Abstract:
A ceramic capacitor assembly has a ceramic capacitor and a cushion. The ceramic capacitor has a body, two terminals formed respectively on the body and two legs connecting to and protruding respectively from the terminals. The cushion is a resilient material and has an upper surface corresponding to and mounted adjacent to the ceramic capacitor, a lower surface, an outer edge and two fastening detents. The detents correspond to the legs and are provided for legs to fasten to the cushion. The ceramic capacitor and the cushion are easily assembled and reduce cost and complexity of manufacture.
Abstract:
A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board.
Abstract:
A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).
Abstract:
An electrical connection terminal for a connection hole includes: a base-side end portion (310) having a predetermined width; a retaining portion (313) having an increasing width wider than the predetermined width of the base-side end portion (310), the retaining portion (313) being formed integrally with the base-side end portion (310); and an insertion taper portion (315) having a taper width narrower than the increasing width of the retaining portion (313) to reach a leading end portion, the insertion taper portion (315) being formed integrally with the retaining portion (313); in which the insertion taper portion (315) is composed of a plurality of taper portions taper angles of which change so as to increase along an insertion direction.
Abstract:
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
Abstract:
An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.
Abstract:
A staggered light unit has a top-bottom electrode lead. The light unit is insertable into a substrate having a metal/insulation/metal sandwich structure.
Abstract:
A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.
Abstract:
In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
Abstract:
A method and product produced includes a power layer board that is manufactured by providing a printed circuit board having an input configured to receive an input power and an output configured to deliver an output power conditioned to power a motor. The method also includes soldering a first component to the printed circuit board. Thereafter, a request to manufacture the power layer board is received that includes parameters of the input power and/or the output power. Therefrom, characteristics of a second component including a resistor, a capacitor, and/or an inductor is identified based on the parameters of the input power and/or the output power. Accordingly, the identified second component is mounted to the printed circuit board through a solder-less cold-weld connector to complete the power layer board.