surface of the metal layer. An active optical device is mounted on the metal layer and a passive optical device is aligned with the active device using the step as a fiduciary for positioning the former. The metal layer provides an electrical path to the active device. The thickness of the metal layer is selected such that the heat generated by the active device is dissipated, the substrate does not interfere with the propagation of light along the first optical axis, and such that the in-plane coefficient of thermal expansion (CTE) of the metal layer is constrained by the substrate. The optoelectronic assembly is also suitable for mounting active devices provided with submounts or without.

    Abstract translation: 一种具有平坦表面的绝缘基底和与平坦表面结合的金属层的光电子组件，使得基底的所选区域被暴露，并且在基底和金属层的顶表面之间产生台阶。 有源光学器件安装在金属层上，并且无源光学器件与有源器件对准，使用该步骤作为用于定位前者的受托人。 金属层提供到有源器件的电路。 选择金属层的厚度使得由有源器件产生的热消散，衬底不会干扰光沿着第一光轴的传播，并且使得面内的热膨胀系数（CTE） 的金属层被基板约束。 光电组件也适用于安装有底座或不带有底座的有源器件。

    Method for producing an optoelectronic component
    23.
    发明授权
    Method for producing an optoelectronic component 失效
    光电子元件的制造方法

    公开(公告)号：US06271049B1

    公开(公告)日：2001-08-07

    申请号：US09395303

    申请日：1999-09-13

    Applicant: Franz Auracher ,  Wolfgang Gramann

    Inventor： Franz Auracher ,  Wolfgang Gramann

    IPC: H01L2100

    CPC classification number: G02B6/422 ,  G02B6/4214 ,  G02B6/4238 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4259 ,  G02B6/4273 ,  G02B6/4286 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/0683

    Abstract: In a method for producing an optoelectronic component, a laser chip is secured to a semiconductor wafer that is provided with metal structures. Thereafter, for each laser chip, one lens-coupling optical element that deflects the beam path of the laser chip is positioned on the semiconductor wafer. The laser chip is driven, and the space between the laser chip and the lens-coupling optical element is varied and set such that a predetermined beam condition with respect to the location of the optical image plane is met.

    Abstract translation: 在制造光电子部件的方法中，将激光芯片固定到设置有金属结构的半导体晶片。 此后，对于每个激光器芯片，偏转激光芯片的光束路径的一个透镜耦合光学元件位于半导体晶片上。 激光芯片被驱动，激光芯片和透镜耦合光学元件之间的空间被改变和设置，使得相对于光学像平面的位置满足预定的光束状态。

    Semiconductor laser module
    24.
    发明授权
    Semiconductor laser module 失效
    半导体激光模块

    公开(公告)号：US6101202A

    公开(公告)日：2000-08-08

    申请号：US327585

    申请日：1999-06-08

    Applicant: Tomonari Kosugi

    Inventor： Tomonari Kosugi

    IPC: G02B6/42 ,  H01L23/38 ,  H01S3/00 ,  H01S3/04 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S3/043

    CPC classification number: H01S5/02415 ,  G02B6/4204 ,  G02B6/4244 ,  G02B6/4257 ,  H01S5/02284 ,  G02B6/4237 ,  G02B6/4271 ,  G02B6/4272 ,  G02B6/4273 ,  H01S5/02208 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02438

    Abstract: It is an object of the invention to provide a thinned semiconductor laser module. The semiconductor laser module is provided with a module package, an inverted L-shaped lens supporting member, composed of a horizontal upper part and a vertical under part, where a corner thereof defines a boundary therebetween, a substrate fixed to an under surface of the vertical under part of the lens supporting member, a temperature regulation element, the under surface of which is fixed on an interior bottom surface of the module package and the upper surface of which is fixed to the under surface of a substrate a semiconductor laser for emitting a laser beam, being fixed to a portion near a side-end of a substrate, an optical fiber, an end of which is fixed on a point irradiated by the laser beam on a side wall of the module package, and a lens, which is fixed on the under surface of the horizontal upper part of the lens supporting member, or optically coupling the semiconductor laser with the optical fiber, and the lowest end of the lens is set lower than the upper surface of the substrate.

    Abstract translation: 本发明的一个目的是提供一种变薄的半导体激光器模块。 半导体激光器模块设置有模块封装，倒L形透镜支撑构件，其由水平上部和垂直下部组成，其中其角部限定了它们之间的边界，基板固定到 在透镜支撑部件的垂直下方的温度调节元件，其下表面固定在模块封装的内部底表面上，并且其上表面固定到基板的下表面，用于发射半导体激光器 激光束固定在基板的侧端附近的部分，光纤，其一端固定在由激光束照射在该模块封装的侧壁上的点上，该透镜是 固定在透镜支撑构件的水平上部的下表面上，或者将半导体激光器与光纤耦合，并且将透镜的最低端设置为低于t的上表面 他的底物。

    Optoelectronic assembly and method of making the same
    25.
    发明授权
    Optoelectronic assembly and method of making the same 失效

    公开(公告)号：US5977567A

    公开(公告)日：1999-11-02

    申请号：US3114

    申请日：1998-01-06

    Applicant: Jean-Marc Verdiell

    Inventor： Jean-Marc Verdiell

    IPC: G02B6/42 ,  H01L33/00

    CPC classification number: G02B6/423 ,  G02B6/4272 ,  G02B6/4273 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4267 ,  G02B6/4268 ,  G02B6/4274 ,  H01L2224/48091

    Abstract: An optoelectronic assembly having an insulating substrate with a planar surface and a metal layer bonded to the planar surface such that selected regions of the substrate are exposed and a step is produced between the substrate and a top surface of the metal layer. An active optical device is mounted on the metal layer and a passive optical device is aligned with the active device using the step as a fiduciary for positioning the former. The metal layer provides an electrical path to the active device. The thickness of the metal layer is selected such that the heat generated by the active device is dissipated, the substrate does not interfere with the propagation of light along the first optical axis, and such that the in-plane coefficient of thermal expansion (CTE) of the metal layer is constrained by the substrate. The optoelectronic assembly is also suitable for mounting active devices provided with submounts or without.

    Optical module
    27.
    发明授权
    Optical module 有权

    公开(公告)号：US12075559B2

    公开(公告)日：2024-08-27

    申请号：US17815714

    申请日：2022-07-28

    Applicant: InnoLight Technology PTE. LTD.

    Inventor： Long Chen ,  Yuzhou Sun ,  Dengqun Yu

    IPC: H05K1/02 ,  G02B6/42

    CPC classification number: H05K1/021 ,  G02B6/4273 ,  H05K1/0216 ,  H05K1/0274 ,  H05K2201/10121

    Abstract: An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.

    Plug connector
    29.
    发明授权
    Plug connector 有权

    公开(公告)号：US11709328B2

    公开(公告)日：2023-07-25

    申请号：US17607302

    申请日：2020-03-12

    Applicant: Japan Aviation Electronics Industry, Limited

    Inventor： Yuichi Koreeda ,  Shingo Nakajima ,  Masaki Ishiguro

    IPC: H04B10/00 ,  G02B6/42 ,  H01R13/639

    CPC classification number: G02B6/4284 ,  G02B6/4261 ,  G02B6/4273 ,  H01R13/639

    Abstract: A plug connector is attachable with an optical fiber cable and is connectable with a receptacle connector. The receptacle connector comprises a receptacle shell. The plug connector comprises a front holder, a cable holding portion, a rear holder and a coupling member. The front holder is made of metal. The front holder is mated with the receptacle shell when the plug connector is connected with the receptacle connector. The cable holding portion is made of metal. The cable holding portion is configured to hold the optical fiber cable. The rear holder guards the cable holding portion. The rear holder comprises, at least in part, a thermal insulating portion made of non-metal material. The coupling member couples the front holder and the rear holder with each other. Each of the coupling member and the front holder is in contact with the rear holder only on the thermal insulating portion.

    Connector
    30.
    发明申请
    Connector 审中-公开

    公开(公告)号：US20180129000A1

    公开(公告)日：2018-05-10

    申请号：US15805687

    申请日：2017-11-07

    Applicant: Tyco Electronics (Shanghai) Co. Ltd.

    Inventor： Wenyu Liu ,  Hongqiang Han ,  Chenxi Wang ,  Lizhou Li ,  Youwei Pan

    IPC: G02B6/42

    CPC classification number: G02B6/4262 ,  G02B6/4261 ,  G02B6/4273 ,  G02B6/4277 ,  G02B6/4292

    Abstract: A connector for receiving one or more plug modules comprises a housing and a partition wall disposed in the housing and dividing an inner space of the housing into an upper insertion port and a lower insertion port. A first rigid convex member protruding toward an inner space of the upper insertion port is formed on a top wall of the upper insertion port and a second rigid convex member protruding toward an inner space of the lower insertion port is formed on a bottom wall of the lower insertion port. The first rigid convex member physically contacts a first plug module inserted into the upper insertion port and the second rigid convex member physically contacts a second plug module inserted into the lower insertion port.

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