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公开(公告)号：US11894218B2
公开(公告)日：2024-02-06
申请号：US16891425
申请日：2020-06-03
发明人： Masato Takayama , Yasuharu Sasaki
CPC分类号： H01J37/32715 , H01J37/32642 , H02N13/00 , H01J37/32091 , H01J2237/002
摘要： There is provision of an electrostatic chuck for supporting a substrate and an edge ring including a first region, a second region, an electrode provided in the second region, and an elastic member. The first region includes a first top surface and is configured to hold the substrate that is placed on the first top surface. The second region extends in a circumferential direction of the first region so as to surround the first region. The second region includes a second top surface, and is configured to support the edge ring placed on the second top surface. The first top surface and the second top surface extend along a single flat plane. A part of the edge ring is accommodated in a space provided between the first region and the second region, and the elastic member is disposed between the part of the edge ring and the electrostatic chuck.
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公开(公告)号：US20240038506A1
公开(公告)日：2024-02-01
申请号：US17815768
申请日：2022-07-28
IPC分类号： H01J37/32 , H01L21/3065
CPC分类号： H01J37/32669 , H01L21/3065 , H01J37/32642
摘要： A plasma etching system that includes a plasma processing chamber, a substrate holder disposed in the plasma processing chamber, a RF power source configured to generate a plasma in the plasma processing chamber, a first magnet disposed above the substrate holder, the first magnet configured to apply, in the plasma processing chamber, an azimuthally symmetric magnetic field that is independent from a magnetic field generated by the RF power source, and a second magnet disposed below the substrate holder and configured to modify the azimuthally symmetric magnetic field and create a ring X point between the first magnet and the second magnet, where positions of the first magnet and the second magnet are arranged such that the ring X point is located nearer to an edge of the substrate holder than a center of the substrate holder.
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公开(公告)号：US11881375B2
公开(公告)日：2024-01-23
申请号：US17232078
申请日：2021-04-15
IPC分类号： H01J37/08 , H01J37/32 , H01J37/24 , H01J37/248
CPC分类号： H01J37/08 , H01J37/248 , H01J37/32642 , H01J2237/24564 , H01J2237/3328
摘要： Embodiments of a lift apparatus for use in a substrate processing chamber are provided herein. In some embodiments, a lift apparatus includes: a plurality of first lift pin assemblies configured to raise or lower a substrate having a given diameter when disposed thereon, wherein each of the first lift pin assemblies includes a first lift pin disposed on a first bellows assembly; a plurality of second lift pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber component, wherein each of the second lift pin assemblies includes a second lift pin disposed on a second bellows assembly; an actuator; and a lift assembly coupled to the actuator and configured to raise or lower each of the first lift pin assemblies and the second lift pin assemblies by movement of the actuator.
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24.发明公开公开(公告)号：US20240021417A1
公开(公告)日：2024-01-18
申请号：US18211887
申请日：2023-06-20
发明人： Hyungsik KO
IPC分类号： H01J37/32 , H01L21/687 , H01L21/683
CPC分类号： H01J37/32642 , H01L21/68742 , H01L21/68785 , H01L21/6831
摘要： A substrate processing apparatus includes a focus ring, the focus ring includes a central axis that extends in a first direction, a top surface having a first inner diameter, a bottom surface having a second inner diameter that is smaller than the first inner diameter, and an inner lateral surface between the top surface and the bottom surface, the inner lateral surface including a first inner lateral surface and a second inner lateral surface, where the second inner lateral surface extends downward from the first inner lateral surface and a first angle between the first inner lateral surface and a line corresponding to the first direction is different from a second angle between the second inner lateral surface and the line corresponding to the first direction.
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公开(公告)号：US11869752B2
公开(公告)日：2024-01-09
申请号：US17111679
申请日：2020-12-04
发明人： Kippei Sugita , Kenji Nagai
IPC分类号： H01J37/32 , H01J37/22 , H01J37/244
CPC分类号： H01J37/32642 , H01J37/226 , H01J37/244 , H01J2237/2446
摘要： A transfer system configured to transfer a focus ring includes a processing system and a position detection system. The processing system includes a processing apparatus including a chamber main body and a placing table having a substrate placing region and a focus ring placing region; and a transfer device configured to transfer the focus ring. The position detection system includes a light source; multiple optical elements configured to output light and receive reflected light; a driving unit configured to move each optical element to allow each optical element to scan a scanning range; and a controller configured to calculate, based on the reflected light in the scanning range, a positional relationship between the placing table and the focus ring for each optical element. The transfer device is configured to adjust a transfer position of the focus ring onto the focus ring placing region based on the calculated positional relationship.
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公开(公告)号：US20230360892A1
公开(公告)日：2023-11-09
申请号：US18356915
申请日：2023-07-21
发明人： James ROGERS , Linying CUI , Rajinder DHINDSA
IPC分类号： H01J37/32 , H01L21/67 , H01L21/683 , H01L21/687 , H01L21/3065
CPC分类号： H01J37/32642 , H01L21/67069 , H01L21/6833 , H01L21/68721 , H01L21/3065 , H01J37/32724 , H01L21/67103 , H01J2237/2001
摘要： Embodiments described herein provide methods and apparatus used to control a processing result profile proximate to a circumferential edge of a substrate during the plasma-assisted processing thereof. In one embodiment, a substrate support assembly features a first base plate and a second base plate circumscribing the first base plate. The first and second base plates each have one or more respective first and second cooling disposed therein. The substrate support assembly further features a substrate support disposed on and thermally coupled to the first base plate, and a biasing ring disposed on and thermally coupled to the second base plate. Here, the substrate support and the biasing ring are each formed of a dielectric material. The substrate support assembly further includes an edge ring biasing electrode embedded in the dielectric material of the biasing ring and an edge ring disposed on the biasing ring.
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公开(公告)号：US20230317439A1
公开(公告)日：2023-10-05
申请号：US18203864
申请日：2023-05-31
发明人： Meehyun LIM , Sungyeol KIM , Taekjin KIM , Minsung KIM , Hosun YOO
CPC分类号： H01J37/32935 , G02F1/035 , H01J37/32091 , H01J37/321 , H01J37/32642 , H01J2237/334
摘要： An apparatus for monitoring a plasma process may include an electro-optical (EO) sensor module and an optical guide, the EO sensor module may be arranged in a plasma chamber configured to perform a semiconductor process for processing a substrate using plasma, the EO sensor module may include a non-conductive material having an optical refractive index changed by an electric field formed in the plasma chamber, the optical guide may form at least one internal path of a light, which may have an optical characteristic changed by the changed optical refractive index, between the EO sensor module and the plasma chamber.
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公开(公告)号：US20230296512A1
公开(公告)日：2023-09-21
申请号：US18201698
申请日：2023-05-24
IPC分类号： G01N21/64 , H01J37/32 , H01L21/683 , H01L21/687
CPC分类号： G01N21/64 , H01J37/32642 , H01J37/32798 , H01J37/32917 , H01L21/6833 , H01L21/68735 , G01N2201/06113 , H01J2237/334
摘要： The present invention generally relates method and apparatus for detecting erosion to a ring assembly used in an etching or other plasma processing chamber. In one embodiment, a method begins by obtaining a metric indicative of wear on a ring assembly disposed on a substrate support in a plasma processing chamber prior to processing with plasma in the plasma processing chamber. The metric for the ring assembly is monitored with a sensor. A determination is made if the metric exceeds a threshold and generating a signal in response to the metric exceeding the threshold.
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公开(公告)号：US20230290620A1
公开(公告)日：2023-09-14
申请号：US17999830
申请日：2021-05-27
发明人： Masaki HIRAYAMA , Tetsuro ITAGAKI
IPC分类号： H01J37/32
CPC分类号： H01J37/32697 , H01J37/32715 , H01J37/32642 , H01J37/32174
摘要： Provided is an electrostatic chuck device including: an electrostatic chuck plate which has a dielectric substrate having a placement surface on which a wafer is placed and electrodes positioned in the dielectric substrate; a focus ring which is installed on an outer peripheral portion of the electrostatic chuck plate and surrounding the placement surface; and a power connection portion which connects the electrode and a power supply. The electrostatic chuck plate has a first electrode positioned in a region overlapping the placement surface in plan view and a second electrode positioned in a region overlapping the focus ring in plan view. The power connection portion includes a power wire electrically connecting the first electrode and the second electrode via a current regulator.
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公开(公告)号：US20230282460A1
公开(公告)日：2023-09-07
申请号：US18196438
申请日：2023-05-12
发明人： Shigeru ISHIZAWA
CPC分类号： H01J37/32807 , B08B7/0035 , H01J37/32642 , H01J37/32862 , H01J37/32899
摘要： A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.
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